ASU Electronic Theses and Dissertations
This collection includes most of the ASU Theses and Dissertations from 2011 to present. ASU Theses and Dissertations are available in downloadable PDF format; however, a small percentage of items are under embargo. Information about the dissertations/theses includes degree information, committee members, an abstract, supporting data or media.
In addition to the electronic theses found in the ASU Digital Repository, ASU Theses and Dissertations can be found in the ASU Library Catalog.
Dissertations and Theses granted by Arizona State University are archived and made available through a joint effort of the ASU Graduate College and the ASU Libraries. For more information or questions about this collection contact or visit the Digital Repository ETD Library Guide or contact the ASU Graduate College at gradformat@asu.edu.
Displaying 41 - 43 of 43
Filtering by
- Creators: Chawla, Nikhilesh
Description
Miniaturization of microdevices comes at the cost of increased circuit complexity and operating current densities. At high current densities, the resulting electron wind imparts a large momentum to metal ions triggering electromigration which leads to degradation of interconnects and solder, ultimately resulting in circuit failure. Although electromigration-induced defects in electronic materials can manifest in several forms, the formation of voids is a common occurrence. This research aims at understanding the morphological evolution of voids under electromigration by formulating a diffuse interface approach that accounts for anisotropic mobility in the metallic interconnect. Based on an extensive parametric study, this study reports the conditions under which pancaking of voids or the novel void ‘swimming’ regimes are observed. Finally, inferences are drawn to formulate strategies using which the reliability of interconnects can be improved.
ContributorsVemulapalli, Sree Shivani (Author) / Ankit, Kumar (Thesis advisor) / Chawla, Nikhilesh (Committee member) / Singh, Arunima (Committee member) / Arizona State University (Publisher)
Created2020
Description
Layer-wise extrusion of soft-solid like cement pastes and mortars is commonly used in 3D printing of concrete. Rheological and mechanical characterization of the printable binder for on-demand flow and subsequent structuration is a critical challenge. This research is an effort to understand the mechanics of cementitious binders as soft solids in the fresh state, towards establishing material-process relationships to enhance print quality. This study introduces 3D printable binders developed based on rotational and capillary rheology test parameters, and establish the direct influence of packing coefficients, geometric ratio, slip velocities, and critical print velocities on the extrudate quality. The ratio of packing fraction to the square of average particle diameter (0.01-0.02), and equivalent microstructural index (5-20) were suitable for printing, and were directly related to the cohesion and extrusional yield stress of the material. In fact, steady state pressure for printing (30-40 kPa) is proportional to the extrusional yield stress, and increases with the geometric ratio (0-60) and print velocity (5-50 mm/s). Higher print velocities results in higher wall shear stresses and was exponentially related to the slip layer thickness (estimated between 1-5μ), while the addition of superplasticizers improve the slip layer thickness and the extrudate flow. However, the steady state pressure and printer capacity limits the maximum print velocity while the deadzone length limits the minimum velocity allowable (critical velocity regime) for printing. The evolution of buildability with time for the fresh state mortars was characterized with digital image correlation using compressive strain and strain rate in printed layers. The fresh state characteristics (interlayer and interfilamentous) and process parameters (layer height and fiber dimensions) influence the hardened mechanical properties. A lower layer height generally improves the mechanical properties and slight addition of fiber (up to 0.3% by volume) results in a 15-30% increase in the mechanical properties. 3D scanning and point-cloud analysis was also used to assess the geometric tolerance of a print based on mean error distances, print accuracy index, and layer-wise percent overlap. The research output will contribute to a synergistic material-process design and development of test methods for printability in the context of 3D printing of concrete.
ContributorsAmbadi Omanakuttan Nair, Sooraj Kumar (Author) / Neithalath, Narayanan (Thesis advisor) / Rajan, Subramaniam (Committee member) / Mobasher, Barzin (Committee member) / Hoover, Christian (Committee member) / Chawla, Nikhilesh (Committee member) / Arizona State University (Publisher)
Created2021
Description
Special thermal interface materials are required for connecting devices that operate at high temperatures up to 300°C. Because devices used in power electronics, such as GaN, SiC, and other wide bandgap semiconductors, can reach very high temperatures (beyond 250°C), a high melting point, and high thermal & electrical conductivity are required for the thermal interface material. Traditional solder materials for packaging cannot be used for these applications as they do not meet these requirements. Sintered nano-silver is a good candidate on account of its high thermal and electrical conductivity and very high melting point. The high temperature operating conditions of these devices lead to very high thermomechanical stresses that can adversely affect performance and also lead to failure. A number of these devices are mission critical and, therefore, there is a need for very high reliability. Thus, computational and nondestructive techniques and design methodology are needed to determine, characterize, and design the packages. Actual thermal cycling tests can be very expensive and time consuming. It is difficult to build test vehicles in the lab that are very close to the production level quality and therefore making comparisons or making predictions becomes a very difficult exercise. Virtual testing using a Finite Element Analysis (FEA) technique can serve as a good alternative. In this project, finite element analysis is carried out to help achieve this objective. A baseline linear FEA is performed to determine the nature and magnitude of stresses and strains that occur during the sintering step. A nonlinear coupled thermal and mechanical analysis is conducted for the sintering step to study the behavior more accurately and in greater detail. Damage and fatigue analysis are carried out for multiple thermal cycling conditions. The results are compared with the actual results from a prior study. A process flow chart outlining the FEA modeling process is developed as a template for the future work. A Coffin-Manson type relationship is developed to help determine the accelerated aging conditions and predict life for different service conditions.
ContributorsAmla, Tarun (Author) / Chawla, Nikhilesh (Thesis advisor) / Jiao, Yang (Committee member) / Liu, Yongming (Committee member) / Zhuang, Houlong (Committee member) / Jiang, Hanqing (Committee member) / Arizona State University (Publisher)
Created2020