Matching Items (60)
158879-Thumbnail Image.png
Description
Lateral programmable metallization cells (PMC) utilize the properties of electrodeposits grown over a solid electrolyte channel. Such devices have an active anode and an inert cathode separated by a long electrodeposit channel in a coplanar arrangement. The ability to transport large amount of metallic mass across the channel makes these

Lateral programmable metallization cells (PMC) utilize the properties of electrodeposits grown over a solid electrolyte channel. Such devices have an active anode and an inert cathode separated by a long electrodeposit channel in a coplanar arrangement. The ability to transport large amount of metallic mass across the channel makes these devices attractive for various More-Than-Moore applications. Existing literature lacks a comprehensive study of electrodeposit growth kinetics in lateral PMCs. Moreover, the morphology of electrodeposit growth in larger, planar devices is also not understood. Despite the variety of applications, lateral PMCs are not embraced by the semiconductor industry due to incompatible materials and high operating voltages needed for such devices. In this work, a numerical model based on the basic processes in PMCs – cation drift and redox reactions – is proposed, and the effect of various materials parameters on the electrodeposit growth kinetics is reported. The morphology of the electrodeposit growth and kinetics of the electrodeposition process are also studied in devices based on Ag-Ge30Se70 materials system. It was observed that the electrodeposition process mainly consists of two regimes of growth – cation drift limited regime and mixed regime. The electrodeposition starts in cation drift limited regime at low electric fields and transitions into mixed regime as the field increases. The onset of mixed regime can be controlled by applied voltage which also affects the morphology of electrodeposit growth. The numerical model was then used to successfully predict the device kinetics and onset of mixed regime. The problem of materials incompatibility with semiconductor manufacturing was solved by proposing a novel device structure. A bilayer structure using semiconductor foundry friendly materials was suggested as a candidate for solid electrolyte. The bilayer structure consists of a low resistivity oxide shunt layer on top of a high resistivity ion carrying oxide layer. Devices using Cu2O as the low resistivity shunt on top of Cu doped WO3 oxide were fabricated. The bilayer devices provided orders of magnitude improvement in device performance in the context of operating voltage and switching time. Electrical and materials characterization revealed the structure of bilayers and the mechanism of electrodeposition in these devices.
ContributorsChamele, Ninad (Author) / Kozicki, Michael (Thesis advisor) / Barnaby, Hugh (Committee member) / Newman, Nathan (Committee member) / Gonzalez-Velo, Yago (Committee member) / Arizona State University (Publisher)
Created2020
161640-Thumbnail Image.png
Description
Most hardware today is based on von Neumann architecture separating memory from logic. Valuable processing time is lost in shuttling information back and forth between the two units, a problem called von Neumann bottleneck. As transistors are scaled further down, this bottleneck will make it harder to deliver performance in

Most hardware today is based on von Neumann architecture separating memory from logic. Valuable processing time is lost in shuttling information back and forth between the two units, a problem called von Neumann bottleneck. As transistors are scaled further down, this bottleneck will make it harder to deliver performance in computing power. Adding to this is the increasing complexity of artificial intelligence logic. Thus, there is a need for a faster and more efficient method of computing. Neuromorphic systems deliver this by emulating the massively parallel and fault-tolerant computing capabilities of the human brain where the action potential is triggered by multiple inputs at once (spatial) or an input that builds up over time (temporal). Highly scalable memristors are key in these systems- they can maintain their internal resistive state based on previous current/voltage values thus mimicking the way the strength of two synapses in the brain can vary. The brain-inspired algorithms are implemented by vector matrix multiplications (VMMs) to provide neuronal outputs. High-density conductive bridging random access memory (CBRAM) crossbar arrays (CBAs) can perform VMMs parallelly with ultra-low energy.This research explores a simple planarization technique that could be potentially extended to integrate front-end-of-line (FEOL) processing of complementary metal oxide semiconductor (CMOS) circuitry with back-end-of-line (BEOL) processing of CBRAM CBAs for one-transistor one-resistor (1T1R) Neuromorphic CMOS chips where the transistor is part of the CMOS circuitry and the CBRAM forms the resistor. It is a photoresist (PR) and spin-on glass (SOG) based planarization recipe to planarize CBRAM electrode patterns on a silicon substrate. In this research, however, the planarization is only applied to mechanical grade (MG) silicon wafers without any CMOS layers on them. The planarization achieved was of a very high order (few tens of nanometers). Additionally, the recipe is cost-effective, provides good quality films and simple as only two types of process technologies are involved- lithography and dry etching. Subsequent processing would involve depositing the CBRAM layers onto the planarized electrodes to form the resistor. Finally, the entire process flow is to be replicated onto wafers with CMOS layers to form the 1T1R circuit.
ContributorsBiswas, Prabaha (Author) / Barnaby, Hugh (Thesis advisor) / Kozicki, Michael (Committee member) / Velo, Yago Gonzalez (Committee member) / Arizona State University (Publisher)
Created2021
132563-Thumbnail Image.png
Description
Analog to Digital Converters (ADCs) are a critical component in modern circuit applications. ADCs are used in virtually every application in which a digital circuit is interacting with data from the real world, ranging from commercial applications to crucial military and aerospace applications, and are especially important when interacting with

Analog to Digital Converters (ADCs) are a critical component in modern circuit applications. ADCs are used in virtually every application in which a digital circuit is interacting with data from the real world, ranging from commercial applications to crucial military and aerospace applications, and are especially important when interacting with sensors that observe environmental factors. Due to the critical nature of these converters, as well as the vast range of environments in which they are used, it is important that they accurately sample data regardless of environmental factors. These environmental factors range from input noise and power supply variations to temperature and radiation, and it is important to know how each may affect the accuracy of the resulting data when designing circuits that depend upon the data from these ADCs. These environmental factors are considered hostile environments, as they each generally have a negative effect on the operation of an ADC. This thesis seeks to investigate the effects of several of these hostile environmental variables on the performance of analog to digital converters. Three different analog to digital converters with similar specifications were selected and analyzed under common hostile environments. Data was collected on multiple copies of an ADC and averaged together to analyze the results using multiple characteristics of converter performance. Performance metrics were obtained across a range of frequencies, input noise, input signal offsets, power supply voltages, and temperatures. The obtained results showed a clear decrease in performance farther from a room temperature environment, but the results for several other environmental variables showed either no significant correlation or resulted in inconclusive data.
ContributorsSwanson, Taylor Catherine (Co-author) / Millman, Hershel (Co-author) / Barnaby, Hugh (Thesis director) / Garrity, Douglas (Committee member) / Electrical Engineering Program (Contributor, Contributor) / Barrett, The Honors College (Contributor)
Created2019-05
165468-Thumbnail Image.png
Description
Most machine learning algorithms, and specifically neural networks, utilize vector-matrix multiplication (VMM) to process information, but these calculations are CPU intensive and can have long run-times. This issue is fundamentally outlined by the von Neumann bottleneck. Because of this undesirable expense associated with performing VMM via software, the exploration of

Most machine learning algorithms, and specifically neural networks, utilize vector-matrix multiplication (VMM) to process information, but these calculations are CPU intensive and can have long run-times. This issue is fundamentally outlined by the von Neumann bottleneck. Because of this undesirable expense associated with performing VMM via software, the exploration of new ways to perform the same calculations via hardware have grown more popular. When performed with hardware that is specialized to perform these calculations, VMM becomes far more power-efficient and less time consuming. This project expands upon those principles and seeks to validate the use of RRAM in this hardware. The flexibility of the conductance of RRAM makes these devices a strong contender for hardware-driven VMM calculation for neural network computing. The conductance of these devices is affected by the pulse width of a voltage signal sent across the devices at each node. This pulse is produced on-chip and can be modified by user inputs. The design of this pulse- producing circuit, as well as the simulated and physical functionality of the design, is discussed in this Honors Thesis. Simulation and physical testing of the pulse-producing design on the ASIC have verified correct operation of the design. This operation is imperative to the future ability of the ASIC to perform accurate VMM.
ContributorsPearson, Katherine (Author) / Barnaby, Hugh (Thesis director) / Wilson, Donald (Committee member) / Barrett, The Honors College (Contributor) / Electrical Engineering Program (Contributor) / School of International Letters and Cultures (Contributor)
Created2022-05
164606-Thumbnail Image.png
Description
When exposed to radiation, many electronic components become damaged and operate incorrectly. Making sure these components are resistant to radiation effects is especially important for components used in space flight operations. At low dose rates, a phenomenon known as the enhanced low dose rate sensitivity (ELDRS) effect causes an increase

When exposed to radiation, many electronic components become damaged and operate incorrectly. Making sure these components are resistant to radiation effects is especially important for components used in space flight operations. At low dose rates, a phenomenon known as the enhanced low dose rate sensitivity (ELDRS) effect causes an increase in current within linear bipolar circuits. This increase in current is not desirable for space flight operations. Correctly selecting radiation hardened components or figuring out how to deal with the effects for space operation is important, however, radiation testing each component is very expensive and time consuming. To further the future of space travel, a more efficient way of testing is highly desired by the space industry. A low-cost and time-efficient solution is the IMPACT tool. The Multiscale Tool for Modeling Radiation Effects in Linear Bipolar Circuits project aims to improve the existing IMPACT tool for radiation simulation. This tool contains a database of commonly used linear bipolar circuits and allows the user to model the radiation effects. Currently the tool is not very easy to use and the circuit database is limited. The team’s goal and overall outcome of the project is to deliver the IMPACT tool with a user-friendly interface and an expanded circuit database. The team is using multiple tools to improve the overall appearance of the IMPACT tool and running simulations to collect any necessary data for the database expansion. In our thesis, Kerri and Kylie are using LTSpice simulations to expand the database. Cheyenne is using TCAD modeling to create TCAD models of transistors and compare them with her other group member’s simulations.
ContributorsCook, Cheyenne (Author) / Welch, Kerri (Co-author) / Welch, Kylie (Co-author) / Barnaby, Hugh (Thesis director) / Kozicki, Michael (Committee member) / Barrett, The Honors College (Contributor) / Electrical Engineering Program (Contributor)
Created2022-05
164607-Thumbnail Image.png
Description
When exposed to radiation, many electronic components become damaged and operate incorrectly. Making sure these components are resistant to radiation effects is especially important for components used in space flight operations. At low dose rates, a phenomenon known as the enhanced low dose rate sensitivity (ELDRS) effect causes an increase

When exposed to radiation, many electronic components become damaged and operate incorrectly. Making sure these components are resistant to radiation effects is especially important for components used in space flight operations. At low dose rates, a phenomenon known as the enhanced low dose rate sensitivity (ELDRS) effect causes an increase in current within linear bipolar circuits. This increase in current is not desirable for space flight operations. Correctly selecting radiation hardened components or figuring out how to deal with the effects for space operation is important, however, radiation testing each component is very expensive and time consuming. To further the future of space travel, a more efficient way of testing is highly desired by the space industry. A low-cost and time-efficient solution is the IMPACT tool. The Multiscale Tool for Modeling Radiation Effects in Linear Bipolar Circuits project aims to improve the existing IMPACT tool for radiation simulation. This tool contains a database of commonly used linear bipolar circuits and allows the user to model the radiation effects. Currently the tool is not very easy to use and the circuit database is limited. The team’s goal and overall outcome of the project is to deliver the IMPACT tool with a user-friendly interface and an expanded circuit database. The team is using multiple tools to improve the overall appearance of the IMPACT tool and running simulations to collect any necessary data for the database expansion. In our thesis, Kerri and Kylie are using LTSpice simulations to expand the database. Cheyenne is using TCAD modeling to create TCAD models of transistors and compare them with her other group member’s simulations.
ContributorsWelch, Kylie (Author) / Welch, Kerri (Co-author) / Cook, Cheyenne (Co-author) / Barnaby, Hugh (Thesis director) / Kozicki, Michael (Committee member) / Barrett, The Honors College (Contributor) / Electrical Engineering Program (Contributor)
Created2022-05
164608-Thumbnail Image.png
Description
When exposed to radiation, many electronic components become damaged and operate incorrectly. Making sure these components are resistant to radiation effects is especially important for components used in space flight operations. At low dose rates, a phenomenon known as the enhanced low dose rate sensitivity (ELDRS) effect causes an increase

When exposed to radiation, many electronic components become damaged and operate incorrectly. Making sure these components are resistant to radiation effects is especially important for components used in space flight operations. At low dose rates, a phenomenon known as the enhanced low dose rate sensitivity (ELDRS) effect causes an increase in current within linear bipolar circuits. This increase in current is not desirable for space flight operations. Correctly selecting radiation hardened components or figuring out how to deal with the effects for space operation is important, however, radiation testing each component is very expensive and time consuming. To further the future of space travel, a more efficient way of testing is highly desired by the space industry. A low-cost and time-efficient solution is the IMPACT tool. The Multiscale Tool for Modeling Radiation Effects in Linear Bipolar Circuits project aims to improve the existing IMPACT tool for radiation simulation. This tool contains a database of commonly used linear bipolar circuits and allows the user to model the radiation effects. Currently the tool is not very easy to use and the circuit database is limited. The team’s goal and overall outcome of the project is to deliver the IMPACT tool with a user-friendly interface and an expanded circuit database. The team is using multiple tools to improve the overall appearance of the IMPACT tool and running simulations to collect any necessary data for the database expansion. In our thesis, Kerri and Kylie are using LTSpice simulations to expand the database. Cheyenne is using TCAD modeling to create TCAD models of transistors and compare them with her other group member’s simulations.
ContributorsWelch, Kerri (Author) / Welch, Kylie (Co-author) / Cook, Cheyenne (Co-author) / Barnaby, Hugh (Thesis director) / Kozicki, Michael (Committee member) / Barrett, The Honors College (Contributor) / Electrical Engineering Program (Contributor)
Created2022-05
Description

This thesis project explores the TID susceptibility of 12nm FinFETs. Along with the basic effects, the mechanisms and patterns of these effects are analyzed and reported.

ContributorsWallace, Trace (Author) / Barnaby, Hugh (Thesis director) / Marinella, Mathew (Committee member) / Barrett, The Honors College (Contributor) / Electrical Engineering Program (Contributor) / Dean, W.P. Carey School of Business (Contributor)
Created2022-05
151182-Thumbnail Image.png
Description
ABSTRACT As the technology length shrinks down, achieving higher gain is becoming very difficult in deep sub-micron technologies. As the supply voltages drop, cascodes are very difficult to implement and cascade amplifiers are needed to achieve sufficient gain with required output swing. This sets the fundamental limit on the SNR

ABSTRACT As the technology length shrinks down, achieving higher gain is becoming very difficult in deep sub-micron technologies. As the supply voltages drop, cascodes are very difficult to implement and cascade amplifiers are needed to achieve sufficient gain with required output swing. This sets the fundamental limit on the SNR and hence the maximum resolution that can be achieved by ADC. With the RSD algorithm and the range overlap, the sub ADC can tolerate large comparator offsets leaving the linearity and accuracy requirement for the DAC and residue gain stage. Typically, the multiplying DAC requires high gain wide bandwidth op-amp and the design of this high gain op-amp becomes challenging in the deep submicron technologies. This work presents `A 12 bit 25MSPS 1.2V pipelined ADC using split CLS technique' in IBM 130nm 8HP process using only CMOS devices for the application of Large Hadron Collider (LHC). CLS technique relaxes the gain requirement of op-amp and improves the signal-to-noise ratio without increase in power or input sampling capacitor with rail-to-rail swing. An op-amp sharing technique has been incorporated with split CLS technique which decreases the number of op-amps and hence the power further. Entire pipelined converter has been implemented as six 2.5 bit RSD stages and hence decreases the latency associated with the pipelined architecture - one of the main requirements for LHC along with the power requirement. Two different OTAs have been designed to use in the split-CLS technique. Bootstrap switches and pass gate switches are used in the circuit along with a low power dynamic kick-back compensated comparator.
ContributorsSwaminathan, Visu Vaithiyanathan (Author) / Barnaby, Hugh (Thesis advisor) / Bakkaloglu, Bertan (Committee member) / Christen, Jennifer Blain (Committee member) / Arizona State University (Publisher)
Created2012
190847-Thumbnail Image.png
Description
Machine learning advancements have led to increasingly complex algorithms, resulting in significant energy consumption due to heightened memory-transfer requirements and inefficient vector matrix multiplication (VMM). To address this issue, many have proposed ReRAM analog in-memory computing (AIMC) as a solution. AIMC enhances the time-energy efficiency of VMM operations beyond conventional

Machine learning advancements have led to increasingly complex algorithms, resulting in significant energy consumption due to heightened memory-transfer requirements and inefficient vector matrix multiplication (VMM). To address this issue, many have proposed ReRAM analog in-memory computing (AIMC) as a solution. AIMC enhances the time-energy efficiency of VMM operations beyond conventional VMM digital hardware, such as a tensor processing unit (TPU), while substantially reducing memory-transfer demands through in-memory computing. As AIMC gains prominence as a solution, it becomes crucial to optimize ReRAM and analog crossbar architecture characteristics. This thesis introduces an application-specific integrated circuit (ASIC) tailored forcharacterizing ReRAM within a crossbar array architecture and discusses the interfacing techniques employed. It discusses ReRAM forming and programming techniques and showcases chip’s ability to utilize the write-verify programming method to write image pixels on a conductance heat map. Additionally, this thesis assesses the ASIC’s capability to characterize different aspects of ReRAM, including drift and noise characteristics. The research employs the chip to extract ReRAM data and models it within a crossbar array simulator, enabling its application in the classification of the CIFAR-10 dataset.
ContributorsShort, Jesse (Author) / Marinella, Matthew (Thesis advisor) / Barnaby, Hugh (Committee member) / Sanchez Esqueda, Ivan (Committee member) / Arizona State University (Publisher)
Created2023