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The objective of this thesis was to compare various approaches for classification of the `good' and `bad' parts via non-destructive resonance testing methods by collecting and analyzing experimental data in the frequency and time domains. A Laser Scanning Vibrometer was employed to measure vibrations samples in order to determine the

The objective of this thesis was to compare various approaches for classification of the `good' and `bad' parts via non-destructive resonance testing methods by collecting and analyzing experimental data in the frequency and time domains. A Laser Scanning Vibrometer was employed to measure vibrations samples in order to determine the spectral characteristics such as natural frequencies and amplitudes. Statistical pattern recognition tools such as Hilbert Huang, Fisher's Discriminant, and Neural Network were used to identify and classify the unknown samples whether they are defective or not. In this work, a Finite Element Analysis software packages (ANSYS 13.0 and NASTRAN NX8.0) was used to obtain estimates of resonance frequencies in `good' and `bad' samples. Furthermore, a system identification approach was used to generate Auto-Regressive-Moving Average with exogenous component, Box-Jenkins, and Output Error models from experimental data that can be used for classification
ContributorsJameel, Osama (Author) / Redkar, Sangram (Thesis advisor) / Arizona State University (Publisher)
Created2013
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Description
For decades, microelectronics manufacturing has been concerned with failures related to electromigration phenomena in conductors experiencing high current densities. The influence of interconnect microstructure on device failures related to electromigration in BGA and flip chip solder interconnects has become a significant interest with reduced individual solder interconnect volumes. A survey

For decades, microelectronics manufacturing has been concerned with failures related to electromigration phenomena in conductors experiencing high current densities. The influence of interconnect microstructure on device failures related to electromigration in BGA and flip chip solder interconnects has become a significant interest with reduced individual solder interconnect volumes. A survey indicates that x-ray computed micro-tomography (µXCT) is an emerging, novel means for characterizing the microstructures' role in governing electromigration failures. This work details the design and construction of a lab-scale µXCT system to characterize electromigration in the Sn-0.7Cu lead-free solder system by leveraging in situ imaging.

In order to enhance the attenuation contrast observed in multi-phase material systems, a modeling approach has been developed to predict settings for the controllable imaging parameters which yield relatively high detection rates over the range of x-ray energies for which maximum attenuation contrast is expected in the polychromatic x-ray imaging system. In order to develop this predictive tool, a model has been constructed for the Bremsstrahlung spectrum of an x-ray tube, and calculations for the detector's efficiency over the relevant range of x-ray energies have been made, and the product of emitted and detected spectra has been used to calculate the effective x-ray imaging spectrum. An approach has also been established for filtering `zinger' noise in x-ray radiographs, which has proven problematic at high x-ray energies used for solder imaging. The performance of this filter has been compared with a known existing method and the results indicate a significant increase in the accuracy of zinger filtered radiographs.

The obtained results indicate the conception of a powerful means for the study of failure causing processes in solder systems used as interconnects in microelectronic packaging devices. These results include the volumetric quantification of parameters which are indicative of both electromigration tolerance of solders and the dominant mechanisms for atomic migration in response to current stressing. This work is aimed to further the community's understanding of failure-causing electromigration processes in industrially relevant material systems for microelectronic interconnect applications and to advance the capability of available characterization techniques for their interrogation.
ContributorsMertens, James Charles Edwin (Author) / Chawla, Nikhilesh (Thesis advisor) / Alford, Terry (Committee member) / Jiao, Yang (Committee member) / Neithalath, Narayanan (Committee member) / Arizona State University (Publisher)
Created2015
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Description
In this dissertation, the results of our comprehensive computational studies of disordered jammed (i.e., mechanically stable) packings of hard particles are presented, including the family of superdisks in 2D and ellipsoids in 3D Euclidean space. Following a very brief introduction to the hard-particle systems, the event driven molecular dynamics (EDMD)

In this dissertation, the results of our comprehensive computational studies of disordered jammed (i.e., mechanically stable) packings of hard particles are presented, including the family of superdisks in 2D and ellipsoids in 3D Euclidean space. Following a very brief introduction to the hard-particle systems, the event driven molecular dynamics (EDMD) employed to generate the packing ensembles will be discussed. A large number of 2D packing configurations of superdisks are subsequently analyzed, through which a relatively accurate theoretical scheme for packing-fraction prediction based on local particle contact configurations is proposed and validated via additional numerical simulations. Moreover, the studies on binary ellipsoid packing in 3D are briefly discussed and the effects of different geometrical parameters on the final packing fraction are analyzed.
ContributorsXu, Yaopengxiao (Author) / Jiao, Yang (Thesis advisor) / Oswald, Jay (Committee member) / Liu, Yongming (Committee member) / Arizona State University (Publisher)
Created2014
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Description
The objective of this work is to develop a Stop-Rotor Multimode UAV. This UAV is capable of vertical take-off and landing like a helicopter and can convert from a helicopter mode to an airplane mode in mid-flight. Thus, this UAV can hover as a helicopter and achieve high mission range

The objective of this work is to develop a Stop-Rotor Multimode UAV. This UAV is capable of vertical take-off and landing like a helicopter and can convert from a helicopter mode to an airplane mode in mid-flight. Thus, this UAV can hover as a helicopter and achieve high mission range of an airplane. The stop-rotor concept implies that in mid-flight the lift generating helicopter rotor stops and rotates the blades into airplane wings. The thrust in airplane mode is then provided by a pusher propeller. The aircraft configuration presents unique challenges in flight dynamics, modeling and control. In this thesis a mathematical model along with the design and simulations of a hover control will be presented. In addition, the discussion of the performance in fixed-wing flight, and the autopilot architecture of the UAV will be presented. Also presented, are some experimental "conversion" results where the Stop-Rotor aircraft was dropped from a hot air balloon and performed a successful conversion from helicopter to airplane mode.
ContributorsVargas-Clara, Alvaro (Author) / Redkar, Sangram (Thesis advisor) / Macia, Narciso (Committee member) / Rajadas, John (Committee member) / Arizona State University (Publisher)
Created2011
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Description
Brain Computer Interfaces are becoming the next generation controllers not only in the medical devices for disabled individuals but also in the gaming and entertainment industries. In order to build an effective Brain Computer Interface, which accurately translates the user thoughts into machine commands, it is important to have robust

Brain Computer Interfaces are becoming the next generation controllers not only in the medical devices for disabled individuals but also in the gaming and entertainment industries. In order to build an effective Brain Computer Interface, which accurately translates the user thoughts into machine commands, it is important to have robust and fail proof signal processing and machine learning modules which operate on the raw EEG signals and estimate the current thought of the user.

In this thesis, several techniques used to perform EEG signal pre-processing, feature extraction and signal classification have been discussed, implemented, validated and verified; efficient supervised machine learning models, for the EEG motor imagery signal classification are identified. To further improve the performance of system unsupervised feature learning techniques have been investigated by pre-training the Deep Learning models. Use of pre-training stacked autoencoders have been proposed to solve the problems caused by random initialization of weights in neural networks.

Motor Imagery (imaginary hand and leg movements) signals are acquire using the Emotiv EEG headset. Different kinds of features like mean signal, band powers, RMS of the signal have been extracted and supplied to the machine learning (ML) stage, wherein, several ML techniques like LDA, KNN, SVM, Logistic regression and Neural Networks are applied and validated. During the validation phase the performances of various techniques are compared and some important observations are reported. Further, deep Learning techniques like autoencoding have been used to perform unsupervised feature learning. The reliability of the features is analyzed by performing classification by using the ML techniques mentioned earlier. The performance of the neural networks has been further improved by pre-training the network in an unsupervised fashion using stacked autoencoders and supplying the stacked autoencoders’ network parameters as initial parameters to the neural network. All the findings in this research, during each phase (pre-processing, feature extraction, classification) are directly relevant and can be used by the BCI research community for building motor imagery based BCI applications.

Additionally, this thesis attempts to develop, test, and compare the performance of an alternative method for classifying human driving behavior. This thesis proposes the use of driver affective states to know the driving behavior. The purpose of this part of the thesis was to classify the EEG data collected from several subjects while driving simulated vehicle and compare the classification results with those obtained by classifying the driving behavior using vehicle parameters collected simultaneously from all the subjects. The objective here is to see if the drivers’ mental state is reflected in his driving behavior.
ContributorsManchala, Vamsi Krishna (Author) / Redkar, Sangram (Thesis advisor) / Rogers, Bradley (Committee member) / Sugar, Thomas (Committee member) / Arizona State University (Publisher)
Created2015
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Description
In this dissertation, three complex material systems including a novel class of hyperuniform composite materials, cellularized collagen gel and low melting point alloy (LMPA) composite are investigated, using statistical pattern characterization, stochastic microstructure reconstruction and micromechanical analysis. In Chapter 1, an introduction of this report is provided, in which a

In this dissertation, three complex material systems including a novel class of hyperuniform composite materials, cellularized collagen gel and low melting point alloy (LMPA) composite are investigated, using statistical pattern characterization, stochastic microstructure reconstruction and micromechanical analysis. In Chapter 1, an introduction of this report is provided, in which a brief review is made about these three material systems. In Chapter 2, detailed discussion of the statistical morphological descriptors and a stochastic optimization approach for microstructure reconstruction is presented. In Chapter 3, the lattice particle method for micromechanical analysis of complex heterogeneous materials is introduced. In Chapter 4, a new class of hyperuniform heterogeneous material with superior mechanical properties is investigated. In Chapter 5, a bio-material system, i.e., cellularized collagen gel is modeled using correlation functions and stochastic reconstruction to study the collective dynamic behavior of the embed tumor cells. In chapter 6, LMPA soft robotic system is generated by generalizing the correlation functions and the rigidity tunability of this smart composite is discussed. In Chapter 7, a future work plan is presented.
ContributorsXu, Yaopengxiao (Author) / Jiao, Yang (Thesis advisor) / Liu, Yongming (Committee member) / Wang, Qing Hua (Committee member) / Ren, Yi (Committee member) / Arizona State University (Publisher)
Created2018
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Description
The sensor industry is a growing industry that has been predicted by Allied Market Research to be a multi-billion industry by 2022. One of the many key drives behind this rapid growth in the sensor industry is the increase incorporation of sensors into portable electrical devices. The value

The sensor industry is a growing industry that has been predicted by Allied Market Research to be a multi-billion industry by 2022. One of the many key drives behind this rapid growth in the sensor industry is the increase incorporation of sensors into portable electrical devices. The value for sensor technologies are increased when the sensors are developed into innovative measuring system for application uses in the Aerospace, Defense, and Healthcare industries. While sensors are not new, their increased performance, size reduction, and decrease in cost has opened the door for innovative sensor combination for portable devices that could be worn or easily moved around. With this opportunity for further development of sensor use through concept engineering development, three concept projects for possible innovative portable devices was undertaken in this research. One project was the development of a pulse oximeter devise with fingerprint recognition. The second project was prototyping a portable Bluetooth strain gage monitoring system. The third project involved sensors being incorporated onto flexible printed circuit board (PCB) for improved comfort of wearable devices. All these systems were successfully tested in lab.
ContributorsNichols, Kevin William (Author) / Redkar, Sangram (Thesis advisor) / Rogers, Brad (Committee member) / Sugar, Thomas (Committee member) / Arizona State University (Publisher)
Created2018
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Description
Recent research and study have showed the potential of auto-parametric system in controlling stability and parametric resonance. In this project, two different designs for auto-parametrically excited mass-spring-damper systems were studied. The theoretical models were developed to describe the behavior of the systems, and simulation models were constructed to validate the

Recent research and study have showed the potential of auto-parametric system in controlling stability and parametric resonance. In this project, two different designs for auto-parametrically excited mass-spring-damper systems were studied. The theoretical models were developed to describe the behavior of the systems, and simulation models were constructed to validate the analytical results. The error between simulation and theoretical results was within 2%. Both theoretical and simulation results showed that the implementation of auto-parametric system could help reduce or amplify the resonance significantly.
ContributorsLe, Thao (Author) / Redkar, Sangram (Thesis advisor) / Sugar, Thomas (Committee member) / Rogers, Brad (Committee member) / Arizona State University (Publisher)
Created2018
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Description
Increasing density of microelectronic packages, results in an increase in thermal and mechanical stresses within the various layers of the package. To accommodate the high-performance demands, the materials used in the electronic package would also require improvement. Specifically, the damage that often occurs in solders that function as die-attachment and

Increasing density of microelectronic packages, results in an increase in thermal and mechanical stresses within the various layers of the package. To accommodate the high-performance demands, the materials used in the electronic package would also require improvement. Specifically, the damage that often occurs in solders that function as die-attachment and thermal interfaces need to be addressed. This work evaluates and characterizes thermo-mechanical damage in two material systems – Electroplated Tin and Sintered Nano-Silver solder.

Tin plated electrical contacts are prone to formation of single crystalline tin whiskers which can cause short circuiting. A mechanistic model of their formation, evolution and microstructural influence is still not fully understood. In this work, growth of mechanically induced tin whiskers/hillocks is studied using in situ Nano-indentation and Electron Backscatter Diffraction (EBSD). Electroplated tin was indented and monitored in vacuum to study growth of hillocks without the influence of atmosphere. Thermal aging was done to study the effect of intermetallic compounds. Grain orientation of the hillocks and the plastically deformed region surrounding the indent was studied using Focused Ion Beam (FIB) lift-out technique. In addition, micropillars were milled on the surface of electroplated Sn using FIB to evaluate the yield strength and its relation to Sn grain size.

High operating temperature power electronics use wide band-gap semiconductor devices (Silicon Carbide/Gallium Nitride). The operating temperature of these devices can exceed 250oC, preventing use of traditional Sn-solders as Thermal Interface materials (TIM). At high temperature, the thermomechanical stresses can severely degrade the reliability and life of the device. In this light, new non-destructive approach is needed to understand the damage mechanism when subjected to reliability tests such as thermal cycling. In this work, sintered nano-Silver was identified as a promising high temperature TIM. Sintered nano-Silver samples were fabricated and their shear strength was evaluated. Thermal cycling tests were conducted and damage evolution was characterized using a lab scale 3D X-ray system to periodically assess changes in the microstructure such as cracks, voids, and porosity in the TIM layer. The evolution of microstructure and the effect of cycling temperature during thermal cycling are discussed.
ContributorsLujan Regalado, Irene (Author) / Chawla, Nikhilesh (Thesis advisor) / Frear, Darrel (Committee member) / Rajagopalan, Jagannathan (Committee member) / Jiao, Yang (Committee member) / Arizona State University (Publisher)
Created2018
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Description
One type of assistive device for the blind has attempted to convert visual information into information that can be perceived through another sense, such as touch or hearing. A vibrotactile haptic display assistive device consists of an array of vibrating elements placed against the skin, allowing the blind individual to

One type of assistive device for the blind has attempted to convert visual information into information that can be perceived through another sense, such as touch or hearing. A vibrotactile haptic display assistive device consists of an array of vibrating elements placed against the skin, allowing the blind individual to receive visual information through touch. However, these approaches have two significant technical challenges: large vibration element size and the number of microcontroller pins required for vibration control, both causing excessively low resolution of the device. Here, I propose and investigate a type of high-resolution vibrotactile haptic display which overcomes these challenges by utilizing a ‘microbeam’ as the vibrating element. These microbeams can then be actuated using only one microcontroller pin connected to a speaker or surface transducer. This approach could solve the low-resolution problem currently present in all haptic displays. In this paper, the results of an investigation into the manufacturability of such a device, simulation of the vibrational characteristics, and prototyping and experimental validation of the device concept are presented. The possible reasons of the frequency shift between the result of the forced or free response of beams and the frequency calculated based on a lumped mass approximation are investigated. It is found that one of the important reasons for the frequency shift is the size effect, the dependency of the elastic modulus on the size and kind of material. This size effect on A2 tool steel for Micro-Meso scale cantilever beams for the proposed system is investigated.
ContributorsWi, Daehan (Author) / SODEMANN, ANGELA A (Thesis advisor) / Redkar, Sangram (Committee member) / McDaniel, Troy (Committee member) / Arizona State University (Publisher)
Created2019