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- Creators: Poulenc, Francis, 1899-1963
Description
The removal of support material from metal 3D printed objects is a laborious necessity for the post-processing of powder bed fusion printing (PBF). Supports are typically mechanically removed by machining techniques. Sacrificial supports are necessary in PBF printing to relieve thermal stresses and support overhanging parts often resulting in the inclusion of supports in regions of the part that are not easily accessed by mechanical removal methods. Recent innovations in PBF support removal include dissolvable metal supports through an electrochemical etching process. Dissolvable PBF supports have the potential to significantly reduce the costs and time associated with traditional support removal. However, the speed and effectiveness of this approach is inhibited by numerous factors such as support geometry and metal powder entrapment within supports. To fully realize this innovative approach, it is necessary to model and understand the design parameters necessary to optimize support structures applicable to an electrochemical etching process. The objective of this study was to evaluate the impact of block additive manufacturing support parameters on key process outcomes of the dissolution of 316 stainless steel support structures. The parameters investigated included hatch spacing and perforation, and the outcomes of interests included time required for completion, surface roughness, and effectiveness of the etching process. Electrical current was also evaluated as an indicator of process completion. Analysis of the electrical current throughout the etching process showed that the dissolution is diffusion limited to varying degrees, and is dependent on support structure parameters. Activation and passivation behavior was observed during current leveling, and appeared to be more pronounced in non-perforated samples with less dense hatch spacing. The correlation between electrical current and completion of the etching process was unclear, as the support structures became mechanically removable well before the current leveled. The etching process was shown to improve surface finish on unsupported surfaces, but support was shown to negatively impact surface finish. Tighter hatch spacing was shown to correlate to larger variation in surface finish, due to ridges left behind by the support structures. In future studies, it is recommended current be more closely correlated to process completion and more roughness data be collected to identify a trend between hatch spacing and surface roughness.
ContributorsAbranovic, Brandon (Author) / Hildreth, Owen (Thesis director) / Torres, Cesar (Committee member) / Chemical Engineering Program (Contributor) / Barrett, The Honors College (Contributor)
Created2018-05
Description
Skin electronics is one of the most promising applications of stretchable electronics. The versatility of skin electronics can only be guaranteed when it has conformal contact with human skin. While both analytical and numerical solutions for contact between serpentine interconnects and soft substrate remain unreported, the motivation of this thesis is to render a novel method to numerically study the conformability of the serpentine interconnects. This thesis explained thoroughly how to conduct finite element analysis for the conformability of skin electronics, including modeling, meshing method and step setup etc.. User-defined elements were implemented to the finite element commercial package ABAQUS for the analysis of conformability. With thorough investigation into the conformability of Fermat’s spiral, it has been found that the kirigami based pattern exhibits high conformability. Since thickness is a key factor to design skin electronics, the thesis also talked about how the change of thickness of the skin electronics impacts on the conformability.
ContributorsFan, Yiling (Author) / Jiang, Hanqing (Thesis advisor) / Hildreth, Owen (Committee member) / Yu, Hongbin (Committee member) / Arizona State University (Publisher)
Created2015
Description
“Smart” materials are used for a broad range of application including electronics, bio-medical devices, and smart clothing. This work focuses on development of smart self-sealing and breathable protective gear for soldiers against Chemical Weapon Agents (CWA). Specifically, the response of chemo-mechanical swelling polymer modified meshes to contact with stimuli droplets was studied. Theoretical discussion of the mechanism of smart materials is followed by development and experimental analysis of different modified mesh designs. A multi-physics model is proposed based on experimental data and the prototype of the fabric is tested in aerosol impingement conditions to confirm the barrier formed by rapid-self-sealing feature of the design.
ContributorsUppal, Aastha (Author) / Rykaczewski, Konrad (Thesis advisor) / Hildreth, Owen (Committee member) / Marvi, Hamidreza (Committee member) / Arizona State University (Publisher)
Created2016
Description
This paper details ink chemistries and processes to fabricate passive microfluidic devices using drop-on-demand printing of tetraethyl-orthosilicate (TEOS) inks. Parameters space investigation of the relationship between printed morphology and ink chemistries and printing parameters was conducted to demonstrate that morphology can be controlled by adjusting solvents selection, TEOS concentration, substrate temperature, and hydrolysis time. Optical microscope and scanning electron microscope images were gathered to observe printed morphology and optical videos were taken to quantify the impact of morphology on fluid flow rates. The microscopy images show that by controlling the hydrolysis time of TEOS, dilution solvents and the printing temperature, dense or fracture structure can be obtained. Fracture structures are used as passive fluidic device due to strong capillary action in cracks. At last, flow rate of passive fluidic devices with different thickness printed at different temperatures are measured and compared. The result shows the flow rate increases with the increase of device width and thickness. By controlling the morphology and dimensions of printed structure, passive microfluidic devices with designed flow rate and low fluorescence background are able to be printed.
ContributorsHuang, Yiwen (Author) / Hildreth, Owen (Thesis advisor) / Wang, Robert (Committee member) / Rykaczewski, Konrad (Committee member) / Arizona State University (Publisher)
Created2016
Description
Origami and kirigami, the technique of generating three-dimensional (3D) structures from two-dimensional (2D) flat sheets, are now more and more involved in scientific and engineering fields. Therefore, the development of tools for their theoretical analysis becomes more and more important. Since much effort was paid on calculations based on pure mathematical consideration and only limited effort has been paid to include mechanical properties, the goal of my research is developing a method to analyze the mechanical behavior of origami and kirigami based structures. Mechanical characteristics, including nonlocal effect and fracture of the structures, as well as elasticity and plasticity of materials are studied. For calculation of relative simple structures and building of structures’ constitutive relations, analytical approaches were used. For more complex structures, finite element analysis (FEA), which is commonly applied as a numerical method for the analysis of solid structures, was utilized. The general study approach is not necessarily related to characteristic size of model. I believe the scale-independent method described here will pave a new way to understand the mechanical response of a variety of origami and kirigami based structures under given mechanical loading.
ContributorsLv, Cheng (Author) / Jiang, Hanqing (Thesis advisor) / Yu, Hongbin (Committee member) / Wang, Liping (Committee member) / Mignolet, Marc (Committee member) / Hildreth, Owen (Committee member) / Arizona State University (Publisher)
Created2016
Description
Material extrusion based rapid prototyping systems have been used to produceprototypes for several years. They have been quite important in the additive manufacturing field, and have gained popularity in research, development and manufacturing in a wide field of applications. There has been a lot of interest in using these technologies to produce end use parts, and Fused Deposition Modeling (FDM) has gained traction in leading the transition of rapid prototyping technologies to rapid manufacturing. But parts built with the FDM process exhibit property anisotropy. Many studies have been conducted into process optimization, material properties and even post processing of parts, but were unable to solve the strength anisotropy issue. To address this, an optical heating system has been proposed to achieve localized heating of the pre- deposition surface prior to material deposition over the heated region. This occurs in situ within the build process, and aims to increase the interface temperature to above glass transition (Tg), to trigger an increase in polymer chain diffusion, and in extension, increase the strength of the part. An increase in flexural strength by 95% at the layer interface has been observed when the optical heating method was implemented, thereby improving property isotropy of the FDM part. This approach can be designed to perform real time control of inter-filament and interlayer temperatures across the build volume of a part, and can be tuned to achieve required mechanical properties.
ContributorsKurapatti Ravi, Abinesh (Author) / Hao Hsu, Keng (Thesis advisor) / Hildreth, Owen (Committee member) / Wang, Liping (Committee member) / Arizona State University (Publisher)
Created2016
Description
The use of nanoparticle-in-matrix composites is a common motif among a broad range of nanoscience applications and is of particular interest to the thermal sciences community. To explore this morphological theme, crystalline inorganic composites were synthesized by mixing colloidal CdSe nanocrystals and In2Se3 metal chalcogenide complex (MCC) precursor in hydrazine solvent and then thermally transform the MCC precursor into a crystalline In2Se3 matrix. The volume fraction of CdSe nanocrystals was varied from 0 to ~100% .Rich structural and chemical interactions between the CdSe nanocrystals and the In2Se3 matrix were observed. The average thermal conductivities of the 100% In2Se3 and ~100% CdSe composites are 0.32 and 0.53 W/m-K, respectively, which are remarkably low for inorganic crystalline materials. With the exception of the ~100% CdSe samples, the thermal conductivities of these nanocomposites are insensitive to CdSe volume fraction.This insensitivity is attributed to competing effects rise from structural morphology changes during composite formation.
Next, thermoelectric properties of metal chalcogenide thin films deposited from precursors using thiol-amine solvent mixtures were first reported. Cu2-xSeyS1-y and Ag-doped Cu2-xSeyS1-y thin films were synthesized, and the interrelationship between structure, composition, and room temperature thermoelectric properties was studied. The precursor annealing temperature affects the metal:chalcogen ratio, and leads to charge carrier concentration changes that affect Seebeck coefficient and electrical conductivity. Incorporating Ag into the Cu2-xSeyS1-y film leads to appreciable improvements in thermoelectric performance. Overall, the room temperature thermoelectric properties of these solution-processed materials are comparable to measurements on Cu2-xSe alloys made via conventional thermoelectric material processing methods.
Finally, a new route to make soluble metal chalcogenide precursors by reacting organic dichalcogenides with metal in different solvents was reported. By this method, SnSe, PbSe, SnTe and PbSexTe1-x precursors were successfully synthesized, and phase-pure and impurity-free metal chalcogenides were recovered after precursor decomposition. Compared to the hydrazine and diamine-dithiol route, the new approach uses safe solvent, and avoids introducing unwanted sulfur into the precursor. SnSe and PbSexTe1-x thin films, both of which are interesting thermoelectric materials, were also successfully made by solution deposition. The thermoelectric property measurements on those thin films show a great potential for future improvements.
Next, thermoelectric properties of metal chalcogenide thin films deposited from precursors using thiol-amine solvent mixtures were first reported. Cu2-xSeyS1-y and Ag-doped Cu2-xSeyS1-y thin films were synthesized, and the interrelationship between structure, composition, and room temperature thermoelectric properties was studied. The precursor annealing temperature affects the metal:chalcogen ratio, and leads to charge carrier concentration changes that affect Seebeck coefficient and electrical conductivity. Incorporating Ag into the Cu2-xSeyS1-y film leads to appreciable improvements in thermoelectric performance. Overall, the room temperature thermoelectric properties of these solution-processed materials are comparable to measurements on Cu2-xSe alloys made via conventional thermoelectric material processing methods.
Finally, a new route to make soluble metal chalcogenide precursors by reacting organic dichalcogenides with metal in different solvents was reported. By this method, SnSe, PbSe, SnTe and PbSexTe1-x precursors were successfully synthesized, and phase-pure and impurity-free metal chalcogenides were recovered after precursor decomposition. Compared to the hydrazine and diamine-dithiol route, the new approach uses safe solvent, and avoids introducing unwanted sulfur into the precursor. SnSe and PbSexTe1-x thin films, both of which are interesting thermoelectric materials, were also successfully made by solution deposition. The thermoelectric property measurements on those thin films show a great potential for future improvements.
ContributorsMa, Yuanyu (Author) / Wang, Robert (Thesis advisor) / Newman, Nathan (Committee member) / Wang, Liping (Committee member) / Hildreth, Owen (Committee member) / Arizona State University (Publisher)
Created2016
Description
Research on incorporating liquid metal into flexible substrates has resulted in a new avenue for research. Currently, the most promising technique performed was coating a cotton fiber in liquid metal and then using high heat to remove the fiber from the liquid metal without the use of flames or solvents. This is promising in that thin fibers could be coated to create the circuitry, then removed from the liquid metal. The remaining liquid metal could then be encased in a flexible polymer. This then sparked the idea of using a mortar and pestle to manually mix the liquid metal into the elastic substrate, in this case PDMS. Other materials can also be mixed in, such as graphite or alumina to create thermal interface materials (TIMs). These compounds are then poured into molds to cure, then are taken to be tested for thermal conductivity. The results have not yet returned, but this research will continue by changing the ratios of the materials in the TIMs as well as moving forward with encasing the remaining Galistan in elastomer once the fabric was removed through oxidation.
ContributorsKemme, Nicholas Austin (Author) / Rykaczewski, Konrad (Thesis director) / Hildreth, Owen (Committee member) / Mechanical and Aerospace Engineering Program (Contributor) / Barrett, The Honors College (Contributor)
Created2016-05
ContributorsPoulenc, Francis, 1899-1963 (Composer)
ContributorsPoulenc, Francis, 1899-1963 (Composer)