ASU Electronic Theses and Dissertations
This collection includes most of the ASU Theses and Dissertations from 2011 to present. ASU Theses and Dissertations are available in downloadable PDF format; however, a small percentage of items are under embargo. Information about the dissertations/theses includes degree information, committee members, an abstract, supporting data or media.
In addition to the electronic theses found in the ASU Digital Repository, ASU Theses and Dissertations can be found in the ASU Library Catalog.
Dissertations and Theses granted by Arizona State University are archived and made available through a joint effort of the ASU Graduate College and the ASU Libraries. For more information or questions about this collection contact or visit the Digital Repository ETD Library Guide or contact the ASU Graduate College at gradformat@asu.edu.
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- Creators: Chawla, Nikhilesh
Description
Glasses have many applications such as containers, substrates of displays, high strength fibers and portable electronic display panels. Their excellent mechanical properties such as high hardness, good forming ability and scratch resistance make glasses ideal for these applications. Many factors affect the selection of one glass over another for a given purpose such as cost, ingredients, scalability of manufacturing, etc. Typically, silicate based glasses are often selected because they satisfy most of the selection criteria. However, with the recent abundant use of these glasses in touch-based applications, understanding their abilities to dissipate energy due to surface contact loads has become increasingly desirable. The most common silicate glasses worldwide are glassy silica and soda lime. Calcium aluminosilicates are also gaining popularity due to their importance as substrates for display screens in electronic devices. The surface energy dissipation and strength of these glasses are based on several factors, but predominantly rely on ingredient composition and the so-called Indentation Size Effect (ISE), where the strength depends on the maximum surface force. Both the composition and ISE alter the strength and favored energy dissipation mechanisms of the glass. Unlocking the contribution of these mechanisms and elucidating their dependence on composition and force is the underlining goal of this thesis.Prior to cracking, silicate glasses can inelastically deform by shear and densification. However, the link between the mechanical properties, strength, glass structure and maximum force and the propensity by which either of these mechanisms are favored still remains unclear. In this study, the first aim is to elucidate the causes of the ISE and
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explore the relationships between the ISE and the dissipation mechanisms, and identify what feature(s) of the glass can be used to infer their behavior. All glasses have shown a strong link between the ISE and shear flow and densification. Second, the link between composition and the dissipation mechanisms will be elucidated. This is accomplished by performing indentation tests coupled with an annealing method to independently quantify the amount of volume associated with each dissipation mechanism and elucidate relationships with ingredients and structure of the glasses. Some conclusions will then be presented that link all these behaviors together.
ContributorsKazembeyki, Maryam (Author) / Hoover, Christian G (Thesis advisor) / Rajan, Subramaniam (Committee member) / Neithalath, Narayanan (Committee member) / Chawla, Nikhilesh (Committee member) / Perreault, Francois (Committee member) / Arizona State University (Publisher)
Created2021
Description
Increasing density of microelectronic packages, results in an increase in thermal and mechanical stresses within the various layers of the package. To accommodate the high-performance demands, the materials used in the electronic package would also require improvement. Specifically, the damage that often occurs in solders that function as die-attachment and thermal interfaces need to be addressed. This work evaluates and characterizes thermo-mechanical damage in two material systems – Electroplated Tin and Sintered Nano-Silver solder.
Tin plated electrical contacts are prone to formation of single crystalline tin whiskers which can cause short circuiting. A mechanistic model of their formation, evolution and microstructural influence is still not fully understood. In this work, growth of mechanically induced tin whiskers/hillocks is studied using in situ Nano-indentation and Electron Backscatter Diffraction (EBSD). Electroplated tin was indented and monitored in vacuum to study growth of hillocks without the influence of atmosphere. Thermal aging was done to study the effect of intermetallic compounds. Grain orientation of the hillocks and the plastically deformed region surrounding the indent was studied using Focused Ion Beam (FIB) lift-out technique. In addition, micropillars were milled on the surface of electroplated Sn using FIB to evaluate the yield strength and its relation to Sn grain size.
High operating temperature power electronics use wide band-gap semiconductor devices (Silicon Carbide/Gallium Nitride). The operating temperature of these devices can exceed 250oC, preventing use of traditional Sn-solders as Thermal Interface materials (TIM). At high temperature, the thermomechanical stresses can severely degrade the reliability and life of the device. In this light, new non-destructive approach is needed to understand the damage mechanism when subjected to reliability tests such as thermal cycling. In this work, sintered nano-Silver was identified as a promising high temperature TIM. Sintered nano-Silver samples were fabricated and their shear strength was evaluated. Thermal cycling tests were conducted and damage evolution was characterized using a lab scale 3D X-ray system to periodically assess changes in the microstructure such as cracks, voids, and porosity in the TIM layer. The evolution of microstructure and the effect of cycling temperature during thermal cycling are discussed.
Tin plated electrical contacts are prone to formation of single crystalline tin whiskers which can cause short circuiting. A mechanistic model of their formation, evolution and microstructural influence is still not fully understood. In this work, growth of mechanically induced tin whiskers/hillocks is studied using in situ Nano-indentation and Electron Backscatter Diffraction (EBSD). Electroplated tin was indented and monitored in vacuum to study growth of hillocks without the influence of atmosphere. Thermal aging was done to study the effect of intermetallic compounds. Grain orientation of the hillocks and the plastically deformed region surrounding the indent was studied using Focused Ion Beam (FIB) lift-out technique. In addition, micropillars were milled on the surface of electroplated Sn using FIB to evaluate the yield strength and its relation to Sn grain size.
High operating temperature power electronics use wide band-gap semiconductor devices (Silicon Carbide/Gallium Nitride). The operating temperature of these devices can exceed 250oC, preventing use of traditional Sn-solders as Thermal Interface materials (TIM). At high temperature, the thermomechanical stresses can severely degrade the reliability and life of the device. In this light, new non-destructive approach is needed to understand the damage mechanism when subjected to reliability tests such as thermal cycling. In this work, sintered nano-Silver was identified as a promising high temperature TIM. Sintered nano-Silver samples were fabricated and their shear strength was evaluated. Thermal cycling tests were conducted and damage evolution was characterized using a lab scale 3D X-ray system to periodically assess changes in the microstructure such as cracks, voids, and porosity in the TIM layer. The evolution of microstructure and the effect of cycling temperature during thermal cycling are discussed.
ContributorsLujan Regalado, Irene (Author) / Chawla, Nikhilesh (Thesis advisor) / Frear, Darrel (Committee member) / Rajagopalan, Jagannathan (Committee member) / Jiao, Yang (Committee member) / Arizona State University (Publisher)
Created2018