This thesis presents a meta-analysis of lead-free solder reliability. The qualitative analyses of the failure modes of lead- free solder under different stress tests including drop test, bend test, thermal test and vibration test are discussed.
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- Partial requirement for: M.S., Arizona State University, 2014Note typethesis
- Includes bibliographical references (p. 48-49)Note typebibliography
- Field of study: Industrial engineering