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- All Subjects: engineering
- All Subjects: Electric inductors
- Genre: Academic theses
- Genre: Masters Thesis
- Creators: Bakkaloglu, Bertan
- Member of: Theses and Dissertations
Description
With increasing demand for System on Chip (SoC) and System in Package (SiP) design in computer and communication technologies, integrated inductor which is an essential passive component has been widely used in numerous integrated circuits (ICs) such as in voltage regulators and RF circuits. In this work, soft ferromagnetic core material, amorphous Co-Zr-Ta-B, was incorporated into on-chip and in-package inductors in order to scale down inductors and improve inductors performance in both inductance density and quality factor. With two layers of 500 nm Co-Zr-Ta-B films a 3.5X increase in inductance and a 3.9X increase in quality factor over inductors without magnetic films were measured at frequencies as high as 1 GHz. By laminating technology, up to 9.1X increase in inductance and more than 5X increase in quality factor (Q) were obtained from stripline inductors incorporated with 50 nm by 10 laminated films with a peak Q at 300 MHz. It was also demonstrated that this peak Q can be pushed towards high frequency as far as 1GHz by a combination of patterning magnetic films into fine bars and laminations. The role of magnetic vias in magnetic flux and eddy current control was investigated by both simulation and experiment using different patterning techniques and by altering the magnetic via width. Finger-shaped magnetic vias were designed and integrated into on-chip RF inductors improving the frequency of peak quality factor from 400 MHz to 800 MHz without sacrificing inductance enhancement. Eddy current and magnetic flux density in different areas of magnetic vias were analyzed by HFSS 3D EM simulation. With optimized magnetic vias, high frequency response of up to 2 GHz was achieved. Furthermore, the effect of applied magnetic field on on-chip inductors was investigated for high power applications. It was observed that as applied magnetic field along the hard axis (HA) increases, inductance maintains similar value initially at low fields, but decreases at larger fields until the magnetic films become saturated. The high frequency quality factor showed an opposite trend which is correlated to the reduction of ferromagnetic resonant absorption in the magnetic film. In addition, experiments showed that this field-dependent inductance change varied with different patterned magnetic film structures, including bars/slots and fingers structures. Magnetic properties of Co-Zr-Ta-B films on standard organic package substrates including ABF and polyimide were also characterized. Effects of substrate roughness and stress were analyzed and simulated which provide strategies for integrating Co-Zr-Ta-B into package inductors and improving inductors performance. Stripline and spiral inductors with Co-Zr-Ta-B films were fabricated on both ABF and polyimide substrates. Maximum 90% inductance increase in hundreds MHz frequency range were achieved in stripline inductors which are suitable for power delivery applications. Spiral inductors with Co-Zr-Ta-B films showed 18% inductance increase with quality factor of 4 at frequency up to 3 GHz.
ContributorsWu, Hao (Author) / Yu, Hongbin (Thesis advisor) / Bakkaloglu, Bertan (Committee member) / Cao, Yu (Committee member) / Chickamenahalli, Shamala (Committee member) / Arizona State University (Publisher)
Created2013
Description
Current hybrid vehicle and/or Fuel Cell Vehicle (FCV) use both FC and an electric system. The sequence of the electric power train with the FC system is intended to achieve both better fuel economies than the conventional vehicles and higher performance. Current hybrids use regenerative braking technology, which converts the vehicles kinetic energy into electric energy instead of wasting it. A hybrid vehicle is much more fuel efficient than conventional Internal Combustion (IC) engine and has less environmental impact The new hybrid vehicle technology with it's advanced with configurations (i.e. Mechanical intricacy, advanced driving modes etc) inflict an intrusion with the existing Thermal Management System (TMS) of the conventional vehicles. This leaves for the opportunity for now thermal management issues which needed to be addressed. Till date, there has not been complete literature on thermal management issued of FC vehicles. The primary focus of this dissertation is on providing better cooling strategy for the advanced power trains. One of the cooling strategies discussed here is the thermo-electric modules.
The 3D Thermal modeling of the FC stack utilizes a Finite Differencing heat approach method augmented with empirical boundary conditions is employed to develop 3D thermal model for the integration of thermoelectric modules with Proton Exchange Membrane fuel cell stack. Hardware-in-Loop was designed under pre-defined drive cycle to obtain fuel cell performance parameters along with anode and cathode gas flow-rates and surface temperatures. The FC model, combined experimental and finite differencing nodal net work simulation modeling approach which implemented heat generation across the stack to depict the chemical composition process. The structural and temporal temperature contours obtained from this model are in compliance with the actual recordings obtained from the infrared detector and thermocouples. The Thermography detectors were set-up through dual band thermography to neutralize the emissivity and to give several dynamic ranges to achieve accurate temperature measurements. The thermocouples network was installed to provide a reference signal.
The model is harmonized with thermo-electric modules with a modeling strategy, which enables optimize better temporal profile across the stack. This study presents the improvement of a 3D thermal model for proton exchange membrane fuel cell stack along with the interfaced thermo-electric module. The model provided a virtual environment using a model-based design approach to assist the design engineers to manipulate the design correction earlier in the process and eliminate the need for costly and time consuming prototypes.
The 3D Thermal modeling of the FC stack utilizes a Finite Differencing heat approach method augmented with empirical boundary conditions is employed to develop 3D thermal model for the integration of thermoelectric modules with Proton Exchange Membrane fuel cell stack. Hardware-in-Loop was designed under pre-defined drive cycle to obtain fuel cell performance parameters along with anode and cathode gas flow-rates and surface temperatures. The FC model, combined experimental and finite differencing nodal net work simulation modeling approach which implemented heat generation across the stack to depict the chemical composition process. The structural and temporal temperature contours obtained from this model are in compliance with the actual recordings obtained from the infrared detector and thermocouples. The Thermography detectors were set-up through dual band thermography to neutralize the emissivity and to give several dynamic ranges to achieve accurate temperature measurements. The thermocouples network was installed to provide a reference signal.
The model is harmonized with thermo-electric modules with a modeling strategy, which enables optimize better temporal profile across the stack. This study presents the improvement of a 3D thermal model for proton exchange membrane fuel cell stack along with the interfaced thermo-electric module. The model provided a virtual environment using a model-based design approach to assist the design engineers to manipulate the design correction earlier in the process and eliminate the need for costly and time consuming prototypes.
ContributorsRamani, Dilip (Author) / Mayyas, Abdel Ra'Ouf (Thesis advisor) / Hsu, Keng (Committee member) / Madakannan, Arunachalanadar (Committee member) / Arizona State University (Publisher)
Created2014
Description
Current sensing ability is one of the most desirable features of contemporary current or voltage mode controlled DC-DC converters. Current sensing can be used for over load protection, multi-stage converter load balancing, current-mode control, multi-phase converter current-sharing, load independent control, power efficiency improvement etc. There are handful existing approaches for current sensing such as external resistor sensing, triode mode current mirroring, observer sensing, Hall-Effect sensors, transformers, DC Resistance (DCR) sensing, Gm-C filter sensing etc. However, each method has one or more issues that prevent them from being successfully applied in DC-DC converter, e.g. low accuracy, discontinuous sensing nature, high sensitivity to switching noise, high cost, requirement of known external power filter components, bulky size, etc. In this dissertation, an offset-independent inductor Built-In Self Test (BIST) architecture is proposed which is able to measure the inductor inductance and DCR. The measured DCR enables the proposed continuous, lossless, average current sensing scheme. A digital Voltage Mode Control (VMC) DC-DC buck converter with the inductor BIST and current sensing architecture is designed, fabricated, and experimentally tested. The average measurement errors for inductance, DCR and current sensing are 2.1%, 3.6%, and 1.5% respectively. For the 3.5mm by 3.5mm die area, inductor BIST and current sensing circuits including related pins only consume 5.2% of the die area. BIST mode draws 40mA current for a maximum time period of 200us upon start-up and the continuous current sensing consumes about 400uA quiescent current. This buck converter utilizes an adaptive compensator. It could update compensator internally so that the overall system has a proper loop response for large range inductance and load current. Next, a digital Average Current Mode Control (ACMC) DC-DC buck converter with the proposed average current sensing circuits is designed and tested. To reduce chip area and power consumption, a 9 bits hybrid Digital Pulse Width Modulator (DPWM) which uses a Mixed-mode DLL (MDLL) is also proposed. The DC-DC converter has a maximum of 12V input, 1-11 V output range, and a maximum of 3W output power. The maximum error of one least significant bit (LSB) delay of the proposed DPWM is less than 1%.
ContributorsLiu, Tao (Author) / Bakkaloglu, Bertan (Thesis advisor) / Ozev, Sule (Committee member) / Vermeire, Bert (Committee member) / Cao, Yu (Committee member) / Arizona State University (Publisher)
Created2011
Description
Pulse Density Modulation- (PDM-) based class-D amplifiers can reduce non-linearity and tonal content due to carrier signal in Pulse Width Modulation - (PWM-) based amplifiers. However, their low-voltage analog implementations also require a linear- loop filter and a quantizer. A PDM-based class-D audio amplifier using a frequency-domain quantization is presented in this paper. The digital-intensive frequency domain approach achieves high linearity under low-supply regimes. An analog comparator and a single-bit quantizer are replaced with a Current-Controlled Oscillator- (ICO-) based frequency discriminator. By using the ICO as a phase integrator, a third-order noise shaping is achieved using only two analog integrators. A single-loop, singlebit class-D audio amplifier is presented with an H-bridge switching power stage, which is designed and fabricated on a 0.18 um CMOS process, with 6 layers of metal achieving a total harmonic distortion plus noise (THD+N) of 0.065% and a peak power efficiency of 80% while driving a 4-ohms loudspeaker load. The amplifier can deliver the output power of 280 mW.
ContributorsLee, Junghan (Author) / Bakkaloglu, Bertan (Thesis advisor) / Kiaei, Sayfe (Committee member) / Ozev, Sule (Committee member) / Song, Hongjiang (Committee member) / Arizona State University (Publisher)
Created2011
Description
ABSTRACT To meet stringent market demands, manufacturers must produce Radio Frequency (RF) transceivers that provide wireless communication between electronic components used in consumer products at extremely low cost. Semiconductor manufacturers are in a steady race to increase integration levels through advanced system-on-chip (SoC) technology. The testing costs of these devices tend to increase with higher integration levels. As the integration levels increase and the devices get faster, the need for high-calibre low cost test equipment become highly dominant. However testing the overall system becomes harder and more expensive. Traditionally, the transceiver system is tested in two steps utilizing high-calibre RF instrumentation and mixed-signal testers, with separate measurement setups for transmitter and receiver paths. Impairments in the RF front-end, such as the I/Q gain and phase imbalance and nonlinearity, severely affect the performance of the device. The transceiver needs to be characterized in terms of these impairments in order to guarantee good performance and specification requirements. The motivation factor for this thesis is to come up with a low cost and computationally simple extraction technique of these impairments. In the proposed extraction technique, the mapping between transmitter input signals and receiver output signals are used to extract the impairment and nonlinearity parameters. This is done with the help of detailed mathematical modeling of the transceiver. While the overall behavior is nonlinear, both linear and nonlinear models to be used under different test setups are developed. A two step extraction technique has been proposed in this work. The extraction of system parameters is performed by using the mathematical model developed along with a genetic algorithm implemented in MATLAB. The technique yields good extraction results with reasonable error. It uses simple mathematical operation which makes the extraction fast and computationally simple when compared to other existing techniques such as traditional two step dedicated approach, Nonlinear Solver (NLS) approach, etc. It employs frequency domain analysis of low frequency input and output signals, over cumbersome time domain computations. Thus a test method, including detailed behavioral modeling of the transceiver, appropriate test signal design along with a simple algorithm for extraction is presented.
ContributorsSreenivassan, Aiswariya (Author) / Ozev, Sule (Thesis advisor) / Kiaei, Sayfe (Committee member) / Bakkaloglu, Bertan (Committee member) / Arizona State University (Publisher)
Created2011
Description
A workload-aware low-power neuromorphic controller for dynamic power and thermal management in VLSI systems is presented. The neuromorphic controller predicts future workload and temperature values based on the past values and CPU performance counters and preemptively regulates supply voltage and frequency. System-level measurements from stateof-the-art commercial microprocessors are used to get workload, temperature and CPU performance counter values. The controller is designed and simulated using circuit-design and synthesis tools. At device-level, on-chip planar inductors suffer from low inductance occupying large chip area. On-chip inductors with integrated magnetic materials are designed, simulated and fabricated to explore performance-efficiency trade offs and explore potential applications such as resonant clocking and on-chip voltage regulation. A system level study is conducted to evaluate the effect of on-chip voltage regulator employing magnetic inductors as the output filter. It is concluded that neuromorphic power controller is beneficial for fine-grained per-core power management in conjunction with on-chip voltage regulators utilizing scaled magnetic inductors.
ContributorsSinha, Saurabh (Author) / Cao, Yu (Thesis advisor) / Bakkaloglu, Bertan (Committee member) / Yu, Hongbin (Committee member) / Christen, Jennifer B. (Committee member) / Arizona State University (Publisher)
Created2011
Description
Three-dimensional (3D) inductors with square, hexagonal and octagonal geometries have been designed and simulated in ANSYS HFSS. The inductors have been designed on Silicon substrate with through-hole via with different width, spacing and thickness. Spice modeling has been done in Agilent ADS and comparison has been made with results of custom excel based calculator and HFSS simulation results. Single ended quality factor was measured as 12.97 and differential ended quality factor was measured as 15.96 at a maximum operational frequency of 3.65GHz. The single ended and differential inductance was measured as 2.98nH and 2.88nH respectively at this frequency. Based on results a symmetric octagonal inductor design has been recommended to be used for application in RF biosensing. A system design has been proposed based on use of this inductor and principle of inductive sensing using magnetic labeling.
ContributorsAbbey, Hemanshu (Author) / Bakkaloglu, Bertan (Thesis advisor) / Kiaei, Sayfe (Committee member) / Goryll, Michael (Committee member) / Arizona State University (Publisher)
Created2012
Description
Biosensors aiming at detection of target analytes, such as proteins, microbes, virus, and toxins, are widely needed for various applications including detection of chemical and biological warfare (CBW) agents, biomedicine, environmental monitoring, and drug screening. Surface Plasmon Resonance (SPR), as a surface-sensitive analytical tool, can very sensitively respond to minute changes of refractive index occurring adjacent to a metal film, offering detection limits up to a few ppt (pg/mL). Through SPR, the process of protein adsorption may be monitored in real-time, and transduced into an SPR angle shift. This unique technique bypasses the time-consuming, labor-intensive labeling processes, such as radioisotope and fluorescence labeling. More importantly, the method avoids the modification of the biomarker’s characteristics and behaviors by labeling that often occurs in traditional biosensors. While many transducers, including SPR, offer high sensitivity, selectivity is determined by the bio-receptors. In traditional biosensors, the selectivity is provided by bio-receptors possessing highly specific binding affinity to capture target analytes, yet their use in biosensors are often limited by their relatively-weak binding affinity with analyte, non-specific adsorption, need for optimization conditions, low reproducibility, and difficulties integrating onto the surface of transducers. In order to circumvent the use of bio-receptors, the competitive adsorption of proteins, termed the Vroman effect, is utilized in this work. The Vroman effect was first reported by Vroman and Adams in 1969. The competitive adsorption targeted here occurs among different proteins competing to adsorb to a surface, when more than one type of protein is present. When lower-affinity proteins are adsorbed on the surface first, they can be displaced by higher-affinity proteins arriving at the surface at a later point in time. Moreover, only low-affinity proteins can be displaced by high-affinity proteins, typically possessing higher molecular weight, yet the reverse sequence does not occur. The SPR biosensor based on competitive adsorption is successfully demonstrated to detect fibrinogen and thyroglobulin (Tg) in undiluted human serum and copper ions in drinking water through the denatured albumin.
ContributorsWang, Ran (Author) / Chae, Junseok (Thesis advisor) / Bakkaloglu, Bertan (Committee member) / Tsow, Tsing (Committee member) / Goryll, Michael (Committee member) / Arizona State University (Publisher)
Created2015
Description
The demand for miniaturized components with feature sizes as small as tens of microns and tolerances as small as 0.1 microns is on the rise in the fields of aerospace, electronics, optics and biomedical engineering. Micromilling has proven to be a process capable of generating the required accuracy for these features and is an alternative to various non-mechanical micro-manufacturing processes which are limited in terms of cost and productivity, especially at the micro-meso scale. The micromilling process is on the surface, a miniaturized version of conventional milling, hence inheriting its benefits. However, the reduction in scale by a few magnitudes makes the process peculiar and unique; and the macro-scale theories have failed to successfully explain the micromilling process and its machining parameters. One such characteristic is the unpredictable nature of tool wear and breakage. There is a large cost benefit that can be realized by improving tool life. Workpiece rejection can also be reduced by successfully monitoring the condition of the tool to avoid issues. Many researchers have developed Tool Condition Monitoring and Tool Wear Modeling systems to address the issue of tool wear, and to obtain new knowledge. In this research, a tool wear modeling effort is undertaken with a new approach. A new tool wear signature is used for real-time data collection and modeling of tool wear. A theoretical correlation between the number of metal chips produced during machining and the condition of the tool is introduced. Experimentally, it is found that the number of chips produced drops with respect to the feedrate of the cutting process i.e. when the uncut chip thickness is below the theoretical minimum chip thickness.
ContributorsBajaj, Anuj Kishorkumar (Author) / SODEMANN, ANGELA A (Thesis advisor) / Bekki, Jeniffer (Committee member) / Hsu, Keng (Committee member) / Arizona State University (Publisher)
Created2015
Description
The increase in computing power has simultaneously increased the demand for input/output (I/O) bandwidth. Unfortunately, the speed of I/O and memory interconnects have not kept pace. Thus, processor-based systems are I/O and interconnect limited. The memory aggregated bandwidth is not scaling fast enough to keep up with increasing bandwidth demands. The term "memory wall" has been coined to describe this phenomenon.
A new memory bus concept that has the potential to push double data rate (DDR) memory speed to 30 Gbit/s is presented. We propose to map the conventional DDR bus to a microwave link using a multicarrier frequency division multiplexing scheme. The memory bus is formed using a microwave signal carried within a waveguide. We call this approach multicarrier memory channel architecture (MCMCA). In MCMCA, each memory signal is modulated onto an RF carrier using 64-QAM format or higher. The carriers are then routed using substrate integrated waveguide (SIW) interconnects. At the receiver, the memory signals are demodulated and then delivered to SDRAM devices. We pioneered the usage of SIW as memory channel interconnects and demonstrated that it alleviates the memory bandwidth bottleneck. We demonstrated SIW performance superiority over conventional transmission line in immunity to cross-talk and electromagnetic interference. We developed a methodology based on design of experiment (DOE) and response surface method techniques that optimizes the design of SIW interconnects and minimizes its performance fluctuations under material and manufacturing variations. Along with using SIW, we implemented a multicarrier architecture which enabled the aggregated DDR bandwidth to reach 30 Gbit/s. We developed an end-to-end system model in Simulink and demonstrated the MCMCA performance for ultra-high throughput memory channel.
Experimental characterization of the new channel shows that by using judicious frequency division multiplexing, as few as one SIW interconnect is sufficient to transmit the 64 DDR bits. Overall aggregated bus data rate achieves 240 GBytes/s data transfer with EVM not exceeding 2.26% and phase error of 1.07 degree or less.
A new memory bus concept that has the potential to push double data rate (DDR) memory speed to 30 Gbit/s is presented. We propose to map the conventional DDR bus to a microwave link using a multicarrier frequency division multiplexing scheme. The memory bus is formed using a microwave signal carried within a waveguide. We call this approach multicarrier memory channel architecture (MCMCA). In MCMCA, each memory signal is modulated onto an RF carrier using 64-QAM format or higher. The carriers are then routed using substrate integrated waveguide (SIW) interconnects. At the receiver, the memory signals are demodulated and then delivered to SDRAM devices. We pioneered the usage of SIW as memory channel interconnects and demonstrated that it alleviates the memory bandwidth bottleneck. We demonstrated SIW performance superiority over conventional transmission line in immunity to cross-talk and electromagnetic interference. We developed a methodology based on design of experiment (DOE) and response surface method techniques that optimizes the design of SIW interconnects and minimizes its performance fluctuations under material and manufacturing variations. Along with using SIW, we implemented a multicarrier architecture which enabled the aggregated DDR bandwidth to reach 30 Gbit/s. We developed an end-to-end system model in Simulink and demonstrated the MCMCA performance for ultra-high throughput memory channel.
Experimental characterization of the new channel shows that by using judicious frequency division multiplexing, as few as one SIW interconnect is sufficient to transmit the 64 DDR bits. Overall aggregated bus data rate achieves 240 GBytes/s data transfer with EVM not exceeding 2.26% and phase error of 1.07 degree or less.
ContributorsBensalem, Brahim (Author) / Aberle, James T. (Thesis advisor) / Bakkaloglu, Bertan (Committee member) / Tirkas, Panayiotis A. (Committee member) / Kitchen, Jennifer (Committee member) / Arizona State University (Publisher)
Created2018