Matching Items (2)

157121-Thumbnail Image.png

Bayesian Inference Frameworks for Fluorescence Microscopy Data Analysis

Description

In this work, I present a Bayesian inference computational framework for the analysis of widefield microscopy data that addresses three challenges: (1) counting and localizing stationary fluorescent molecules; (2) inferring

In this work, I present a Bayesian inference computational framework for the analysis of widefield microscopy data that addresses three challenges: (1) counting and localizing stationary fluorescent molecules; (2) inferring a spatially-dependent effective fluorescence profile that describes the spatially-varying rate at which fluorescent molecules emit subsequently-detected photons (due to different illumination intensities or different local environments); and (3) inferring the camera gain. My general theoretical framework utilizes the Bayesian nonparametric Gaussian and beta-Bernoulli processes with a Markov chain Monte Carlo sampling scheme, which I further specify and implement for Total Internal Reflection Fluorescence (TIRF) microscopy data, benchmarking the method on synthetic data. These three frameworks are self-contained, and can be used concurrently so that the fluorescence profile and emitter locations are both considered unknown and, under some conditions, learned simultaneously. The framework I present is flexible and may be adapted to accommodate the inference of other parameters, such as emission photophysical kinetics and the trajectories of moving molecules. My TIRF-specific implementation may find use in the study of structures on cell membranes, or in studying local sample properties that affect fluorescent molecule photon emission rates.

Contributors

Agent

Created

Date Created
  • 2019

153109-Thumbnail Image.png

Applied meta-analysis of lead-free solder reliability

Description

This thesis presents a meta-analysis of lead-free solder reliability. The qualitative analyses of the failure modes of lead- free solder under different stress tests including drop test, bend test, thermal

This thesis presents a meta-analysis of lead-free solder reliability. The qualitative analyses of the failure modes of lead- free solder under different stress tests including drop test, bend test, thermal test and vibration test are discussed. The main cause of failure of lead- free solder is fatigue crack, and the speed of propagation of the initial crack could differ from different test conditions and different solder materials. A quantitative analysis about the fatigue behavior of SAC lead-free solder under thermal preconditioning process is conducted. This thesis presents a method of making prediction of failure life of solder alloy by building a Weibull regression model. The failure life of solder on circuit board is assumed Weibull distributed. Different materials and test conditions could affect the distribution by changing the shape and scale parameters of Weibull distribution. The method is to model the regression of parameters with different test conditions as predictors based on Bayesian inference concepts. In the process of building regression models, prior distributions are generated according to the previous studies, and Markov Chain Monte Carlo (MCMC) is used under WinBUGS environment.

Contributors

Agent

Created

Date Created
  • 2014