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Description
To date, the most popular and dominant material for commercial solar cells is

crystalline silicon (or wafer-Si). It has the highest cell efficiency and cell lifetime out

of all commercial solar cells. Although the potential of crystalline-Si solar cells in

supplying energy demands is enormous, their future growth will likely be constrained

by two

To date, the most popular and dominant material for commercial solar cells is

crystalline silicon (or wafer-Si). It has the highest cell efficiency and cell lifetime out

of all commercial solar cells. Although the potential of crystalline-Si solar cells in

supplying energy demands is enormous, their future growth will likely be constrained

by two major bottlenecks. The first is the high electricity input to produce

crystalline-Si solar cells and modules, and the second is the limited supply of silver

(Ag) reserves. These bottlenecks prevent crystalline-Si solar cells from reaching

terawatt-scale deployment, which means the electricity produced by crystalline-Si

solar cells would never fulfill a noticeable portion of our energy demands in the future.

In order to solve the issue of Ag limitation for the front metal grid, aluminum (Al)

electroplating has been developed as an alternative metallization technique in the

fabrication of crystalline-Si solar cells. The plating is carried out in a

near-room-temperature ionic liquid by means of galvanostatic electrolysis. It has been

found that dense, adherent Al deposits with resistivity in the high 10^–6 ohm-cm range

can be reproducibly obtained directly on Si substrates and nickel seed layers. An

all-Al Si solar cell, with an electroplated Al front electrode and a screen-printed Al

back electrode, has been successfully demonstrated based on commercial p-type

monocrystalline-Si solar cells, and its efficiency is approaching 15%. Further

optimization of the cell fabrication process, in particular a suitable patterning

technique for the front silicon nitride layer, is expected to increase the efficiency of

the cell to ~18%. This shows the potential of Al electroplating in cell metallization is

promising and replacing Ag with Al as the front finger electrode is feasible.
ContributorsSun, Wen-Cheng (Author) / Tao, Meng (Thesis advisor) / Vasileska, Dragica (Committee member) / Yu, Hongbin (Committee member) / Goryll, Michael (Committee member) / Arizona State University (Publisher)
Created2016