Full metadata
Title
Effect of grain orientation on electromigration in Sn-0.7Cu solder joints
Description
Microelectronic industry is continuously moving in a trend requiring smaller and smaller devices and reduced form factors with time, resulting in new challenges. Reduction in device and interconnect solder bump sizes has led to increased current density in these small solders. Higher level of electromigration occurring due to increased current density is of great concern affecting the reliability of the entire microelectronics systems. This paper reviews electromigration in Pb- free solders, focusing specifically on Sn0.7wt.% Cu solder joints. Effect of texture, grain orientation, and grain-boundary misorientation angle on electromigration and intermetallic compound (IMC) formation is studied through EBSD analysis performed on actual C4 bumps.
Date Created
2013
Contributors
- Lara, Leticia (Author)
- Tasooji, Amaneh (Thesis advisor)
- Lee, Kyuoh (Committee member)
- Krause, Stephen (Committee member)
- Arizona State University (Publisher)
Topical Subject
Resource Type
Extent
xi, 60 p. : ill. (some col.)
Language
Copyright Statement
In Copyright
Primary Member of
Peer-reviewed
No
Open Access
No
Handle
https://hdl.handle.net/2286/R.I.20827
Statement of Responsibility
by Leticia Lara
Description Source
Viewed on Mar. 11, 2014
Level of coding
full
Note
Partial requirement for: M.S., Arizona State University, 2013
Note type
thesis
Includes bibliographical references (p. 51-53)
Note type
bibliography
Field of study: Engineering
System Created
- 2014-01-31 11:31:08
System Modified
- 2021-08-30 01:37:42
- 2 years 8 months ago
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