ASU Electronic Theses and Dissertations
This collection includes most of the ASU Theses and Dissertations from 2011 to present. ASU Theses and Dissertations are available in downloadable PDF format; however, a small percentage of items are under embargo. Information about the dissertations/theses includes degree information, committee members, an abstract, supporting data or media.
In addition to the electronic theses found in the ASU Digital Repository, ASU Theses and Dissertations can be found in the ASU Library Catalog.
Dissertations and Theses granted by Arizona State University are archived and made available through a joint effort of the ASU Graduate College and the ASU Libraries. For more information or questions about this collection contact or visit the Digital Repository ETD Library Guide or contact the ASU Graduate College at gradformat@asu.edu.
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- Creators: Honsberg, Christiana
Description
Unlike conventional solar cells, modern high efficiency passivated contacts solar cells like silicon heterojunction (SHJ) cells have excellent surface passivation and use high bulk lifetime wafers which increase the operating injection level of these devices. These solar cell architectures can benefit from having lower doped substrates, with undoped solar cells becoming an attractive option. There has been very limited literature on high bulk resistivity substrates (>>10 Ωcm). This thesis work provides a comprehensive assessment of the potential of high resistivity/undoped substrates for high performance and more reliable silicon solar cells by demonstrating the results from modeling as well as characterization of SHJ solar cells fabricated with high resistivity/undoped substrates under real-world illumination and temperature conditions that the cells/modules experience in the field. In this work, the results from the analytical model demonstrated the effects of various defects, variation in doping and temperature on the performance of silicon solar cells. Experimentally, SHJ cells with bulk resistivities in the range of 1 Ωcm to >15k Ωcm were fabricated, and cell efficiencies over 20% were measured at standard testing conditions (STC) across the entire range of bulk resistivities. The illumination response (0.1-1 sun) and temperature coefficients (25-90 °C) were shown to be independent of the bulk resistivity. No light induced degradation was observed in the n-type SHJ cells of all resistivity ranges whereas high resistivity p-type SHJ cells showed less degradation compared to that of commercial resistivity range (<10 Ωcm). Very high reverse breakdown voltages (over 1 kV) were demonstrated for SHJ cells fabricated with high resistivity wafers. Using simulation, the importance of having cells in the modules with breakdown voltage higher than the series string voltage for safe and reliable operation of the photovoltaic (PV) system was highlighted.
The ingot yield can be improved by moving towards high resistivity ranges to manufacture high efficiency reliable solar cells by utilizing the entire ingot and eliminating the need to adhere to narrow resistivity range. Thus, the novel findings from this work can have profound impact on ingot and module manufacturing resulting in significant cost savings as well as improvement in the system reliability.
ContributorsSrinivasa, Apoorva (Author) / Bowden, Stuart (Thesis advisor) / Honsberg, Christiana (Committee member) / King, Richard (Committee member) / Goryll, Michael (Committee member) / Arizona State University (Publisher)
Created2021
Description
To keep up with the increasing demand for solar energy, higher efficiencies are necessary while keeping cost at a minimum. The easiest theoretical way to achieve that is using silicon-based multi-junction solar cells. However, there are major challenges in effectively implementing such a system. Much work has been done recently to integrate III-V with Si for multi-junction solar cell purposes. The focus of this paper is to explore GaP-based dilute nitrides as a possible top cell candidate for Si-based multi-junctions. The direct growth of dilute nitrides in a lattice-matched configuration epitaxially in literature is reviewed. The problems associated with such growths are outlined and pathways to mitigate these problems are presented. The need for a GaP buffer layer between the dilute nitride film and Si is established. Defects in GaP/Si system are explored in detail and a study on pit formation during such growth is performed. Effective suppression of pits in GaP surface grown on Si is achieved. Issues facing GaP-based dilute nitrides in terms of material properties are outlined. Review of these challenges is done and some possible future areas of interest to improve material quality are established. Finally, the growth process of dilute nitrides using Molecular Beam Epitaxy tool is explained. Results for GaNP grown on Si pre and post growth treatments are detailed.
ContributorsMurali, Srinath (Author) / Honsberg, Christiana (Thesis advisor) / Goodnick, Stephen (Committee member) / King, Richard (Committee member) / Goryll, Michael (Committee member) / Arizona State University (Publisher)
Created2022
Description
In this dissertation, the nanofabrication process is characterized for fabrication of nanostructure on surface of silicon and gallium phosphide using silica nanosphere lithography (SNL) and metal assisted chemical etching (MACE) process. The SNL process allows fast process time and well defined silica nanosphere monolayer by spin-coating process after mixing N,N-dimethyl-formamide (DMF) solvent. The MACE process achieves the high aspect ratio structure fabrication using the reaction between metal and wet chemical. The nanostructures are fabricated on Si surface for enhanced light management, but, without proper surface passivation those gains hardly impact the performance of the solar cell. The surface passivation of nanostructures is challenging, not only due to larger surface areas and aspect ratios, but also has a direct result of the nanofabrication processes. In this research, the surface passivation of silicon nanostructures is improved by modifying the silica nanosphere lithography (SNL) and the metal assisted chemical etching (MACE) processes, frequently used to fabricate nanostructures. The implementation of a protective silicon oxide layer is proposed prior to the lithography process to mitigate the impact of the plasma etching during the SNL. Additionally, several adhesion layers are studied, chromium (Cr), nickel (Ni) and titanium (Ti) with gold (Au), used in the MACE process. The metal contamination is one of main damage and Ti makes the mitigation of metal contamination. Finally, a new chemical etching step is introduced, using potassium hydroxide at room temperature, to smooth the surface of the nanostructures after the MACE process. This chemical treatment allows to improve passivation by surface area control and removing surface defects. In this research, I demonstrate the Aluminum Oxide (Al2O3) passivation on nanostructure using atomic layer deposition (ALD) process. 10nm of Al2O3 layer makes effective passivation on nanostructure with optimized post annealing in forming gas (N2/H2) environment. However, 10nm thickness is not suitable for hetero structure because of carrier transportation. For carrier transportation, ultrathin Al2O3 (≤ 1nm) layer is used for passivation, but effective passivation is not achieved because of insufficient hydrogen contents. This issue is solved to use additional ultrathin SiO2 (1nm) below Al2O3 layer and hydrogenation from doped a-Si:H.
Moreover, the nanostructure is creased on gallium phosphide (GaP) by SNL and MACE process. The fabrication process is modified by control of metal layer and MACE solution.
ContributorsKim, Sangpyeong (Author) / Honsberg, Christiana (Thesis advisor) / Bowden, Stuart (Committee member) / Goryll, Michael (Committee member) / Augusto, Andre (Committee member) / Arizona State University (Publisher)
Created2021