Description
The transition to lead-free solder in the electronics industry has benefited the environment in many ways. However, with new materials systems comes new materials issues. During the processing of copper pads, a protective surface treatment is needed to prevent the copper from oxidizing.
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Contributors
- Smith, Bethany Blair (Co-author)
- Marion, Branch Kelly (Co-author)
- Cruz, Hernandez (Co-author)
- Kimberly, McGuiness (Co-author)
- Adams, James (Thesis director)
- Krause, Stephen (Committee member)
- Barrett, The Honors College (Contributor)
- Materials Science and Engineering Program (Contributor)
Date Created
The date the item was original created (prior to any relationship with the ASU Digital Repositories.)
2015-05
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