This collection includes most of the ASU Theses and Dissertations from 2011 to present. ASU Theses and Dissertations are available in downloadable PDF format; however, a small percentage of items are under embargo. Information about the dissertations/theses includes degree information, committee members, an abstract, supporting data or media.

In addition to the electronic theses found in the ASU Digital Repository, ASU Theses and Dissertations can be found in the ASU Library Catalog.

Dissertations and Theses granted by Arizona State University are archived and made available through a joint effort of the ASU Graduate College and the ASU Libraries. For more information or questions about this collection contact or visit the Digital Repository ETD Library Guide or contact the ASU Graduate College at gradformat@asu.edu.

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Description
With increasing demand for System on Chip (SoC) and System in Package (SiP) design in computer and communication technologies, integrated inductor which is an essential passive component has been widely used in numerous integrated circuits (ICs) such as in voltage regulators and RF circuits. In this work, soft ferromagnetic core

With increasing demand for System on Chip (SoC) and System in Package (SiP) design in computer and communication technologies, integrated inductor which is an essential passive component has been widely used in numerous integrated circuits (ICs) such as in voltage regulators and RF circuits. In this work, soft ferromagnetic core material, amorphous Co-Zr-Ta-B, was incorporated into on-chip and in-package inductors in order to scale down inductors and improve inductors performance in both inductance density and quality factor. With two layers of 500 nm Co-Zr-Ta-B films a 3.5X increase in inductance and a 3.9X increase in quality factor over inductors without magnetic films were measured at frequencies as high as 1 GHz. By laminating technology, up to 9.1X increase in inductance and more than 5X increase in quality factor (Q) were obtained from stripline inductors incorporated with 50 nm by 10 laminated films with a peak Q at 300 MHz. It was also demonstrated that this peak Q can be pushed towards high frequency as far as 1GHz by a combination of patterning magnetic films into fine bars and laminations. The role of magnetic vias in magnetic flux and eddy current control was investigated by both simulation and experiment using different patterning techniques and by altering the magnetic via width. Finger-shaped magnetic vias were designed and integrated into on-chip RF inductors improving the frequency of peak quality factor from 400 MHz to 800 MHz without sacrificing inductance enhancement. Eddy current and magnetic flux density in different areas of magnetic vias were analyzed by HFSS 3D EM simulation. With optimized magnetic vias, high frequency response of up to 2 GHz was achieved. Furthermore, the effect of applied magnetic field on on-chip inductors was investigated for high power applications. It was observed that as applied magnetic field along the hard axis (HA) increases, inductance maintains similar value initially at low fields, but decreases at larger fields until the magnetic films become saturated. The high frequency quality factor showed an opposite trend which is correlated to the reduction of ferromagnetic resonant absorption in the magnetic film. In addition, experiments showed that this field-dependent inductance change varied with different patterned magnetic film structures, including bars/slots and fingers structures. Magnetic properties of Co-Zr-Ta-B films on standard organic package substrates including ABF and polyimide were also characterized. Effects of substrate roughness and stress were analyzed and simulated which provide strategies for integrating Co-Zr-Ta-B into package inductors and improving inductors performance. Stripline and spiral inductors with Co-Zr-Ta-B films were fabricated on both ABF and polyimide substrates. Maximum 90% inductance increase in hundreds MHz frequency range were achieved in stripline inductors which are suitable for power delivery applications. Spiral inductors with Co-Zr-Ta-B films showed 18% inductance increase with quality factor of 4 at frequency up to 3 GHz.
ContributorsWu, Hao (Author) / Yu, Hongbin (Thesis advisor) / Bakkaloglu, Bertan (Committee member) / Cao, Yu (Committee member) / Chickamenahalli, Shamala (Committee member) / Arizona State University (Publisher)
Created2013
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Description
The strong demand for the advancing of Moore’s law on device size scaling down has accelerated the miniaturization of passive devices. Among these important electronic components, inductors are facing challenges because the inductance value, which is strongly dependent on the coil number for the air core inductor case, will be

The strong demand for the advancing of Moore’s law on device size scaling down has accelerated the miniaturization of passive devices. Among these important electronic components, inductors are facing challenges because the inductance value, which is strongly dependent on the coil number for the air core inductor case, will be sacrificed when the size is shrinking. Adding magnetic core is one of the solutions due to its enhancement of inductance density but it will also add complexity to the fabrication process, and the core loss induced by the eddy current at high frequency is another drawback. In this report, the output of this research will be presented, which has three parts. In the first part, the CoZrTaB thin films are sputtered on different substrates and characterized comprehensively. The laminated CoZrTaB thin films have been also investigated, showing low coercivity and anisotropy field on both Si and polyimide substrates. Also, the different process conditions that could affect the magnetic properties are investigated. In the second part, Ansys Maxwell software is used to optimize the lamination profile and the magnetic core inductor structure. The measured M-H loop is imported to improve the simulation accuracy. In the third part, a novel method to fabricate the magnetic core inductors on flexible substrates is proposed. The sandwich magnetic core inductor is fabricated and assembled with flipchip bonder. The measurement result shows that this single-turn magnetic core inductor can achieve up to 24% inductance enhancement and quality factor of 7.42. The super low DC resistance (< 60 mΩ) proves that it is a good candidate to act as the passive component in the power delivery module and the use of polyimide-based substrate extends its compatibility to more packaging form factors.
ContributorsWu, Yanze (Author) / Yu, Hongbin (Thesis advisor) / Chickamenahalli, Shamala (Committee member) / Rizzo, Nicholas (Committee member) / Goryll, Michael (Committee member) / Arizona State University (Publisher)
Created2022