Description

Ball Grid Array (BGA) using lead-free or lead-rich solder materials are widely used as Second Level Interconnects (SLI) in mounting packaged components to the printed circuit board (PCB). The reliability of these solder joints is of significant importance to the performance of microelectronics components and systems.

Reuse Permissions
  • Downloads
    pdf (6.3 MB)

    Download count: 0

    Details

    Contributors
    Date Created
    2013
    Resource Type
  • Text
  • Collections this item is in
    Note
    • Partial requirement for: Ph.D., Arizona State University, 2013
      Note type
      thesis
    • Includes bibliographical references (p. 159-168)
      Note type
      bibliography
    • Field of study: Materials science and engineering

    Citation and reuse

    Statement of Responsibility

    by Ali Fallah-Adl

    Machine-readable links