Description

Soft polymer composites with improved thermal conductivity are needed for the thermal management of electronics. Interfacial thermal boundary resistance, however, prevents the efficient use of many high thermal conductivity fill materials.

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Date Created
2019
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  • Text
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    Note
    • Partial requirement for: Ph.D., Arizona State University, 2019
      Note type
      thesis
    • Includes bibliographical references (pages 56-66)
      Note type
      bibliography
    • Field of study: Mechanical engineering

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    by Matthew Ralphs

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