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Electromigration (EM) has been a serious reliability concern in microelectronics packaging for close to half a century now. Whenever the challenges of EM are overcome newer complications arise such as

Electromigration (EM) has been a serious reliability concern in microelectronics packaging for close to half a century now. Whenever the challenges of EM are overcome newer complications arise such as the demand for better performance due to increased miniaturization of semiconductor devices or the problems faced due to undesirable properties of lead-free solders. The motivation for the work is that there exists no fully computational modeling study on EM damage in lead-free solders (and also in lead-based solders).

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    Date Created
    • 2016
    Resource Type
  • Text
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    Note
    • Partial requirement for: M.S., Arizona State University, 2016
      Note type
      thesis
    • Includes bibliographical references (pages 40-41)
      Note type
      bibliography
    • Field of study: Materials Science and Engineering

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    by Deepak Karunakaran

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