Description
With the increasing focus on developing environmentally benign electronic packages, lead-free solder alloys have received a great deal of attention. Mishandling of packages, during manufacture, assembly, or by the user may cause failure of solder joint. A fundamental understanding of the behavior of lead-free solders under mechanical shock conditions is lacking.
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Contributors
- Fei, Huiyang (Author)
- Jiang, Hanqing (Thesis advisor)
- Chawla, Nikhilesh (Thesis advisor)
- Tasooji, Amaneh (Committee member)
- Mobasher, Barzin (Committee member)
- Rajan, Subramaniam D. (Committee member)
- Arizona State University (Publisher)
Date Created
The date the item was original created (prior to any relationship with the ASU Digital Repositories.)
2011
Subjects
- Mechanical Engineering
- Materials Science
- Electrical Engineering
- Interfacial law
- Intermetallic
- Lead-free solder
- Shock (Mechanics)
- Microstructural fracture
- Random defects
- Shock (Mechanics)
- Solder and soldering--Environmental aspects.
- Solder and soldering
- Electronic packaging--Environmental aspects.
- Electronic packaging
- Microstructure--Materials.
- Microstructure
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Note
- Partial requirement for: Ph.D., Arizona State University, 2011Note typethesis
- Includes bibliographical references (p. 129-143)Note typebibliography
- Field of study: Mechanical engineering
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Statement of Responsibility
Huiyang Fei