Description
In 2022, integrated circuit interconnects will approach 10 nm and the diffusion barrier layers needed to ensure long lasting devices will be at 1 nm. This dimension means the interconnect will be dominated by the interface and it has been shown the interface is currently eroding device performance.
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Contributors
- Grumski, Michael (Author)
- Adams, James (Thesis advisor)
- Krause, Stephen (Committee member)
- Alford, Terry (Committee member)
- Arizona State University (Publisher)
Date Created
The date the item was original created (prior to any relationship with the ASU Digital Repositories.)
2012
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Note
- Vita
- Partial requirement for: Ph.D., Arizona State University, 2012Note typethesis
- Includes bibliographical references (p. 82-87)Note typebibliography
- Field of study: Materials science and engineering
Citation and reuse
Statement of Responsibility
by Michael Grumski