Description
Soft polymer composites with improved thermal conductivity are needed for the thermal management of electronics. Interfacial thermal boundary resistance, however, prevents the efficient use of many high thermal conductivity fill materials.
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Contributors
- Ralphs, Matthew (Author)
- Rykaczewski, Konrad (Thesis advisor)
- Wang, Robert Y (Thesis advisor)
- Phelan, Patrick (Committee member)
- Wang, Liping (Committee member)
- Devasenathipathy, Shankar (Committee member)
- Arizona State University (Publisher)
Date Created
The date the item was original created (prior to any relationship with the ASU Digital Repositories.)
2019
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Note
- Partial requirement for: Ph.D., Arizona State University, 2019Note typethesis
- Includes bibliographical references (pages 56-66)Note typebibliography
- Field of study: Mechanical engineering
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by Matthew Ralphs