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Miedema's plot is used to select the Cu/metal barrier for Cu metallization.The Cu/metal barrier system selected should have positive heat of formation (Hf) so that there is no intermixing between

Miedema's plot is used to select the Cu/metal barrier for Cu metallization.The Cu/metal barrier system selected should have positive heat of formation (Hf) so that there is no intermixing between the two layers. In this case, Ru is chosen as a potential candidate, and then the barrier properties of sputtered Cu/Ru thin films on thermally grown SiO2 substrates are investigated by Rutherford backscattering spectrometry (RBS), X-ray diffractometry (XRD), and electrical resistivity measurement.

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    Date Created
    • 2010
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  • Text
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    • Partial requirement for: M.S., Arizona State University, 2010
      Note type
      thesis
    • Includes bibliographical references
      Note type
      bibliography
    • Field of study: Materials science and engineering

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    Srilakshmi Hosadurga Venkatesh

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