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- All Subjects: engineering
- Creators: Jiao, Yang
Description
For decades, microelectronics manufacturing has been concerned with failures related to electromigration phenomena in conductors experiencing high current densities. The influence of interconnect microstructure on device failures related to electromigration in BGA and flip chip solder interconnects has become a significant interest with reduced individual solder interconnect volumes. A survey indicates that x-ray computed micro-tomography (µXCT) is an emerging, novel means for characterizing the microstructures' role in governing electromigration failures. This work details the design and construction of a lab-scale µXCT system to characterize electromigration in the Sn-0.7Cu lead-free solder system by leveraging in situ imaging.
In order to enhance the attenuation contrast observed in multi-phase material systems, a modeling approach has been developed to predict settings for the controllable imaging parameters which yield relatively high detection rates over the range of x-ray energies for which maximum attenuation contrast is expected in the polychromatic x-ray imaging system. In order to develop this predictive tool, a model has been constructed for the Bremsstrahlung spectrum of an x-ray tube, and calculations for the detector's efficiency over the relevant range of x-ray energies have been made, and the product of emitted and detected spectra has been used to calculate the effective x-ray imaging spectrum. An approach has also been established for filtering `zinger' noise in x-ray radiographs, which has proven problematic at high x-ray energies used for solder imaging. The performance of this filter has been compared with a known existing method and the results indicate a significant increase in the accuracy of zinger filtered radiographs.
The obtained results indicate the conception of a powerful means for the study of failure causing processes in solder systems used as interconnects in microelectronic packaging devices. These results include the volumetric quantification of parameters which are indicative of both electromigration tolerance of solders and the dominant mechanisms for atomic migration in response to current stressing. This work is aimed to further the community's understanding of failure-causing electromigration processes in industrially relevant material systems for microelectronic interconnect applications and to advance the capability of available characterization techniques for their interrogation.
In order to enhance the attenuation contrast observed in multi-phase material systems, a modeling approach has been developed to predict settings for the controllable imaging parameters which yield relatively high detection rates over the range of x-ray energies for which maximum attenuation contrast is expected in the polychromatic x-ray imaging system. In order to develop this predictive tool, a model has been constructed for the Bremsstrahlung spectrum of an x-ray tube, and calculations for the detector's efficiency over the relevant range of x-ray energies have been made, and the product of emitted and detected spectra has been used to calculate the effective x-ray imaging spectrum. An approach has also been established for filtering `zinger' noise in x-ray radiographs, which has proven problematic at high x-ray energies used for solder imaging. The performance of this filter has been compared with a known existing method and the results indicate a significant increase in the accuracy of zinger filtered radiographs.
The obtained results indicate the conception of a powerful means for the study of failure causing processes in solder systems used as interconnects in microelectronic packaging devices. These results include the volumetric quantification of parameters which are indicative of both electromigration tolerance of solders and the dominant mechanisms for atomic migration in response to current stressing. This work is aimed to further the community's understanding of failure-causing electromigration processes in industrially relevant material systems for microelectronic interconnect applications and to advance the capability of available characterization techniques for their interrogation.
ContributorsMertens, James Charles Edwin (Author) / Chawla, Nikhilesh (Thesis advisor) / Alford, Terry (Committee member) / Jiao, Yang (Committee member) / Neithalath, Narayanan (Committee member) / Arizona State University (Publisher)
Created2015
Description
In this dissertation, the results of our comprehensive computational studies of disordered jammed (i.e., mechanically stable) packings of hard particles are presented, including the family of superdisks in 2D and ellipsoids in 3D Euclidean space. Following a very brief introduction to the hard-particle systems, the event driven molecular dynamics (EDMD) employed to generate the packing ensembles will be discussed. A large number of 2D packing configurations of superdisks are subsequently analyzed, through which a relatively accurate theoretical scheme for packing-fraction prediction based on local particle contact configurations is proposed and validated via additional numerical simulations. Moreover, the studies on binary ellipsoid packing in 3D are briefly discussed and the effects of different geometrical parameters on the final packing fraction are analyzed.
ContributorsXu, Yaopengxiao (Author) / Jiao, Yang (Thesis advisor) / Oswald, Jay (Committee member) / Liu, Yongming (Committee member) / Arizona State University (Publisher)
Created2014
Description
In this dissertation, three complex material systems including a novel class of hyperuniform composite materials, cellularized collagen gel and low melting point alloy (LMPA) composite are investigated, using statistical pattern characterization, stochastic microstructure reconstruction and micromechanical analysis. In Chapter 1, an introduction of this report is provided, in which a brief review is made about these three material systems. In Chapter 2, detailed discussion of the statistical morphological descriptors and a stochastic optimization approach for microstructure reconstruction is presented. In Chapter 3, the lattice particle method for micromechanical analysis of complex heterogeneous materials is introduced. In Chapter 4, a new class of hyperuniform heterogeneous material with superior mechanical properties is investigated. In Chapter 5, a bio-material system, i.e., cellularized collagen gel is modeled using correlation functions and stochastic reconstruction to study the collective dynamic behavior of the embed tumor cells. In chapter 6, LMPA soft robotic system is generated by generalizing the correlation functions and the rigidity tunability of this smart composite is discussed. In Chapter 7, a future work plan is presented.
ContributorsXu, Yaopengxiao (Author) / Jiao, Yang (Thesis advisor) / Liu, Yongming (Committee member) / Wang, Qing Hua (Committee member) / Ren, Yi (Committee member) / Arizona State University (Publisher)
Created2018
Description
Increasing density of microelectronic packages, results in an increase in thermal and mechanical stresses within the various layers of the package. To accommodate the high-performance demands, the materials used in the electronic package would also require improvement. Specifically, the damage that often occurs in solders that function as die-attachment and thermal interfaces need to be addressed. This work evaluates and characterizes thermo-mechanical damage in two material systems – Electroplated Tin and Sintered Nano-Silver solder.
Tin plated electrical contacts are prone to formation of single crystalline tin whiskers which can cause short circuiting. A mechanistic model of their formation, evolution and microstructural influence is still not fully understood. In this work, growth of mechanically induced tin whiskers/hillocks is studied using in situ Nano-indentation and Electron Backscatter Diffraction (EBSD). Electroplated tin was indented and monitored in vacuum to study growth of hillocks without the influence of atmosphere. Thermal aging was done to study the effect of intermetallic compounds. Grain orientation of the hillocks and the plastically deformed region surrounding the indent was studied using Focused Ion Beam (FIB) lift-out technique. In addition, micropillars were milled on the surface of electroplated Sn using FIB to evaluate the yield strength and its relation to Sn grain size.
High operating temperature power electronics use wide band-gap semiconductor devices (Silicon Carbide/Gallium Nitride). The operating temperature of these devices can exceed 250oC, preventing use of traditional Sn-solders as Thermal Interface materials (TIM). At high temperature, the thermomechanical stresses can severely degrade the reliability and life of the device. In this light, new non-destructive approach is needed to understand the damage mechanism when subjected to reliability tests such as thermal cycling. In this work, sintered nano-Silver was identified as a promising high temperature TIM. Sintered nano-Silver samples were fabricated and their shear strength was evaluated. Thermal cycling tests were conducted and damage evolution was characterized using a lab scale 3D X-ray system to periodically assess changes in the microstructure such as cracks, voids, and porosity in the TIM layer. The evolution of microstructure and the effect of cycling temperature during thermal cycling are discussed.
Tin plated electrical contacts are prone to formation of single crystalline tin whiskers which can cause short circuiting. A mechanistic model of their formation, evolution and microstructural influence is still not fully understood. In this work, growth of mechanically induced tin whiskers/hillocks is studied using in situ Nano-indentation and Electron Backscatter Diffraction (EBSD). Electroplated tin was indented and monitored in vacuum to study growth of hillocks without the influence of atmosphere. Thermal aging was done to study the effect of intermetallic compounds. Grain orientation of the hillocks and the plastically deformed region surrounding the indent was studied using Focused Ion Beam (FIB) lift-out technique. In addition, micropillars were milled on the surface of electroplated Sn using FIB to evaluate the yield strength and its relation to Sn grain size.
High operating temperature power electronics use wide band-gap semiconductor devices (Silicon Carbide/Gallium Nitride). The operating temperature of these devices can exceed 250oC, preventing use of traditional Sn-solders as Thermal Interface materials (TIM). At high temperature, the thermomechanical stresses can severely degrade the reliability and life of the device. In this light, new non-destructive approach is needed to understand the damage mechanism when subjected to reliability tests such as thermal cycling. In this work, sintered nano-Silver was identified as a promising high temperature TIM. Sintered nano-Silver samples were fabricated and their shear strength was evaluated. Thermal cycling tests were conducted and damage evolution was characterized using a lab scale 3D X-ray system to periodically assess changes in the microstructure such as cracks, voids, and porosity in the TIM layer. The evolution of microstructure and the effect of cycling temperature during thermal cycling are discussed.
ContributorsLujan Regalado, Irene (Author) / Chawla, Nikhilesh (Thesis advisor) / Frear, Darrel (Committee member) / Rajagopalan, Jagannathan (Committee member) / Jiao, Yang (Committee member) / Arizona State University (Publisher)
Created2018
Description
With the growing penetration of plug-in electric vehicles (PEVs), the impact of the PEV charging brought to the utility grid draws more and more attention. This thesis focused on the optimization of a home energy management system (HEMS) with the presence of PEVs. For a household microgrid with photovoltaic (PV) panels and PEVs, a HEMS using model predictive control (MPC) is designed to achieve the optimal PEV charging. Soft electric loads and an energy storage system (ESS) are also considered in the optimization of PEV charging in the MPC framework. The MPC is solved through mixed-integer linear programming (MILP) by considering the relationship of energy flows in the optimization problem. Through the simulation results, the performance of optimization results under various electricity price plans is evaluated. The influences of PV capacities on the optimization results of electricity cost are also discussed. Furthermore, the hardware development of a microgrid prototype is also described in this thesis.
ContributorsZhao, Yue (Author) / Chen, Yan (Thesis advisor) / Johnson, Nathan (Committee member) / Lei, Qin (Committee member) / Arizona State University (Publisher)
Created2018
Description
The concept of the microgrid is widely studied and explored in both academic and industrial societies. The microgrid is a power system with distributed generations and loads, which is intentionally planned and can be disconnected from the main utility grid. Nowadays, various distributed power generations (wind resource, photovoltaic resource, etc.) are emerging to be significant power sources of the microgrid.
This thesis focuses on the system structure of Photovoltaics (PV)-dominated microgrid, precisely modeling and stability analysis of the specific system. The grid-connected mode microgrid is considered, and system control objectives are: PV panel is working at the maximum power point (MPP), the DC link voltage is regulated at a desired value, and the grid side current is also controlled in phase with grid voltage. To simulate the real circuits of the whole system with high fidelity instead of doing real experiments, PLECS software is applied to construct the detailed model in chapter 2. Meanwhile, a Simulink mathematical model of the microgrid system is developed in chapter 3 for faster simulation and energy management analysis. Simulation results of both the PLECS model and Simulink model are matched with the expectations. Next chapter talks about state space models of different power stages for stability analysis utilization. Finally, the large signal stability analysis of a grid-connected inverter, which is based on cascaded control of both DC link voltage and grid side current is discussed. The large signal stability analysis presented in this thesis is mainly focused on the impact of the inductor and capacitor capacity and the controller parameters on the DC link stability region. A dynamic model with the cascaded control logic is proposed. One Lyapunov large-signal stability analysis tool is applied to derive the domain of attraction, which is the asymptotic stability region. Results show that both the DC side capacitor and the inductor of grid side filter can significantly influence the stability region of the DC link voltage. PLECS simulation models developed for the microgrid system are applied to verify the stability regions estimated from the Lyapunov large signal analysis method.
This thesis focuses on the system structure of Photovoltaics (PV)-dominated microgrid, precisely modeling and stability analysis of the specific system. The grid-connected mode microgrid is considered, and system control objectives are: PV panel is working at the maximum power point (MPP), the DC link voltage is regulated at a desired value, and the grid side current is also controlled in phase with grid voltage. To simulate the real circuits of the whole system with high fidelity instead of doing real experiments, PLECS software is applied to construct the detailed model in chapter 2. Meanwhile, a Simulink mathematical model of the microgrid system is developed in chapter 3 for faster simulation and energy management analysis. Simulation results of both the PLECS model and Simulink model are matched with the expectations. Next chapter talks about state space models of different power stages for stability analysis utilization. Finally, the large signal stability analysis of a grid-connected inverter, which is based on cascaded control of both DC link voltage and grid side current is discussed. The large signal stability analysis presented in this thesis is mainly focused on the impact of the inductor and capacitor capacity and the controller parameters on the DC link stability region. A dynamic model with the cascaded control logic is proposed. One Lyapunov large-signal stability analysis tool is applied to derive the domain of attraction, which is the asymptotic stability region. Results show that both the DC side capacitor and the inductor of grid side filter can significantly influence the stability region of the DC link voltage. PLECS simulation models developed for the microgrid system are applied to verify the stability regions estimated from the Lyapunov large signal analysis method.
ContributorsXu, Hongru (Author) / Chen, Yan (Thesis advisor) / Johnson, Nathan (Committee member) / Lei, Qin (Committee member) / Arizona State University (Publisher)
Created2018
Description
The most important metrics considered for electric vehicles are power density, efficiency, and reliability of the powertrain modules. The powertrain comprises of an Electric Machine (EM), power electronic converters, an Energy Management System (EMS), and an Energy Storage System (ESS). The power electronic converters are used to couple the motor with the battery stack. Including a DC/DC converter in the powertrain module is favored as it adds an additional degree of freedom to achieve flexibility in optimizing the battery module and inverter independently. However, it is essential that the converter is rated for high peak power and can maintain high efficiency while operating over a wide range of load conditions to not compromise on system efficiency. Additionally, the converter must strictly adhere to all automotive standards.
Currently, several hard-switching topologies have been employed such as conventional boost DC/DC, interleaved step-up DC/DC, and full-bridge DC/DC converter. These converters face respective limitations in achieving high step-up conversion ratio, size and weight issues, or high component count. In this work, a bi-directional synchronous boost DC/DC converter with easy interleaving capability is proposed with a novel ZVT mechanism. This converter steps up the EV battery voltage of 200V-300V to a wide range of variable output voltages ranging from 310V-800V. High power density and efficiency are achieved through high switching frequency of 250kHz for each phase with effective frequency doubling through interleaving. Also, use of wide bandgap high voltage SiC switches allows high efficiency operation even at high temperatures.
Comprehensive analysis, design details and extensive simulation results are presented. Incorporating ZVT branch with adaptive time delay results in converter efficiency close to 98%. Experimental results from a 2.5kW hardware prototype validate the performance of the proposed approach. A peak efficiency of 98.17% has been observed in hardware in the boost or motoring mode.
Currently, several hard-switching topologies have been employed such as conventional boost DC/DC, interleaved step-up DC/DC, and full-bridge DC/DC converter. These converters face respective limitations in achieving high step-up conversion ratio, size and weight issues, or high component count. In this work, a bi-directional synchronous boost DC/DC converter with easy interleaving capability is proposed with a novel ZVT mechanism. This converter steps up the EV battery voltage of 200V-300V to a wide range of variable output voltages ranging from 310V-800V. High power density and efficiency are achieved through high switching frequency of 250kHz for each phase with effective frequency doubling through interleaving. Also, use of wide bandgap high voltage SiC switches allows high efficiency operation even at high temperatures.
Comprehensive analysis, design details and extensive simulation results are presented. Incorporating ZVT branch with adaptive time delay results in converter efficiency close to 98%. Experimental results from a 2.5kW hardware prototype validate the performance of the proposed approach. A peak efficiency of 98.17% has been observed in hardware in the boost or motoring mode.
ContributorsMullangi Chenchu, Hemanth (Author) / Ayyanar, Raja (Thesis advisor) / Qin, Jiangchao (Committee member) / Lei, Qin (Committee member) / Arizona State University (Publisher)
Created2018
Description
Over the years, the growing penetration of renewable energy into the electricity market has resulted in a significant change in the electricity market price. This change makes the existing forecasting method prone to error, decreasing the economic benefits. Hence, more precise forecasting methods need to be developed. This paper starts with a survey and benchmark of existing machine learning approaches for forecasting the real-time market (RTM) price. While these methods provide sufficient modeling capability via supervised learning, their accuracy is still limited due to the single data source, e.g., historical price information only. In this paper, a novel two-stage supervised learning approach is proposed by diversifying the data sources such as highly correlated power data. This idea is inspired by the recent load forecasting methods that have shown extremely well performances. Specifically, the proposed two-stage method, namely the rerouted method, learns two types of mapping rules. The first one is the mapping between the historical wind power and the historical price. The second is the forecasting rule for wind generation. Based on the two rules, we forecast the price via the forecasted generation and the first learned mapping between power and price. Additionally, we observed that it is not the more training data the better, leading to our validation steps to quantify the best training intervals for different datasets. We conduct comparisons of numerical results between existing methods and the proposed methods based on datasets from the Electric Reliability Council of Texas (ERCOT). For each machine learning step, we examine different learning methods, such as polynomial regression, support vector regression, neural network, and deep neural network. The results show that the proposed method is significantly better than existing approaches when renewables are involved.
ContributorsLuo, Shuman (Author) / Weng, Yang (Thesis advisor) / Lei, Qin (Committee member) / Qin, Jiangchao (Committee member) / Arizona State University (Publisher)
Created2019
Description
Nanolaminate materials are layered composites with layer thickness ≤ 100 nm. They exhibit unique properties due to their small length scale, the presence of a high number of interfaces and the effect of imposed constraint. This thesis focuses on the mechanical behavior of Al/SiC nanolaminates. The high strength of ceramics combined with the ductility of Al makes this combination desirable. Al/SiC nanolaminates were synthesized through magnetron sputtering and have an overall thickness of ~ 20 μm which limits the characterization techniques to microscale testing methods. A large amount of work has already been done towards evaluating their mechanical properties under indentation loading and micropillar compression. The effects of temperature, orientation and layer thickness have been well established. Al/SiC nanolaminates exhibited a flaw dependent deformation, anisotropy with respect to loading direction and strengthening due to imposed constraint. However, the mechanical behavior of nanolaminates under tension and fatigue loading has not yet been studied which is critical for obtaining a complete understanding of their deformation behavior. This thesis fills this gap and presents experiments which were conducted to gain an insight into the behavior of nanolaminates under tensile and cyclic loading. The effect of layer thickness, tension-compression asymmetry and effect of a wavy microstructure on mechanical response have been presented. Further, results on in situ micropillar compression using lab-based X-ray microscope through novel experimental design are also presented. This was the first time when a resolution of 50 nms was achieved during in situ micropillar compression in a lab-based setup. Pores present in the microstructure were characterized in 3D and sites of damage initiation were correlated with the channel of pores present in the microstructure.
The understanding of these deformation mechanisms paved way for the development of co-sputtered Al/SiC composites. For these composites, Al and SiC were sputtered together in a layer. The effect of change in the atomic fraction of SiC on the microstructure and mechanical properties were evaluated. Extensive microstructural characterization was performed at the nanoscale level and Al nanocrystalline aggregates were observed dispersed in an amorphous matrix. The modulus and hardness of co- sputtered composites were much higher than their traditional counterparts owing to denser atomic packing and the absence of synthesis induced defects such as pores and columnar boundaries.
The understanding of these deformation mechanisms paved way for the development of co-sputtered Al/SiC composites. For these composites, Al and SiC were sputtered together in a layer. The effect of change in the atomic fraction of SiC on the microstructure and mechanical properties were evaluated. Extensive microstructural characterization was performed at the nanoscale level and Al nanocrystalline aggregates were observed dispersed in an amorphous matrix. The modulus and hardness of co- sputtered composites were much higher than their traditional counterparts owing to denser atomic packing and the absence of synthesis induced defects such as pores and columnar boundaries.
ContributorsSingh, Somya (Author) / Chawla, Nikhilesh (Thesis advisor) / Neithalath, Narayanan (Committee member) / Jiao, Yang (Committee member) / Mara, Nathan (Committee member) / Arizona State University (Publisher)
Created2018
Description
Switching surges are a common type of phenomenon that occur on any sort of power system network. These are more pronounced on long transmission lines and in high voltage substations. The problem with switching surges is encountered when a lot of power is transmitted across a transmission line
etwork, typically from a concentrated generation node to a concentrated load. The problem becomes significantly worse when the transmission line is long and when the voltage levels are high, typically above 400 kV. These overvoltage transients occur following any type of switching action such as breaker operation, fault occurrence/clearance and energization, and they pose a very real danger to weakly interconnected systems. At EHV levels, the insulation coordination of such lines is mainly dictated by the peak level of switching surges, the most dangerous of which include three phase line energization and single-phase reclosing. Switching surges can depend on a number of independent and inter-dependent factors like voltage level, line length, tower construction, location along the line, and presence of other equipment like shunt/series reactors and capacitors.
This project discusses the approaches taken and methods applied to observe and tackle the problems associated with switching surges on a long transmission line. A detailed discussion pertaining to different aspects of switching surges and their effects is presented with results from various studies published in IEEE journals and conference papers. Then a series of simulations are presented to determine an arrangement of substation equipment with respect to incoming transmission lines; that correspond to the lowest surge levels at that substation.
etwork, typically from a concentrated generation node to a concentrated load. The problem becomes significantly worse when the transmission line is long and when the voltage levels are high, typically above 400 kV. These overvoltage transients occur following any type of switching action such as breaker operation, fault occurrence/clearance and energization, and they pose a very real danger to weakly interconnected systems. At EHV levels, the insulation coordination of such lines is mainly dictated by the peak level of switching surges, the most dangerous of which include three phase line energization and single-phase reclosing. Switching surges can depend on a number of independent and inter-dependent factors like voltage level, line length, tower construction, location along the line, and presence of other equipment like shunt/series reactors and capacitors.
This project discusses the approaches taken and methods applied to observe and tackle the problems associated with switching surges on a long transmission line. A detailed discussion pertaining to different aspects of switching surges and their effects is presented with results from various studies published in IEEE journals and conference papers. Then a series of simulations are presented to determine an arrangement of substation equipment with respect to incoming transmission lines; that correspond to the lowest surge levels at that substation.
ContributorsShaikh, Mohammed Mubashir (Author) / Qin, Jiangchao (Thesis advisor) / Heydt, Gerald T (Committee member) / Lei, Qin (Committee member) / Arizona State University (Publisher)
Created2018