ASU Electronic Theses and Dissertations
This collection includes most of the ASU Theses and Dissertations from 2011 to present. ASU Theses and Dissertations are available in downloadable PDF format; however, a small percentage of items are under embargo. Information about the dissertations/theses includes degree information, committee members, an abstract, supporting data or media.
In addition to the electronic theses found in the ASU Digital Repository, ASU Theses and Dissertations can be found in the ASU Library Catalog.
Dissertations and Theses granted by Arizona State University are archived and made available through a joint effort of the ASU Graduate College and the ASU Libraries. For more information or questions about this collection contact or visit the Digital Repository ETD Library Guide or contact the ASU Graduate College at gradformat@asu.edu.
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- Creators: Kitchen, Jennifer
Description
Radio frequency (RF) transceivers require a disproportionately high effort in terms of test development time, test equipment cost, and test time. The relatively high test cost stems from two contributing factors. First, RF transceivers require the measurement of a diverse set of specifications, requiring multiple test set-ups and long test times, which complicates load-board design, debug, and diagnosis. Second, high frequency operation necessitates the use of expensive equipment, resulting in higher per second test time cost compared with mixed-signal or digital circuits. Moreover, in terms of the non-recurring engineering cost, the need to measure complex specfications complicates the test development process and necessitates a long learning process for test engineers. Test time is dominated by changing and settling time for each test set-up. Thus, single set-up test solutions are desirable. Loop-back configuration where the transmitter output is connected to the receiver input are used as the desirable test set- up for RF transceivers, since it eliminates the reliance on expensive instrumentation for RF signal analysis and enables measuring multiple parameters at once. In-phase and Quadrature (IQ) imbalance, non-linearity, DC offset and IQ time skews are some of the most detrimental imperfections in transceiver performance. Measurement of these parameters in the loop-back mode is challenging due to the coupling between the receiver (RX) and transmitter (TX) parameters. Loop-back based solutions are proposed in this work to resolve this issue. A calibration algorithm for a subset of the above mentioned impairments is also presented. Error Vector Magnitude (EVM) is a system-level parameter that is specified for most advanced communication standards. EVM measurement often takes extensive test development efforts, tester resources, and long test times. EVM is analytically related to system impairments, which are typically measured in a production test i environment. Thus, EVM test can be eliminated from the test list if the relations between EVM and system impairments are derived independent of the circuit implementation and manufacturing process. In this work, the focus is on the WLAN standard, and deriving the relations between EVM and three of the most detrimental impairments for QAM/OFDM based systems (IQ imbalance, non-linearity, and noise). Having low cost test techniques for measuring the RF transceivers imperfections and being able to analytically compute EVM from the measured parameters is a complete test solution for RF transceivers. These techniques along with the proposed calibration method can be used in improving the yield by widening the pass/fail boundaries for transceivers imperfections. For all of the proposed methods, simulation and hardware measurements prove that the proposed techniques provide accurate characterization of RF transceivers.
ContributorsNassery, Afsaneh (Author) / Ozev, Sule (Thesis advisor) / Bakkaloglu, Bertan (Committee member) / Kiaei, Sayfe (Committee member) / Kitchen, Jennifer (Committee member) / Arizona State University (Publisher)
Created2013
Description
Isolated DC/DC converters are used to provide electrical isolation between two supply domain systems. A fully integrated isolated DC/DC converter having no board-level components and fabricated using standard integrated circuits (IC) process is highly desirable in order to increase the system reliability and reduce costs. The isolation between the low-voltage side and high-voltage side of the converter is realized by a transformer that transfers energy while blocking the DC loop. The resonant mode power oscillator is used to enable high efficiency power transfer. The on-chip transformer is expected to have high coil inductance, high quality factors and high coupling coefficient to reduce the loss in the oscillation. The performance of a transformer is highly dependent on the vertical structure, horizontal geometry and other indispensable structures that make it compatible with the IC process such as metal fills and patterned ground shield (PGS). With the help of three-dimensional (3-D) electro-magnetic (EM) simulation software, the 3-D transformer model is simulated and the simulation result is got with high accuracy.
In this thesis an on-chip transformer for a fully integrated DC/DC converter using standard IC process is developed. Different types of transformers are modeled and simulated in HFSS. The performances are compared to select the optimum design. The effects of the additional structures including PGS and metal fills are also simulated. The transformer is tested with a network analyzer and the testing results show a good consistency with the simulation results when taking the chip traces, printed circuit board (PCB) traces, bond wires and SMA connectors into account.
In this thesis an on-chip transformer for a fully integrated DC/DC converter using standard IC process is developed. Different types of transformers are modeled and simulated in HFSS. The performances are compared to select the optimum design. The effects of the additional structures including PGS and metal fills are also simulated. The transformer is tested with a network analyzer and the testing results show a good consistency with the simulation results when taking the chip traces, printed circuit board (PCB) traces, bond wires and SMA connectors into account.
ContributorsZhao, Yao (Author) / Bakkaloglu, Bertan (Thesis advisor) / Kiaei, Sayfe (Committee member) / Kitchen, Jennifer (Committee member) / Arizona State University (Publisher)
Created2014
Description
There is an increasing demand for fully integrated point-of-load (POL) isolated DC-DC converters that can provide an isolation barrier between the primary and the secondary side, while delivering a low ripple, low noise regulated voltage at their isolated sides to a high dynamic range, sensitive mixed signal devices, such as sensors, current-shunt-monitors and ADCs. For these applications, smaller system size and integration level is important because the whole system may need to fit to limited space. Traditional methods for providing isolated power are discrete solutions using bulky transformers. Miniaturization of isolated POL regulators is becoming highly desirable for low power applications.
A fully integrated, low noise isolated point-of-load DC-DC converter for supply regulation of high dynamic range analog and mixed signal sensor signal-chains is presented. The isolated DC-DC converter utilizes an integrated planar air-core micro-transformer as a coupled resonator and isolation barrier and enables direct connection of low-voltage mixed signal circuits to higher supply rails. The air core transformer is driven at its primary resonant frequency of 100 MHz to achieve maximum power transfer. A mixed-signal perturb-and-observe based frequency search algorithm is developed to improve maximum power transfer efficiency by 60% across the isolation barrier compared to fixed driving frequency method. The isolated converter’s output ripple is reduced by utilizing spread spectrum clocking in the driver. An isolated PMOS LDO in the secondary side is used to suppress switching noise and ripple by 21dB. Conducted and radiated EMI distribution on the IC is measured by a set of integrated ring oscillator based noise sensors with -68dBm noise sensitivity. The proposed isolated converter achieves highest level of integration with respect to earlier reported integrated isolated converters, while providing 50V on-chip junction isolation without the need for extra silicon post-processing steps.
A fully integrated, low noise isolated point-of-load DC-DC converter for supply regulation of high dynamic range analog and mixed signal sensor signal-chains is presented. The isolated DC-DC converter utilizes an integrated planar air-core micro-transformer as a coupled resonator and isolation barrier and enables direct connection of low-voltage mixed signal circuits to higher supply rails. The air core transformer is driven at its primary resonant frequency of 100 MHz to achieve maximum power transfer. A mixed-signal perturb-and-observe based frequency search algorithm is developed to improve maximum power transfer efficiency by 60% across the isolation barrier compared to fixed driving frequency method. The isolated converter’s output ripple is reduced by utilizing spread spectrum clocking in the driver. An isolated PMOS LDO in the secondary side is used to suppress switching noise and ripple by 21dB. Conducted and radiated EMI distribution on the IC is measured by a set of integrated ring oscillator based noise sensors with -68dBm noise sensitivity. The proposed isolated converter achieves highest level of integration with respect to earlier reported integrated isolated converters, while providing 50V on-chip junction isolation without the need for extra silicon post-processing steps.
ContributorsLiu, Chengxi (Author) / Bakkaloglu, Bertan (Thesis advisor) / Kiaei, Sayfe (Committee member) / Song, Hongjiang (Committee member) / Kitchen, Jennifer (Committee member) / Arizona State University (Publisher)
Created2018
Description
The continuing advancement of modulation standards with newer generations of cellular technology, promises ever increasing data rate and bandwidth efficiency. However, these modulation schemes present high peak to average power ratio (PAPR) even after applying crest factor reduction. Being the most power-hungry component in the radio frequency (RF) transmitter, power amplifiers (PA) for infrastructure applications, need to operate efficiently at the presence of these high PAPR signals while maintaining reasonable linearity performance which could be improved by moderate digital pre-distortion (DPD) techniques. This strict requirement of operating efficiently at average power level while being capable of delivering the peak power, made the load modulated PAs such as Doherty PA, Outphasing PA, various Envelope Tracking PAs, Polar transmitters and most recently the load modulated balanced PA, the prime candidates for such application. However, due to its simpler architecture and ability to deliver RF power efficiently with good linearity performance has made Doherty PA (DPA) the most popular solution and has been deployed almost exclusively for wireless infrastructure application all over the world.
Although DPAs has been very successful at amplifying the high PAPR signals, most recent advancements in cellular technology has opted for higher PAPR based signals at wider bandwidth. This lead to increased research and development work to innovate advanced Doherty architectures which are more efficient at back-off (BO) power levels compared to traditional DPAs. In this dissertation, three such advanced Doherty architectures and/or techniques are proposed to achieve high efficiency at further BO power level compared to traditional architecture using symmetrical devices for carrier and peaking PAs. Gallium Nitride (GaN) based high-electron-mobility (HEMT) technology has been used to design and fabricate the DPAs to validate the proposed advanced techniques for higher efficiency with good linearity performance at BO power levels.
Although DPAs has been very successful at amplifying the high PAPR signals, most recent advancements in cellular technology has opted for higher PAPR based signals at wider bandwidth. This lead to increased research and development work to innovate advanced Doherty architectures which are more efficient at back-off (BO) power levels compared to traditional DPAs. In this dissertation, three such advanced Doherty architectures and/or techniques are proposed to achieve high efficiency at further BO power level compared to traditional architecture using symmetrical devices for carrier and peaking PAs. Gallium Nitride (GaN) based high-electron-mobility (HEMT) technology has been used to design and fabricate the DPAs to validate the proposed advanced techniques for higher efficiency with good linearity performance at BO power levels.
ContributorsRuhul Hasin, Muhammad (Author) / Kitchen, Jennifer (Thesis advisor) / Aberle, James T., 1961- (Committee member) / Bakkaloglu, Bertan (Committee member) / Kiaei, Sayfe (Committee member) / Arizona State University (Publisher)
Created2018
Description
As wireless communication enters smartphone era, more complicated communication technologies are being used to transmit higher data rate. Power amplifier (PA) has to work in back-off region, while this inevitably reduces battery life for cellphones. Various techniques have been reported to increase PA efficiency, such as envelope elimination and restoration (EER) and envelope tracking (ET). However, state of the art ET supply modulators failed to address high efficiency, high slew rate, and accurate tracking concurrently.
In this dissertation, a linear-switch mode hybrid ET supply modulator utilizing adaptive biasing and gain enhanced current mirror operational transconductance amplifier (OTA) with class-AB output stage in parallel with a switching regulator is presented. In comparison to a conventional OTA design with similar quiescent current consumption, proposed approach improves positive and negative slew rate from 50 V/µs to 93.4 V/µs and -87 V/µs to -152.5 V/µs respectively, dc gain from 45 dB to 67 dB while consuming same amount of quiescent current. The proposed hybrid supply modulator achieves 83% peak efficiency, power added efficiency (PAE) of 42.3% at 26.2 dBm for a 10 MHz 7.24 dB peak-to-average power ratio (PAPR) LTE signal and improves PAE by 8% at 6 dB back off from 26.2 dBm power amplifier (PA) output power with respect to fixed supply. With a 10 MHz 7.24 dB PAPR QPSK LTE signal the ET PA system achieves adjacent channel leakage ratio (ACLR) of -37.7 dBc and error vector magnitude (EVM) of 4.5% at 26.2 dBm PA output power, while with a 10 MHz 8.15 dB PAPR 64QAM LTE signal the ET PA system achieves ACLR of -35.6 dBc and EVM of 6% at 26 dBm PA output power without digital pre-distortion (DPD). The proposed supply modulator core circuit occupies 1.1 mm2 die area, and is fabricated in a 0.18 µm CMOS technology.
In this dissertation, a linear-switch mode hybrid ET supply modulator utilizing adaptive biasing and gain enhanced current mirror operational transconductance amplifier (OTA) with class-AB output stage in parallel with a switching regulator is presented. In comparison to a conventional OTA design with similar quiescent current consumption, proposed approach improves positive and negative slew rate from 50 V/µs to 93.4 V/µs and -87 V/µs to -152.5 V/µs respectively, dc gain from 45 dB to 67 dB while consuming same amount of quiescent current. The proposed hybrid supply modulator achieves 83% peak efficiency, power added efficiency (PAE) of 42.3% at 26.2 dBm for a 10 MHz 7.24 dB peak-to-average power ratio (PAPR) LTE signal and improves PAE by 8% at 6 dB back off from 26.2 dBm power amplifier (PA) output power with respect to fixed supply. With a 10 MHz 7.24 dB PAPR QPSK LTE signal the ET PA system achieves adjacent channel leakage ratio (ACLR) of -37.7 dBc and error vector magnitude (EVM) of 4.5% at 26.2 dBm PA output power, while with a 10 MHz 8.15 dB PAPR 64QAM LTE signal the ET PA system achieves ACLR of -35.6 dBc and EVM of 6% at 26 dBm PA output power without digital pre-distortion (DPD). The proposed supply modulator core circuit occupies 1.1 mm2 die area, and is fabricated in a 0.18 µm CMOS technology.
ContributorsJing, Yue (Author) / Bakkaloglu, Bertan (Thesis advisor) / Kiaei, Sayfe (Committee member) / Kitchen, Jennifer (Committee member) / Song, Hongjiang (Committee member) / Arizona State University (Publisher)
Created2017
Description
The photovoltaic systems used to convert solar energy to electricity pose a multitude of design and implementation challenges, including energy conversion efficiency, partial shading effects, and power converter efficiency. Using power converters for Distributed Maximum Power Point Tracking (DMPPT) is a well-known architecture to significantly reduce power loss associated with mismatched panels. Sub-panel-level DMPPT is shown to have up to 14.5% more annual energy yield than panel-level DMPPT, and requires an efficient medium power converter.
This research aims at implementing a highly efficient power management system at sub-panel level with focus on system cost and form-factor. Smaller form-factor motivates increased converter switching frequencies to significantly reduce the size of converter passives and substantially improve transient performance. But, currently available power MOSFETs put a constraint on the highest possible switching frequency due to increased switching losses. The solution is Gallium Nitride based power devices, which deliver figure of merit (FOM) performance at least an order of magnitude higher than existing silicon MOSFETs. Low power loss, high power density, low cost and small die sizes are few of the qualities that make e-GaN superior to its Si counterpart. With careful design, e-GaN can enable a 20-30% improvement in power stage efficiency compared to converters using Si MOSFETs.
The main objective of this research is to develop a highly integrated, high efficiency, 20MHz, hybrid GaN-CMOS DC-DC MPPT converter for a 12V/5A sub-panel. Hard and soft switching boost converter topologies are investigated within this research, and an innovative CMOS gate drive technique for efficiently driving an e-GaN power stage is presented in this work. The converter controller also employs a fast converging analog MPPT control technique.
This research aims at implementing a highly efficient power management system at sub-panel level with focus on system cost and form-factor. Smaller form-factor motivates increased converter switching frequencies to significantly reduce the size of converter passives and substantially improve transient performance. But, currently available power MOSFETs put a constraint on the highest possible switching frequency due to increased switching losses. The solution is Gallium Nitride based power devices, which deliver figure of merit (FOM) performance at least an order of magnitude higher than existing silicon MOSFETs. Low power loss, high power density, low cost and small die sizes are few of the qualities that make e-GaN superior to its Si counterpart. With careful design, e-GaN can enable a 20-30% improvement in power stage efficiency compared to converters using Si MOSFETs.
The main objective of this research is to develop a highly integrated, high efficiency, 20MHz, hybrid GaN-CMOS DC-DC MPPT converter for a 12V/5A sub-panel. Hard and soft switching boost converter topologies are investigated within this research, and an innovative CMOS gate drive technique for efficiently driving an e-GaN power stage is presented in this work. The converter controller also employs a fast converging analog MPPT control technique.
ContributorsKrishnan Achary, Kiran Kumar (Author) / Kitchen, Jennifer (Thesis advisor) / Kiaei, Sayfe (Committee member) / Bakkaloglu, Bertan (Committee member) / Arizona State University (Publisher)
Created2015
Description
This dissertation focuses on three different efficiency enhancement methods that are applicable to handset applications. These proposed designs are based on three critical requirements for handset application: 1) Small form factor, 2) CMOS compatibility and 3) high power handling. The three presented methodologies are listed below:
1) A transformer-based power combiner architecture for out-phasing transmitters
2) A current steering DAC-based average power tracking circuit for on-chip power amplifiers (PA)
3) A CMOS-based driver stage for GaN-based switched-mode power amplifiers applicable to fully digital transmitters
This thesis highlights the trends in wireless handsets, the motivates the need for fully-integrated CMOS power amplifier solutions and presents the three novel techniques for reconfigurable and digital CMOS-based PAs. Chapter 3, presents the transformer-based power combiner for out-phasing transmitters. The simulation results reveal that this technique is able to shrink the power combiner area, which is one of the largest parts of the transmitter, by about 50% and as a result, enhances the output power density by 3dB.
The average power tracking technique (APT) integrated with an on-chip CMOS-based power amplifier is explained in Chapter 4. This system is able to achieve up to 32dBm saturated output power with a linear power gain of 20dB in a 45nm CMOS SOI process. The maximum efficiency improvement is about ∆η=15% compared to the same PA without APT. Measurement results show that the proposed method is able to amplify an enhanced-EDGE modulated input signal with a data rate of 70.83kb/sec and generate more than 27dBm of average output power with EVM<5%.
Although small form factor, high battery lifetime, and high volume integration motivate the need for fully digital CMOS transmitters, the output power generated by this type of transmitter is not high enough to satisfy the communication standards. As a result, compound materials such as GaN or GaAs are usually being used in handset applications to increase the output power. Chapter 5 focuses on the analysis and design of two CMOS based driver architectures (cascode and house of cards) for driving a GaN power amplifier. The presented results show that the drivers are able to generate ∆Vout=5V, which is required by the compound transistor, and operate up to 2GHz. Since the CMOS driver is expected to drive an off-chip capacitive load, the interface components, such as bond wires, and decoupling and pad capacitors, play a critical role in the output transient response. Therefore, extensive analysis and simulation results have been done on the interface circuits to investigate their effects on RF transmitter performance. The presented results show that the maximum operating frequency when the driver is connected to a 4pF capacitive load is about 2GHz, which is perfectly matched with the reported values in prior literature.
1) A transformer-based power combiner architecture for out-phasing transmitters
2) A current steering DAC-based average power tracking circuit for on-chip power amplifiers (PA)
3) A CMOS-based driver stage for GaN-based switched-mode power amplifiers applicable to fully digital transmitters
This thesis highlights the trends in wireless handsets, the motivates the need for fully-integrated CMOS power amplifier solutions and presents the three novel techniques for reconfigurable and digital CMOS-based PAs. Chapter 3, presents the transformer-based power combiner for out-phasing transmitters. The simulation results reveal that this technique is able to shrink the power combiner area, which is one of the largest parts of the transmitter, by about 50% and as a result, enhances the output power density by 3dB.
The average power tracking technique (APT) integrated with an on-chip CMOS-based power amplifier is explained in Chapter 4. This system is able to achieve up to 32dBm saturated output power with a linear power gain of 20dB in a 45nm CMOS SOI process. The maximum efficiency improvement is about ∆η=15% compared to the same PA without APT. Measurement results show that the proposed method is able to amplify an enhanced-EDGE modulated input signal with a data rate of 70.83kb/sec and generate more than 27dBm of average output power with EVM<5%.
Although small form factor, high battery lifetime, and high volume integration motivate the need for fully digital CMOS transmitters, the output power generated by this type of transmitter is not high enough to satisfy the communication standards. As a result, compound materials such as GaN or GaAs are usually being used in handset applications to increase the output power. Chapter 5 focuses on the analysis and design of two CMOS based driver architectures (cascode and house of cards) for driving a GaN power amplifier. The presented results show that the drivers are able to generate ∆Vout=5V, which is required by the compound transistor, and operate up to 2GHz. Since the CMOS driver is expected to drive an off-chip capacitive load, the interface components, such as bond wires, and decoupling and pad capacitors, play a critical role in the output transient response. Therefore, extensive analysis and simulation results have been done on the interface circuits to investigate their effects on RF transmitter performance. The presented results show that the maximum operating frequency when the driver is connected to a 4pF capacitive load is about 2GHz, which is perfectly matched with the reported values in prior literature.
ContributorsMoallemi, Soroush (Author) / Kitchen, Jennifer (Thesis advisor) / Kiaei, Sayfe (Committee member) / Bakkaloglu, Bertan (Committee member) / Thornton, Trevor (Committee member) / Arizona State University (Publisher)
Created2019