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Microelectronic industry is continuously moving in a trend requiring smaller and smaller devices and reduced form factors with time, resulting in new challenges. Reduction in device and interconnect solder bum

Microelectronic industry is continuously moving in a trend requiring smaller and smaller devices and reduced form factors with time, resulting in new challenges. Reduction in device and interconnect solder bump sizes has led to increased current density in these small solders. Higher level of electromigration occurring due to increased current density is of great concern affecting the reliability of the entire microelectronics systems. This paper reviews electromigration in Pb- free solders, focusing specifically on Sn0.7wt.% Cu solder joints.

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    Date Created
    • 2013
    Resource Type
  • Text
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    Note
    • Partial requirement for: M.S., Arizona State University, 2013
      Note type
      thesis
    • Includes bibliographical references (p. 51-53)
      Note type
      bibliography
    • Field of study: Engineering

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    by Leticia Lara

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