Description

In 2022, integrated circuit interconnects will approach 10 nm and the diffusion barrier layers needed to ensure long lasting devices will be at 1 nm. This dimension means the interconnect will be dominated by the interface and it has been shown the interface is currently eroding device performance.

Reuse Permissions
  • Downloads
    pdf (5.2 MB)

    Download count: 0

    Details

    Contributors
    Date Created
    2012
    Resource Type
  • Text
  • Collections this item is in
    Note
    • Vita
    • Partial requirement for: Ph.D., Arizona State University, 2012
      Note type
      thesis
    • Includes bibliographical references (p. 82-87)
      Note type
      bibliography
    • Field of study: Materials science and engineering

    Citation and reuse

    Statement of Responsibility

    by Michael Grumski

    Machine-readable links