Pb-free solders are used as interconnects in various levels of micro-electronic packaging. Reliability of these interconnects is very critical for the performance of the package. One of the main factors affecting the reliability of solder joints is the presence of porosity which is introduced during processing of the joints. In this thesis, the effect of such porosity on the deformation behavior and eventual failure of the joints is studied using Finite Element (FE) modeling technique.
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- Partial requirement for: M.S., Arizona State University, 2011Note typethesis
- Includes bibliographical references (p. 59-62)Note typebibliography
- Field of study: Mechanical engineering