Description
Ball Grid Array (BGA) using lead-free or lead-rich solder materials are widely used as Second Level Interconnects (SLI) in mounting packaged components to the printed circuit board (PCB). The reliability of these solder joints is of significant importance to the performance of microelectronics components and systems.
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Contributors
- Fallah-Adl, Ali (Author)
- Tasooji, Amaneh (Thesis advisor)
- Krause, Stephen (Committee member)
- Alford, Terry (Committee member)
- Jiang, Hanqing (Committee member)
- Mahajan, Ravi (Committee member)
- Arizona State University (Publisher)
Date Created
The date the item was original created (prior to any relationship with the ASU Digital Repositories.)
2013
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Note
- Partial requirement for: Ph.D., Arizona State University, 2013Note typethesis
- Includes bibliographical references (p. 159-168)Note typebibliography
- Field of study: Materials science and engineering
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by Ali Fallah-Adl