Description
Thermal management of electronics is critical to meet the increasing demand for high power and performance. Thermal interface materials (TIMs) play a key role in dissipating heat away from the microelectronic chip and hence are a crucial component in electronics cooling.
Copyright Statement
Download count: 0
Details
Contributors
- Uppal, Aastha (Author)
- Rykaczewski, Konrad (Thesis advisor)
- Wang, Robert (Thesis advisor)
- Kwon, Beomjin (Committee member)
- Choksi, Gaurang (Committee member)
- Phelan, Patrick (Committee member)
- Arizona State University (Publisher)
Date Created
The date the item was original created (prior to any relationship with the ASU Digital Repositories.)
2022
Subjects
Resource Type
Collections this item is in
Note
- Partial requirement for: Ph.D., Arizona State University, 2022
- Field of study: Mechanical Engineering