Description

This thesis presents a meta-analysis of lead-free solder reliability. The qualitative analyses of the failure modes of lead- free solder under different stress tests including drop test, bend test, thermal test and vibration test are discussed.

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    Date Created
    2014
    Resource Type
  • Text
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    Note
    • Partial requirement for: M.S., Arizona State University, 2014
      Note type
      thesis
    • Includes bibliographical references (p. 48-49)
      Note type
      bibliography
    • Field of study: Industrial engineering

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    by Xinyue Xu

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