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Three-dimensional (3D) inductors with square, hexagonal and octagonal geometries have been designed and simulated in ANSYS HFSS. The inductors have been designed on Silicon substrate with through-hole via with different

Three-dimensional (3D) inductors with square, hexagonal and octagonal geometries have been designed and simulated in ANSYS HFSS. The inductors have been designed on Silicon substrate with through-hole via with different width, spacing and thickness. Spice modeling has been done in Agilent ADS and comparison has been made with results of custom excel based calculator and HFSS simulation results. Single ended quality factor was measured as 12.97 and differential ended quality factor was measured as 15.96 at a maximum operational frequency of 3.65GHz.

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    Date Created
    • 2012
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  • Text
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    Note
    • Partial requirement for: M.S., Arizona State University, 2012
      Note type
      thesis
    • Includes bibliographical references (p. 56-57)
      Note type
      bibliography
    • Field of study: Electrical engineering

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    by Hemanshu Abbey

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