This collection includes most of the ASU Theses and Dissertations from 2011 to present. ASU Theses and Dissertations are available in downloadable PDF format; however, a small percentage of items are under embargo. Information about the dissertations/theses includes degree information, committee members, an abstract, supporting data or media.

In addition to the electronic theses found in the ASU Digital Repository, ASU Theses and Dissertations can be found in the ASU Library Catalog.

Dissertations and Theses granted by Arizona State University are archived and made available through a joint effort of the ASU Graduate College and the ASU Libraries. For more information or questions about this collection contact or visit the Digital Repository ETD Library Guide or contact the ASU Graduate College at gradformat@asu.edu.

Displaying 1 - 10 of 202
Filtering by

Clear all filters

150025-Thumbnail Image.png
Description
With the increasing focus on developing environmentally benign electronic packages, lead-free solder alloys have received a great deal of attention. Mishandling of packages, during manufacture, assembly, or by the user may cause failure of solder joint. A fundamental understanding of the behavior of lead-free solders under mechanical shock conditions is

With the increasing focus on developing environmentally benign electronic packages, lead-free solder alloys have received a great deal of attention. Mishandling of packages, during manufacture, assembly, or by the user may cause failure of solder joint. A fundamental understanding of the behavior of lead-free solders under mechanical shock conditions is lacking. Reliable experimental and numerical analysis of lead-free solder joints in the intermediate strain rate regime need to be investigated. This dissertation mainly focuses on exploring the mechanical shock behavior of lead-free tin-rich solder alloys via multiscale modeling and numerical simulations. First, the macroscopic stress/strain behaviors of three bulk lead-free tin-rich solders were tested over a range of strain rates from 0.001/s to 30/s. Finite element analysis was conducted to determine appropriate specimen geometry that could reach a homogeneous stress/strain field and a relatively high strain rate. A novel self-consistent true stress correction method is developed to compensate the inaccuracy caused by the triaxial stress state at the post-necking stage. Then the material property of micron-scale intermetallic was examined by micro-compression test. The accuracy of this measure is systematically validated by finite element analysis, and empirical adjustments are provided. Moreover, the interfacial property of the solder/intermetallic interface is investigated, and a continuum traction-separation law of this interface is developed from an atomistic-based cohesive element method. The macroscopic stress/strain relation and microstructural properties are combined together to form a multiscale material behavior via a stochastic approach for both solder and intermetallic. As a result, solder is modeled by porous plasticity with random voids, and intermetallic is characterized as brittle material with random vulnerable region. Thereafter, the porous plasticity fracture of the solders and the brittle fracture of the intermetallics are coupled together in one finite element model. Finally, this study yields a multiscale model to understand and predict the mechanical shock behavior of lead-free tin-rich solder joints. Different fracture patterns are observed for various strain rates and/or intermetallic thicknesses. The predictions have a good agreement with the theory and experiments.
ContributorsFei, Huiyang (Author) / Jiang, Hanqing (Thesis advisor) / Chawla, Nikhilesh (Thesis advisor) / Tasooji, Amaneh (Committee member) / Mobasher, Barzin (Committee member) / Rajan, Subramaniam D. (Committee member) / Arizona State University (Publisher)
Created2011
149977-Thumbnail Image.png
Description
Reliable extraction of human pose features that are invariant to view angle and body shape changes is critical for advancing human movement analysis. In this dissertation, the multifactor analysis techniques, including the multilinear analysis and the multifactor Gaussian process methods, have been exploited to extract such invariant pose features from

Reliable extraction of human pose features that are invariant to view angle and body shape changes is critical for advancing human movement analysis. In this dissertation, the multifactor analysis techniques, including the multilinear analysis and the multifactor Gaussian process methods, have been exploited to extract such invariant pose features from video data by decomposing various key contributing factors, such as pose, view angle, and body shape, in the generation of the image observations. Experimental results have shown that the resulting pose features extracted using the proposed methods exhibit excellent invariance properties to changes in view angles and body shapes. Furthermore, using the proposed invariant multifactor pose features, a suite of simple while effective algorithms have been developed to solve the movement recognition and pose estimation problems. Using these proposed algorithms, excellent human movement analysis results have been obtained, and most of them are superior to those obtained from state-of-the-art algorithms on the same testing datasets. Moreover, a number of key movement analysis challenges, including robust online gesture spotting and multi-camera gesture recognition, have also been addressed in this research. To this end, an online gesture spotting framework has been developed to automatically detect and learn non-gesture movement patterns to improve gesture localization and recognition from continuous data streams using a hidden Markov network. In addition, the optimal data fusion scheme has been investigated for multicamera gesture recognition, and the decision-level camera fusion scheme using the product rule has been found to be optimal for gesture recognition using multiple uncalibrated cameras. Furthermore, the challenge of optimal camera selection in multi-camera gesture recognition has also been tackled. A measure to quantify the complementary strength across cameras has been proposed. Experimental results obtained from a real-life gesture recognition dataset have shown that the optimal camera combinations identified according to the proposed complementary measure always lead to the best gesture recognition results.
ContributorsPeng, Bo (Author) / Qian, Gang (Thesis advisor) / Ye, Jieping (Committee member) / Li, Baoxin (Committee member) / Spanias, Andreas (Committee member) / Arizona State University (Publisher)
Created2011
149993-Thumbnail Image.png
Description
Many products undergo several stages of testing ranging from tests on individual components to end-item tests. Additionally, these products may be further "tested" via customer or field use. The later failure of a delivered product may in some cases be due to circumstances that have no correlation with the product's

Many products undergo several stages of testing ranging from tests on individual components to end-item tests. Additionally, these products may be further "tested" via customer or field use. The later failure of a delivered product may in some cases be due to circumstances that have no correlation with the product's inherent quality. However, at times, there may be cues in the upstream test data that, if detected, could serve to predict the likelihood of downstream failure or performance degradation induced by product use or environmental stresses. This study explores the use of downstream factory test data or product field reliability data to infer data mining or pattern recognition criteria onto manufacturing process or upstream test data by means of support vector machines (SVM) in order to provide reliability prediction models. In concert with a risk/benefit analysis, these models can be utilized to drive improvement of the product or, at least, via screening to improve the reliability of the product delivered to the customer. Such models can be used to aid in reliability risk assessment based on detectable correlations between the product test performance and the sources of supply, test stands, or other factors related to product manufacture. As an enhancement to the usefulness of the SVM or hyperplane classifier within this context, L-moments and the Western Electric Company (WECO) Rules are used to augment or replace the native process or test data used as inputs to the classifier. As part of this research, a generalizable binary classification methodology was developed that can be used to design and implement predictors of end-item field failure or downstream product performance based on upstream test data that may be composed of single-parameter, time-series, or multivariate real-valued data. Additionally, the methodology provides input parameter weighting factors that have proved useful in failure analysis and root cause investigations as indicators of which of several upstream product parameters have the greater influence on the downstream failure outcomes.
ContributorsMosley, James (Author) / Morrell, Darryl (Committee member) / Cochran, Douglas (Committee member) / Papandreou-Suppappola, Antonia (Committee member) / Roberts, Chell (Committee member) / Spanias, Andreas (Committee member) / Arizona State University (Publisher)
Created2011
150035-Thumbnail Image.png
Description
Concrete columns constitute the fundamental supports of buildings, bridges, and various other infrastructures, and their failure could lead to the collapse of the entire structure. As such, great effort goes into improving the fire resistance of such columns. In a time sensitive fire situation, a delay in the failure of

Concrete columns constitute the fundamental supports of buildings, bridges, and various other infrastructures, and their failure could lead to the collapse of the entire structure. As such, great effort goes into improving the fire resistance of such columns. In a time sensitive fire situation, a delay in the failure of critical load bearing structures can lead to an increase in time allowed for the evacuation of occupants, recovery of property, and access to the fire. Much work has been done in improving the structural performance of concrete including reducing column sizes and providing a safer structure. As a result, high-strength (HS) concrete has been developed to fulfill the needs of such improvements. HS concrete varies from normal-strength (NS) concrete in that it has a higher stiffness, lower permeability and larger durability. This, unfortunately, has resulted in poor performance under fire. The lower permeability allows for water vapor to build up causing HS concrete to suffer from explosive spalling under rapid heating. In addition, the coefficient of thermal expansion (CTE) of HS concrete is lower than that of NS concrete. In this study, the effects of introducing a region of crumb rubber concrete into a steel-reinforced concrete column were analyzed. The inclusion of crumb rubber concrete into a column will greatly increase the thermal resistivity of the overall column, leading to a reduction in core temperature as well as the rate at which the column is heated. Different cases were analyzed while varying the positioning of the crumb-rubber region to characterize the effect of position on the improvement of fire resistance. Computer simulated finite element analysis was used to calculate the temperature and strain distribution with time across the column's cross-sectional area with specific interest in the steel - concrete region. Of the several cases which were investigated, it was found that the improvement of time before failure ranged between 32 to 45 minutes.
ContributorsZiadeh, Bassam Mohammed (Author) / Phelan, Patrick (Thesis advisor) / Kaloush, Kamil (Thesis advisor) / Jiang, Hanqing (Committee member) / Arizona State University (Publisher)
Created2011
149780-Thumbnail Image.png
Description
The demand for handheld portable computing in education, business and research has resulted in advanced mobile devices with powerful processors and large multi-touch screens. Such devices are capable of handling tasks of moderate computational complexity such as word processing, complex Internet transactions, and even human motion analysis. Apple's iOS devices,

The demand for handheld portable computing in education, business and research has resulted in advanced mobile devices with powerful processors and large multi-touch screens. Such devices are capable of handling tasks of moderate computational complexity such as word processing, complex Internet transactions, and even human motion analysis. Apple's iOS devices, including the iPhone, iPod touch and the latest in the family - the iPad, are among the well-known and widely used mobile devices today. Their advanced multi-touch interface and improved processing power can be exploited for engineering and STEM demonstrations. Moreover, these devices have become a part of everyday student life. Hence, the design of exciting mobile applications and software represents a great opportunity to build student interest and enthusiasm in science and engineering. This thesis presents the design and implementation of a portable interactive signal processing simulation software on the iOS platform. The iOS-based object-oriented application is called i-JDSP and is based on the award winning Java-DSP concept. It is implemented in Objective-C and C as a native Cocoa Touch application that can be run on any iOS device. i-JDSP offers basic signal processing simulation functions such as Fast Fourier Transform, filtering, spectral analysis on a compact and convenient graphical user interface and provides a very compelling multi-touch programming experience. Built-in modules also demonstrate concepts such as the Pole-Zero Placement. i-JDSP also incorporates sound capture and playback options that can be used in near real-time analysis of speech and audio signals. All simulations can be visually established by forming interactive block diagrams through multi-touch and drag-and-drop. Computations are performed on the mobile device when necessary, making the block diagram execution fast. Furthermore, the extensive support for user interactivity provides scope for improved learning. The results of i-JDSP assessment among senior undergraduate and first year graduate students revealed that the software created a significant positive impact and increased the students' interest and motivation and in understanding basic DSP concepts.
ContributorsLiu, Jinru (Author) / Spanias, Andreas (Thesis advisor) / Tsakalis, Kostas (Committee member) / Qian, Gang (Committee member) / Arizona State University (Publisher)
Created2011
150405-Thumbnail Image.png
Description
Infant mortality rate of field deployed photovoltaic (PV) modules may be expected to be higher than that estimated by standard qualification tests. The reason for increased failure rates may be attributed to the high system voltages. High voltages (HV) in grid connected modules induce additional stress factors that cause new

Infant mortality rate of field deployed photovoltaic (PV) modules may be expected to be higher than that estimated by standard qualification tests. The reason for increased failure rates may be attributed to the high system voltages. High voltages (HV) in grid connected modules induce additional stress factors that cause new degradation mechanisms. These new degradation mechanisms are not recognized by qualification stress tests. To study and model the effect of high system voltages, recently, potential induced degradation (PID) test method has been introduced. Using PID studies, it has been reported that high voltage failure rates are essentially due to increased leakage currents from active semiconducting layer to the grounded module frame, through encapsulant and/or glass. This project involved designing and commissioning of a new PID test bed at Photovoltaic Reliability Laboratory (PRL) of Arizona State University (ASU) to study the mechanisms of HV induced degradation. In this study, PID stress tests have been performed on accelerated stress modules, in addition to fresh modules of crystalline silicon technology. Accelerated stressing includes thermal cycling (TC200 cycles) and damp heat (1000 hours) tests as per IEC 61215. Failure rates in field deployed modules that are exposed to long term weather conditions are better simulated by conducting HV tests on prior accelerated stress tested modules. The PID testing was performed in 3 phases on a set of 5 mono crystalline silicon modules. In Phase-I of PID test, a positive bias of +600 V was applied, between shorted leads and frame of each module, on 3 modules with conducting carbon coating on glass superstrate. The 3 module set was comprised of: 1 fresh control, TC200 and DH1000. The PID test was conducted in an environmental chamber by stressing the modules at 85°C, for 35 hours with an intermittent evaluation for Arrhenius effects. In the Phase-II, a negative bias of -600 V was applied on a set of 3 modules in the chamber as defined above. The 3 module set in phase-II was comprised of: control module from phase-I, TC200 and DH1000. In the Phase-III, the same set of 3 modules which were used in the phase-II again subjected to +600 V bias to observe the recovery of lost power during the Phase-II. Electrical performance, infrared (IR) and electroluminescence (EL) were done prior and post PID testing. It was observed that high voltage positive bias in the first phase resulted in little
o power loss, high voltage negative bias in the second phase caused significant power loss and the high voltage positive bias in the third phase resulted in major recovery of lost power.
ContributorsGoranti, Sandhya (Author) / Tamizhmani, Govindasamy (Thesis advisor) / Rogers, Bradley (Committee member) / Macia, Narciso (Committee member) / Arizona State University (Publisher)
Created2011
150380-Thumbnail Image.png
Description
Great advances have been made in the construction of photovoltaic (PV) cells and modules, but array level management remains much the same as it has been in previous decades. Conventionally, the PV array is connected in a fixed topology which is not always appropriate in the presence of faults in

Great advances have been made in the construction of photovoltaic (PV) cells and modules, but array level management remains much the same as it has been in previous decades. Conventionally, the PV array is connected in a fixed topology which is not always appropriate in the presence of faults in the array, and varying weather conditions. With the introduction of smarter inverters and solar modules, the data obtained from the photovoltaic array can be used to dynamically modify the array topology and improve the array power output. This is beneficial especially when module mismatches such as shading, soiling and aging occur in the photovoltaic array. This research focuses on the topology optimization of PV arrays under shading conditions using measurements obtained from a PV array set-up. A scheme known as topology reconfiguration method is proposed to find the optimal array topology for a given weather condition and faulty module information. Various topologies such as the series-parallel (SP), the total cross-tied (TCT), the bridge link (BL) and their bypassed versions are considered. The topology reconfiguration method compares the efficiencies of the topologies, evaluates the percentage gain in the generated power that would be obtained by reconfiguration of the array and other factors to find the optimal topology. This method is employed for various possible shading patterns to predict the best topology. The results demonstrate the benefit of having an electrically reconfigurable array topology. The effects of irradiance and shading on the array performance are also studied. The simulations are carried out using a SPICE simulator. The simulation results are validated with the experimental data provided by the PACECO Company.
ContributorsBuddha, Santoshi Tejasri (Author) / Spanias, Andreas (Thesis advisor) / Tepedelenlioğlu, Cihan (Thesis advisor) / Zhang, Junshan (Committee member) / Arizona State University (Publisher)
Created2011
150385-Thumbnail Image.png
Description
In nearly all commercially successful internal combustion engine applications, the slider crank mechanism is used to convert the reciprocating motion of the piston into rotary motion. The hypocycloid mechanism, wherein the crankshaft is replaced with a novel gearing arrangement, is a viable alternative to the slider crank mechanism. The geared

In nearly all commercially successful internal combustion engine applications, the slider crank mechanism is used to convert the reciprocating motion of the piston into rotary motion. The hypocycloid mechanism, wherein the crankshaft is replaced with a novel gearing arrangement, is a viable alternative to the slider crank mechanism. The geared hypocycloid mechanism allows for linear motion of the connecting rod and provides a method for perfect balance with any number of cylinders including single cylinder applications. A variety of hypocycloid engine designs and research efforts have been undertaken and produced successful running prototypes. Wiseman Technologies, Inc provided one of these prototypes to this research effort. This two-cycle 30cc half crank hypocycloid engine has shown promise in several performance categories including balance and efficiency. To further investigate its potential a more thorough and scientific analysis was necessary and completed in this research effort. The major objective of the research effort was to critically evaluate and optimize the Wiseman prototype for maximum performance in balance, efficiency, and power output. A nearly identical slider crank engine was used extensively to establish baseline performance data and make comparisons. Specialized equipment and methods were designed and built to collect experimental data on both engines. Simulation and mathematical models validated by experimental data collection were used to better quantify performance improvements. Modifications to the Wiseman prototype engine improved balance by 20 to 50% (depending on direction) and increased peak power output by 24%.
ContributorsConner, Thomas (Author) / Redkar, Sangram (Thesis advisor) / Rogers, Bradley (Committee member) / Georgeou, Trian (Committee member) / Arizona State University (Publisher)
Created2011
150342-Thumbnail Image.png
Description
Building Applied Photovoltaics (BAPV) form an essential part of today's solar economy. This thesis is an effort to compare and understand the effect of fan cooling on the temperature of rooftop photovoltaic (PV) modules by comparing two side-by-side arrays (test array and control array) under identical ambient conditions of irradiance,

Building Applied Photovoltaics (BAPV) form an essential part of today's solar economy. This thesis is an effort to compare and understand the effect of fan cooling on the temperature of rooftop photovoltaic (PV) modules by comparing two side-by-side arrays (test array and control array) under identical ambient conditions of irradiance, air temperature, wind speed and wind direction. The lower operating temperature of PV modules due to fan operation mitigates array non uniformity and improves on performance. A crystalline silicon (c-Si) PV module has a light to electrical conversion efficiency of 14-20%. So on a cool sunny day with incident solar irradiance of 1000 W/m2, a PV module with 15% efficiency, will produce about only 150 watts. The rest of the energy is primarily lost in the form of heat. Heat extraction methods for BAPV systems may become increasingly higher in demand as the hot stagnant air underneath the array can be extracted to improve the array efficiency and the extracted low-temperature heat can also be used for residential space heating and water heating. Poly c-Si modules experience a negative temperature coefficient of power at about -0.5% /o C. A typical poly c-Si module would experience power loss due to elevation in temperature, which may be in the range of 25 to 30% for desert conditions such as that of Mesa, Arizona. This thesis investigates the effect of fan cooling on the previously developed thermal models at Arizona State University and on the performance of PV modules/arrays. Ambient conditions are continuously monitored and collected to calculate module temperature using the thermal model and to compare with actually measured temperature of individual modules. Including baseline analysis, the thesis has also looked into the effect of fan on the test array in three stages of 14 continuous days each. Multiple Thermal models are developed in order to identify the effect of fan cooling on performance and temperature uniformity. Although the fan did not prove to have much significant cooling effect on the system, but when combined with wind blocks it helped improve the thermal mismatch both under low and high wind speed conditions.
ContributorsChatterjee, Saurabh (Author) / Tamizhmani, Govindasamy (Thesis advisor) / Rogers, Bradley (Committee member) / Macia, Narciso (Committee member) / Arizona State University (Publisher)
Created2011
150419-Thumbnail Image.png
Description
Pb-free solders are used as interconnects in various levels of micro-electronic packaging. Reliability of these interconnects is very critical for the performance of the package. One of the main factors affecting the reliability of solder joints is the presence of porosity which is introduced during processing of the joints. In

Pb-free solders are used as interconnects in various levels of micro-electronic packaging. Reliability of these interconnects is very critical for the performance of the package. One of the main factors affecting the reliability of solder joints is the presence of porosity which is introduced during processing of the joints. In this thesis, the effect of such porosity on the deformation behavior and eventual failure of the joints is studied using Finite Element (FE) modeling technique. A 3D model obtained by reconstruction of x-ray tomographic image data is used as input for FE analysis to simulate shear deformation and eventual failure of the joint using ductile damage model. The modeling was done in ABAQUS (v 6.10). The FE model predictions are validated with experimental results by comparing the deformation of the pores and the crack path as predicted by the model with the experimentally observed deformation and failure pattern. To understand the influence of size, shape, and distribution of pores on the mechanical behavior of the joint four different solder joints with varying degrees of porosity are modeled using the validated FE model. The validation technique mentioned above enables comparison of the simulated and actual deformation only. A more robust way of validating the FE model would be to compare the strain distribution in the joint as predicted by the model and as observed experimentally. In this study, to enable visualization of the experimental strain for the 3D microstructure obtained from tomography, a three dimensional digital image correlation (3D DIC) code has been implemented in MATLAB (MathWorks Inc). This developed 3D DIC code can be used as another tool to verify the numerical model predictions. The capability of the developed code in measuring local displacement and strain is demonstrated by considering a test case.
ContributorsJakkali, Vaidehi (Author) / Chawla, Nikhilesh K (Thesis advisor) / Jiang, Hanqing (Committee member) / Solanki, Kiran (Committee member) / Arizona State University (Publisher)
Created2011