Matching Items (15)
Description
A series of Molybdenum-Copper bilayers were studied for use in 120mK superconducting transition edge sensors for spectrometer applications. The Transition temperature (TC) was tuned to the desired temperature using the proximity effect, by adjusting the thickness of a normal copper layer in direct contact with the superconducting molybdenum layer in a proximitized bilayer structure. The bilayers have a fixed normal metal thickness dCu=1250 Å, on top of a variable superconductor thickness 650 Å ≤ dMo ≤ 1000 Å. Material characterization techniques including X-ray Diffraction (XRD), Rutherford Backscattering Spectroscopy (RBS), Atomic Force Microscopy (AFM), and 4-point electrical characterization are used to characterize the films. Film TC are compared with the results of the Usadel proximity theory. The results of RBS analysis demonstrated that some Argon-contamination is observed at the Mo film-substrate interface, which correlates with bilayer surface roughness (as observed with AFM), reduced crystalline quality (via XRD Rocking Curve), and a deviation from the theoretical expected TC for a bilayer. The Argon contamination is presumably the cause of interface roughness, reducing the interface transmission coefficient in the Usadel model, and producing the discrepancy from the expected TC.
ContributorsKopas, Cameron (Author) / Newman, Nathan (Thesis advisor) / Singh, Rakesh (Committee member) / Chamberlin, Ralph (Committee member) / Arizona State University (Publisher)
Created2014
Description
Nanotechnology is a scientific field that has recently expanded due to its applications in pharmaceutical and personal care products, industry and agriculture. As result of this unprecedented growth, nanoparticles (NPs) have become a significant environmental contaminant, with potential to impact various forms of life in environment. Metal nanoparticles (mNPs) exhibit unique properties such as increased chemical reactivity due to high specific surface area to volume ratios. Bacteria play a major role in many natural and engineered biogeochemical reactions in wastewater treatment plants and other environmental compartments. I have evaluated the laboratory isolates of E. coli, Bacillus, Alcaligenes, Pseudomonas; wastewater isolates of E. coli and Bacillus; and pathogenic isolate of E. coli for their response to 50 & 100 nm sized Cu nanoparticles (CuNPs). Bactericidal tests, scanning electron microscopy (SEM) analyses, and probable toxicity pathways assays were performed. The results indicate that under continuous mixing conditions, CuNPs are effective in inactivation of the selected bacterial isolates. In general, exposure to CuNPs resulted in 4 to >6 log reduction in bacterial population within 2 hours. Based on the GR, LDH and MTT assays, bacterial cells showed different toxicity elicitation pathways after exposure to CuNPs. Therefore, it can be concluded that the laboratory isolates are good candidates for predicting the behavior of environmental isolates exposed to CuNPs. Also, high inactivation values recorded in this study suggest that the presence of CuNPs in different environmental compartments may have an impact on pollutants attenuation and wastewater biological treatment processes. These results point towards the need for an in depth investigation of the impact of NPs on the biological processes; and long-term effect of high load of NPs on the stability of aquatic and terrestrial ecologies.
ContributorsAlboloushi, Ali (Author) / Abbaszadegan, Morteza (Thesis advisor) / Alum, Absar (Committee member) / Fox, Peter (Committee member) / Olson, Larry (Committee member) / Arizona State University (Publisher)
Created2012
Description
This work demonstrates a capable reverse pulse deposition methodology to influence gap fill behavior inside microvia along with a uniform deposit in the fine line patterned regions for substrate packaging applications. Interconnect circuitry in IC substrate packages comprises of stacked microvia that varies in depth from 20µm to 100µm with an aspect ratio of 0.5 to 1.5 and fine line patterns defined by photolithography. Photolithography defined pattern regions incorporate a wide variety of feature sizes including large circular pad structures with diameter of 20µm - 200µm, fine traces with varying widths of 3µm - 30µm and additional planar regions to define a IC substrate package. Electrodeposition of copper is performed to establish the desired circuit. Electrodeposition of copper in IC substrate applications holds certain unique challenges in that they require a low cost manufacturing process that enables a void-free gap fill inside the microvia along with uniform deposition of copper on exposed patterned regions. Deposition time scales to establish the desired metal thickness for such packages could range from several minutes to few hours. This work showcases a reverse pulse electrodeposition methodology that achieves void-free gap fill inside the microvia and uniform plating in FLS (Fine Lines and Spaces) regions with significantly higher deposition rates than traditional approaches. In order to achieve this capability, systematic experimental and simulation studies were performed. A strong correlation of independent parameters that govern the electrodeposition process such as bath temperature, reverse pulse plating parameters and the ratio of electrolyte concentrations is shown to the deposition kinetics and deposition uniformity in fine patterned regions and gap fill rate inside the microvia. Additionally, insight into the physics of via fill process is presented with secondary and tertiary current simulation efforts. Such efforts lead to show “smart” control of deposition rate at the top and bottom of via to avoid void formation. Finally, a parametric effect on grain size and the ensuing copper metallurgical characteristics of bulk copper is also shown to enable high reliability substrate packages for the IC packaging industry.
ContributorsGanesan, Kousik (Author) / Tasooji, Amaneh (Thesis advisor) / Manepalli, Rahul (Committee member) / Alford, Terry (Committee member) / Chan, Candace (Committee member) / Arizona State University (Publisher)
Created2018
Description
In Arizona, people flock the streets of Tombstone in droves, chatting in period costume while gunshots ring down the street. Others in Bisbee walk in the Queen Mine, listening to the tour guide discuss how the miners extracted ore. Still others drive up the precarious road to Jerome, passing through the famed Grand Hotel. As former Arizona mining towns, Tombstone, Jerome and Bisbee have a shared identity as former mining boomtowns, all of which experienced subsequent economic and population decline. Left with the need to reinvent themselves in order to survive, the past takes on a different role in each city. In Jerome, visitors seem content to "kill a day" against the backdrop of the historic town. In Bisbee, time seems stuck in the 1970s, the focus having shifted from the mining to the "hippies" who are considered to have resuscitated the town from near-extinction. Tombstone seem to inspire devotion, rooted in the influence of the 1993 film titled after the town. By memorializing portions of their past, these three towns have carved out new lives for themselves in the twenty-first century. As visitors are informed by the narrative of the "Old West," as shaped by the Western movie and television genre, they in turn impact how the towns present themselves in order to attract tourists. In all these sites, the past is present and like a kaleidoscope, continually recreated into new formations. While the designation of Jerome, Bisbee and Tombstone as "ghost towns" is disputed by individuals in each site, these stories of visitors and residents reveal the intricate ways in which these towns have acquired new life.
ContributorsLemme, Nicole Lee (Author) / de la Garza, Amira (Thesis director) / Paulesc, Marie Louise (Committee member) / Department of English (Contributor) / School of International Letters and Cultures (Contributor) / Hugh Downs School of Human Communication (Contributor) / Barrett, The Honors College (Contributor)
Created2016-05
Description
Current solar cells use a silver-printed front grid for electron conduction. Unfortunately, silver is expensive, leading to research into alternative materials. Copper is the most viable but poses grain growth problems and stress problems silver does not. This paper has characterised the effects of proprietary additives, thickness of the copper film layer, current density, and grain growth on stress. Per Stoney's equation, increased thickness leads to decreased thickness. However, if the current density is too high, the plated copper will become porous. Grain growth, quantified by the ratio of the intensity of the (1 1 1) plane and the (2 0 0) plane, increases over time, thus increasing the ratio which further equations to increased stress. Future work would be gathering more data to further investigate the relationship between additives and stress, current densities and stress, and grain growth over time and stress.
ContributorsSimonet, Danny (Co-author) / Chang, Celine (Co-author) / Bowden, Stuart (Thesis director) / Karas, Joseph (Committee member) / Division of Teacher Preparation (Contributor) / Mechanical and Aerospace Engineering Program (Contributor) / Barrett, The Honors College (Contributor)
Created2018-05
Description
Miedema's plot is used to select the Cu/metal barrier for Cu metallization.The Cu/metal barrier system selected should have positive heat of formation (Hf) so that there is no intermixing between the two layers. In this case, Ru is chosen as a potential candidate, and then the barrier properties of sputtered Cu/Ru thin films on thermally grown SiO2 substrates are investigated by Rutherford backscattering spectrometry (RBS), X-ray diffractometry (XRD), and electrical resistivity measurement. The Cu/Ru/SiO2 samples are analyzed prior to and after vacuum annealing at various temperatures of 400, 500, and 600 oC and at different interval of times of 0.5, 1 and 2 hrs for each temperature. Backscattering analysis indicate that both the copper and ruthenium thin films are thermally stable at high temperature of 600 oC, without any interdiffusion and chemical reaction between Cu and Ru thin films. No new phase formation is observed in any of the Cu/Ru/SiO2 samples. The XRD data indicate no new phase formation in any of the annealed Cu/Ru/SiO2 samples and confirmed excellent thermal stability of Cu on Ru layer. The electrical resistivity measurement indicated that the electrical resistivity value of the copper thin films annealed at 400, 500, and 600 oC is essentially constant and the copper films are thermally stable on Ru, no reaction occurs between copper films and Ru the layer. Cu/Ru/SiO2 multilayered thin film samples have been shown to possess good mechanical strength and adhesion between the Cu and Ru layers compared to the Cu/SiO2 thin film samples. The strength evaluation is carried out under static loading conditions such as nanoindentation testing. In this study, evaluation and comparison is donebased on the dynamic deformation behavior of Cu/Ru/SiO2 and Cu/SiO2 samples under scratch loading condition as a measure of tribological properties. Finally, the deformation behavior under static and dynamic loading conditions is understood using the scanning electron microscope (SEM) and the focused ionbeam imaging microscope (FIB) for topographical and cross-sectional imaging respectively.
ContributorsVenkatesh, Srilakshmi Hosadurga (Author) / Alford, Terry L. (Thesis advisor) / Krause, Stephen (Committee member) / Theodore, David (Committee member) / Arizona State University (Publisher)
Created2010
Description
A novel small metal-binding protein (SmbP), with only 93 residues and no similarity to other known proteins, has been isolated from the periplasm of Nitrosomonas europaea. It is characterized by its high percentage (17%) of histidines, a motif of ten repeats of seven residues, a four α-helix bundle structure, and a high binding affinity to about six equivalents of Cu2+. The goal of this study is to investigate the Cu2+ binding sites in SmbP and to understand how Cu2+ stabilizes the protein. Preliminary folding experiments indicated that Cu2+ greatly stabilizes SmbP. In this study, protein folding data from circular dichroism (CD) spectroscopy was used to elucidate the role of Cu2+ in stabilizing SmbP structure against unfolding induced by decreased pH, increased temperature, and chemical denaturants. The significant stabilization effects of Cu2+ were demonstrated by the observation that Cu2+-SmbP remained fully folded under extreme environmental conditions, such as acidic pH, 96 °C, and 8 M urea. Also, it was shown that Cu2+ is able to induce the refolding of unfolded SmbP in acidic solutions. These findings imply that the coordination of Cu2+ to histidine residues is responsible for the stabilization effects. The crystal structure of SmbP without Cu2+ has been determined. However, attempts to crystallize Cu2+-SmbP have not been successful. In this study, multidimensional NMR experiments were conducted in order to gain additional information regarding the Cu2+-SmbP structure, in particular its metal binding sites. Unambiguous resonance assignments were successfully made. Cα secondary chemical shifts confirmed that SmbP has a four α-helical structure. A Cu2+-protein titration experiment monitored by NMR indicated a top-to-bottom, sequential metal binding pattern for SmbP. In addition, several bioinformatics tools were used to complement the experimental approach and identity of the ligands in Cu2+-binding sites in SmbP is proposed.
ContributorsYan, Qin (Author) / Francisco, Wilson A (Thesis advisor) / Allen, James (Committee member) / Ghirlanda, Giovanna (Committee member) / Arizona State University (Publisher)
Created2010
Description
In this investigation, copper slag was used as a coarse aggregate in four different mixes of concrete, consisting of 0%, 25%, 50%, and 100% copper slag by volume. Locally available Salt river aggregate was used as a control, and mixes were tested for density, strength, thermal conductivity, specific heat capacity, and thermal diffusivity. Density was shown to increase with increasing copper slag content, increasing an average of 2298 kg/m^3, 2522 kg/m^3, and 2652 kg/m^3 in the 25%, 50%, and 100% mixes. This represents a 15% increase in density from 0% to 100%. Compressive strength testing indicated that the presence of copper slag in concrete provides no definitive strength benefit over Salt River aggregate. This result was expected, as concrete's strength is primarily derived from the cement matrix and not the aggregate. Thermal conductivity showed a decreasing trend with increasing copper slag content. Th control mix had an average conductivity of 0.660 W/m*K, and the 25%, 50%, and 100% mixes had conductivities of 0.649 W/m*K, 0.647 W/m*K, and 0.519 W/m*K, respectively. This represents 21% drop in thermal conductivity over the control. This result was also expected, as materials formed at higher temperatures, like copper slag, tend to have lower thermal conductivities. Specific heat capacity testing yielded results that were statistically indeterminate, though unlike strength testing this arose from inaccurate assumptions made during testing. This also prevented accurate thermal diffusivity results, as diffusivity is a function of density, thermal conductivity, and specific heat capacity. However, given the trends of the first two parameters, it is plausible to say that diffusivity in copper slag concrete would be lower than that of the control ix. All of these results were plugged into ASU's Pavement Temperature Model to see what effect they had in mitigating the UHI effect.
ContributorsLaughlin, Colin (Author) / Kaloush, Kamil (Thesis director) / Phelan, Patrick (Committee member) / Witczak, Kenneth (Committee member) / Barrett, The Honors College (Contributor)
Created2012-05
Description
ABSTRACT
Programmable metallization cell (PMC) technology uses the mechanism of metal ion transport in solid electrolytes and electrochemical redox reactions to form metallic electrodeposits. When a positive bias is applied from anode to cathode, atoms at the anode are oxidized to ions and dissolve in the solid electrolyte. They travel to the cathode under the influence of an electric field, where they are reduced to form electrodeposits. These electrodeposits are filamentary in nature and grow in different patterns. Devices that make use of the principle of filament growth have applications in memory, RF switching, and hardware security.
The solid electrolyte under investigation is tungsten trioxide with copper deposited on top. For a standard PMC, these layers are heated in a convection oven to dope the electrolyte. Once the heating process is completed, electrodes are deposited on top of the electrolyte and biased to grow the filaments. What is investigated is the rate of dendritic growth to applied field on the PMC and the composition of the electrolyte. Also investigated are modified three-terminal PMC capacitance change devices. These devices have a buried sensing electrode that senses the increasing capacitance as the filaments grow and increase the upper electrode area.
The rate of dendritic growth in the tungsten trioxide and copper electrolyte of different chemistries and applied field to the PMC devices is the important parameter. The rate of dendritic growth is related to the change of capacitance. Through sensing the change in capacitance over time the modified PMC device will function as an odometer device that can be attached to chips. The attachment of these devices to chips, help in preventing illegal recycling of old chips by marking those chips as old. This will prevent would-be attackers from inserting modified chips in systems that will enable them to by-pass any software security precautions.
Programmable metallization cell (PMC) technology uses the mechanism of metal ion transport in solid electrolytes and electrochemical redox reactions to form metallic electrodeposits. When a positive bias is applied from anode to cathode, atoms at the anode are oxidized to ions and dissolve in the solid electrolyte. They travel to the cathode under the influence of an electric field, where they are reduced to form electrodeposits. These electrodeposits are filamentary in nature and grow in different patterns. Devices that make use of the principle of filament growth have applications in memory, RF switching, and hardware security.
The solid electrolyte under investigation is tungsten trioxide with copper deposited on top. For a standard PMC, these layers are heated in a convection oven to dope the electrolyte. Once the heating process is completed, electrodes are deposited on top of the electrolyte and biased to grow the filaments. What is investigated is the rate of dendritic growth to applied field on the PMC and the composition of the electrolyte. Also investigated are modified three-terminal PMC capacitance change devices. These devices have a buried sensing electrode that senses the increasing capacitance as the filaments grow and increase the upper electrode area.
The rate of dendritic growth in the tungsten trioxide and copper electrolyte of different chemistries and applied field to the PMC devices is the important parameter. The rate of dendritic growth is related to the change of capacitance. Through sensing the change in capacitance over time the modified PMC device will function as an odometer device that can be attached to chips. The attachment of these devices to chips, help in preventing illegal recycling of old chips by marking those chips as old. This will prevent would-be attackers from inserting modified chips in systems that will enable them to by-pass any software security precautions.
ContributorsKrishnan, Anand (Author) / Kozicki, Michael N (Thesis advisor) / Barnaby, Hugh J (Committee member) / Gonzalez-Velo, Yago (Committee member) / Arizona State University (Publisher)
Created2019
Description
This work correlates microscopic material changes to short- and long-term performance in modern, Cu-doped, CdTe-based solar cells. Past research on short- and long-term performance emphasized the device-scale impact of Cu, but neglected the microscopic impact of the other chemical species in the system (e.g., Se, Cl, Cu), their distributions, their local atomic environments, or their interactions/reactions. Additionally, technological limitations precluded nanoscale measurements of the Cu distributions in the cell, and microscale measurements of the material properties (i.e. composition, microstructure, charge transport) as the cell operates. This research aims to answer (1) what is the spatial distribution of Cu in the cell, (2) how does its distribution and local environment correlate with cell performance, and (3) how do local material properties change as the cell operates? This work employs a multi-scale, multi-modal, correlative-measurement approach to elucidate microscopic mechanisms. Several analytical techniques are used – including and especially correlative synchrotron X-ray microscopy – and a unique state-of-the-art instrument was developed to access the dynamics of microscopic mechanisms as they proceed. The work shows Cu segregates around CdTe grain boundaries, and Cu-related acceptor penetration into the CdTe layer is crucial for well-performing cells. After long-term operation, the work presents strong evidence of Se migration into the CdTe layer. This redistribution correlates with microstructural changes in the CdTe layer and limited charge transport around the metal-CdTe interface. Finally, the work correlates changes in microstructure, Cu atomic environment, and charge collection as a cell operates. The results suggest that, as the cell ages, a change to Cu local environment limits charge transport through the metal-CdTe interface, and this change could be influenced by Se migration into the CdTe layer of the cell.
ContributorsWalker, Trumann (Author) / Bertoni, Mariana I (Thesis advisor) / Holman, Zachary (Committee member) / Chan, Candace (Committee member) / Colegrove, Eric (Committee member) / Arizona State University (Publisher)
Created2022