Description
Thermal management of electronics is critical to meet the increasing demand for high power and performance. Thermal interface materials (TIMs) play a key role in dissipating heat away from the microelectronic chip and hence are a crucial component in electronics cooling.
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Contributors
- Uppal, Aastha (Author)
- Rykaczewski, Konrad (Thesis advisor)
- Wang, Robert (Thesis advisor)
- Kwon, Beomjin (Committee member)
- Choksi, Gaurang (Committee member)
- Phelan, Patrick (Committee member)
- Arizona State University (Publisher)
Date Created
The date the item was original created (prior to any relationship with the ASU Digital Repositories.)
2022
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Note
- Partial requirement for: Ph.D., Arizona State University, 2022
- Field of study: Mechanical Engineering