ASU Electronic Theses and Dissertations
This collection includes most of the ASU Theses and Dissertations from 2011 to present. ASU Theses and Dissertations are available in downloadable PDF format; however, a small percentage of items are under embargo. Information about the dissertations/theses includes degree information, committee members, an abstract, supporting data or media.
In addition to the electronic theses found in the ASU Digital Repository, ASU Theses and Dissertations can be found in the ASU Library Catalog.
Dissertations and Theses granted by Arizona State University are archived and made available through a joint effort of the ASU Graduate College and the ASU Libraries. For more information or questions about this collection contact or visit the Digital Repository ETD Library Guide or contact the ASU Graduate College at gradformat@asu.edu.
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- Creators: Pan, Rong
Description
This dissertation presents methods for addressing research problems that currently can only adequately be solved using Quality Reliability Engineering (QRE) approaches especially accelerated life testing (ALT) of electronic printed wiring boards with applications to avionics circuit boards. The methods presented in this research are generally applicable to circuit boards, but the data generated and their analysis is for high performance avionics. Avionics equipment typically requires 20 years expected life by aircraft equipment manufacturers and therefore ALT is the only practical way of performing life test estimates. Both thermal and vibration ALT induced failure are performed and analyzed to resolve industry questions relating to the introduction of lead-free solder product and processes into high reliability avionics. In chapter 2, thermal ALT using an industry standard failure machine implementing Interconnect Stress Test (IST) that simulates circuit board life data is compared to real production failure data by likelihood ratio tests to arrive at a mechanical theory. This mechanical theory results in a statistically equivalent energy bound such that failure distributions below a specific energy level are considered to be from the same distribution thus allowing testers to quantify parameter setting in IST prior to life testing. In chapter 3, vibration ALT comparing tin-lead and lead-free circuit board solder designs involves the use of the likelihood ratio (LR) test to assess both complete failure data and S-N curves to present methods for analyzing data. Failure data is analyzed using Regression and two-way analysis of variance (ANOVA) and reconciled with the LR test results that indicating that a costly aging pre-process may be eliminated in certain cases. In chapter 4, vibration ALT for side-by-side tin-lead and lead-free solder black box designs are life tested. Commercial models from strain data do not exist at the low levels associated with life testing and need to be developed because testing performed and presented here indicate that both tin-lead and lead-free solders are similar. In addition, earlier failures due to vibration like connector failure modes will occur before solder interconnect failures.
ContributorsJuarez, Joseph Moses (Author) / Montgomery, Douglas C. (Thesis advisor) / Borror, Connie M. (Thesis advisor) / Gel, Esma (Committee member) / Mignolet, Marc (Committee member) / Pan, Rong (Committee member) / Arizona State University (Publisher)
Created2012
Description
Ultra-fast 2D/3D material microstructure reconstruction and quantitative structure-property mapping are crucial components of integrated computational material engineering (ICME). It is particularly challenging for modeling random heterogeneous materials such as alloys, composites, polymers, porous media, and granular matters, which exhibit strong randomness and variations of their material properties due to the hierarchical uncertainties associated with their complex microstructure at different length scales. Such uncertainties also exist in disordered hyperuniform systems that are statistically isotropic and possess no Bragg peaks like liquids and glasses, yet they suppress large-scale density fluctuations in a similar manner as in perfect crystals. The unique hyperuniform long-range order in these systems endow them with nearly optimal transport, electronic and mechanical properties. The concept of hyperuniformity was originally introduced for many-particle systems and has subsequently been generalized to heterogeneous materials such as porous media, composites, polymers, and biological tissues for unconventional property discovery. An explicit mixture random field (MRF) model is proposed to characterize and reconstruct multi-phase stochastic material property and microstructure simultaneously, where no additional tuning step nor iteration is needed compared with other stochastic optimization approaches such as the simulated annealing. The proposed method is shown to have ultra-high computational efficiency and only requires minimal imaging and property input data. Considering microscale uncertainties, the material reliability will face the challenge of high dimensionality. To deal with the so-called “curse of dimensionality”, efficient material reliability analysis methods are developed. Then, the explicit hierarchical uncertainty quantification model and efficient material reliability solvers are applied to reliability-based topology optimization to pursue the lightweight under reliability constraint defined based on structural mechanical responses. Efficient and accurate methods for high-resolution microstructure and hyperuniform microstructure reconstruction, high-dimensional material reliability analysis, and reliability-based topology optimization are developed. The proposed framework can be readily incorporated into ICME for probabilistic analysis, discovery of novel disordered hyperuniform materials, material design and optimization.
ContributorsGao, Yi (Author) / Liu, Yongming (Thesis advisor) / Jiao, Yang (Committee member) / Ren, Yi (Committee member) / Pan, Rong (Committee member) / Mignolet, Marc (Committee member) / Arizona State University (Publisher)
Created2021