ASU Electronic Theses and Dissertations
This collection includes most of the ASU Theses and Dissertations from 2011 to present. ASU Theses and Dissertations are available in downloadable PDF format; however, a small percentage of items are under embargo. Information about the dissertations/theses includes degree information, committee members, an abstract, supporting data or media.
In addition to the electronic theses found in the ASU Digital Repository, ASU Theses and Dissertations can be found in the ASU Library Catalog.
Dissertations and Theses granted by Arizona State University are archived and made available through a joint effort of the ASU Graduate College and the ASU Libraries. For more information or questions about this collection contact or visit the Digital Repository ETD Library Guide or contact the ASU Graduate College at gradformat@asu.edu.
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- All Subjects: solder
- All Subjects: Extended finite element
- Creators: Chawla, Nikhilesh
Description
The mechanical behavior of Pb-free solder alloys is important, since they must maintain mechanical integrity under thermomechanical fatigue, creep, and mechanical shock conditions. Mechanical shock, in particular, has become an increasing concern in the electronics industry, since electronic packages can be subjected to mechanical shock by mishandling during manufacture or by accidental dropping. In this study, the mechanical shock behavior of Sn and Sn-Ag-Cu alloys was systematically analyzed over the strain rate range 10-3 - 30 s-1 in bulk samples, and over 10-3 - 12 s-1 on the single solder joint level. More importantly, the influences of solder microstructure and intermetallic compounds (IMC) on mechanical shock resistance were quantified. A thorough microstructural characterization of Sn-rich alloys was conducted using synchrotron x-ray computed tomography. The three-dimensional morphology and distribution of contiguous phases and precipitates was analyzed. A multiscale approach was utilized to characterize Sn-rich phases on the microscale with x-ray tomography and focused ion beam tomography to characterize nanoscale precipitates. A high strain rate servohydraulic test system was developed in conjunction with a modified tensile specimen geometry and a high speed camera for quantifying deformation. The effect of microstructure and applied strain rate on the local strain and strain rate distributions were quantified using digital image correlation. Necking behavior was analyzed using a novel mirror fixture, and the triaxial stresses associated with necking were corrected using a self-consistent method to obtain the true stress-true strain constitutive behavior. Fracture mechanisms were quantified as a function of strain rate. Finally, the relationship between solder microstructure and intermetallic compound layer thickness with the mechanical shock resistance of Sn-3.8Ag-0.7Cu solder joints was characterized. It was found that at low strain rates the dynamic solder joint strength was controlled by the solder microstructure, while at high strain rates it was controlled by the IMC layer. The influences of solder microstructure and IMC layer thickness were then isolated using extended reflow or isothermal aging treatments. It was found that at large IMC layer thicknesses the trend described above does not hold true. The fracture mechanisms associated with the dynamic solder joint strength regimes were analyzed.
ContributorsYazzie, Kyle (Author) / Chawla, Nikhilesh (Thesis advisor) / Sane, Sandeep (Committee member) / Jiang, Hanqing (Committee member) / Krause, Stephen (Committee member) / Arizona State University (Publisher)
Created2012
Description
The objective of this research is to develop robust, accurate, and adaptive algorithms in the framework of the extended finite element method (XFEM) for fracture analysis of highly heterogeneous materials with complex internal geometries. A key contribution of this work is the creation of novel methods designed to automate the incorporation of high-resolution data, e.g. from X-ray tomography, that can be used to better interpret the enormous volume of data generated in modern in-situ experimental testing. Thus new algorithms were developed for automating analysis of complex microstructures characterized by segmented tomographic images.
A centrality-based geometry segmentation algorithm was developed to accurately identify discrete inclusions and particles in composite materials where limitations in imaging resolution leads to spurious connections between particles in close contact.To allow for this algorithm to successfully segment geometry independently of particle size and shape, a relative centrality metric was defined to allow for a threshold centrality criterion for removal of voxels that spuriously connect distinct geometries.
To automate incorporation of microstructural information from high-resolution images, two methods were developed that initialize signed distance fields on adaptively-refined finite element meshes. The first method utilizes a level set evolution equation that is directly solved on the finite element mesh through Galerkins method. The evolution equation is formulated to produce a signed distance field that matches geometry defined by a set of voxels segmented from tomographic images. The method achieves optimal convergence for the order of elements used. In a second approach, the fast marching method is employed to initialize a distance field on a uniform grid which is then projected by least squares onto a finite element mesh. This latter approach is shown to be superior in speed and accuracy.
Lastly, extended finite element method simulations are performed for the analysis of particle fracture in metal matrix composites with realistic particle geometries initialized from X-ray tomographic data. In the simulations, particles fracture probabilistically through a Weibull strength distribution. The model is verified through comparisons with the experimentally-measured stress-strain response of the material as well as analysis of the fracture. Further, simulations are then performed to analyze the effect of mesh sensitivity, the effect of fracture of particles on their neighbors, and the role of a particles shape on its fracture probability.
A centrality-based geometry segmentation algorithm was developed to accurately identify discrete inclusions and particles in composite materials where limitations in imaging resolution leads to spurious connections between particles in close contact.To allow for this algorithm to successfully segment geometry independently of particle size and shape, a relative centrality metric was defined to allow for a threshold centrality criterion for removal of voxels that spuriously connect distinct geometries.
To automate incorporation of microstructural information from high-resolution images, two methods were developed that initialize signed distance fields on adaptively-refined finite element meshes. The first method utilizes a level set evolution equation that is directly solved on the finite element mesh through Galerkins method. The evolution equation is formulated to produce a signed distance field that matches geometry defined by a set of voxels segmented from tomographic images. The method achieves optimal convergence for the order of elements used. In a second approach, the fast marching method is employed to initialize a distance field on a uniform grid which is then projected by least squares onto a finite element mesh. This latter approach is shown to be superior in speed and accuracy.
Lastly, extended finite element method simulations are performed for the analysis of particle fracture in metal matrix composites with realistic particle geometries initialized from X-ray tomographic data. In the simulations, particles fracture probabilistically through a Weibull strength distribution. The model is verified through comparisons with the experimentally-measured stress-strain response of the material as well as analysis of the fracture. Further, simulations are then performed to analyze the effect of mesh sensitivity, the effect of fracture of particles on their neighbors, and the role of a particles shape on its fracture probability.
ContributorsYuan, Rui (Author) / Oswald, Jay (Thesis advisor) / Chawla, Nikhilesh (Committee member) / Liu, Yongming (Committee member) / Solanki, Kiran (Committee member) / Chen, Kangping (Committee member) / Arizona State University (Publisher)
Created2015
Description
For decades, microelectronics manufacturing has been concerned with failures related to electromigration phenomena in conductors experiencing high current densities. The influence of interconnect microstructure on device failures related to electromigration in BGA and flip chip solder interconnects has become a significant interest with reduced individual solder interconnect volumes. A survey indicates that x-ray computed micro-tomography (µXCT) is an emerging, novel means for characterizing the microstructures' role in governing electromigration failures. This work details the design and construction of a lab-scale µXCT system to characterize electromigration in the Sn-0.7Cu lead-free solder system by leveraging in situ imaging.
In order to enhance the attenuation contrast observed in multi-phase material systems, a modeling approach has been developed to predict settings for the controllable imaging parameters which yield relatively high detection rates over the range of x-ray energies for which maximum attenuation contrast is expected in the polychromatic x-ray imaging system. In order to develop this predictive tool, a model has been constructed for the Bremsstrahlung spectrum of an x-ray tube, and calculations for the detector's efficiency over the relevant range of x-ray energies have been made, and the product of emitted and detected spectra has been used to calculate the effective x-ray imaging spectrum. An approach has also been established for filtering `zinger' noise in x-ray radiographs, which has proven problematic at high x-ray energies used for solder imaging. The performance of this filter has been compared with a known existing method and the results indicate a significant increase in the accuracy of zinger filtered radiographs.
The obtained results indicate the conception of a powerful means for the study of failure causing processes in solder systems used as interconnects in microelectronic packaging devices. These results include the volumetric quantification of parameters which are indicative of both electromigration tolerance of solders and the dominant mechanisms for atomic migration in response to current stressing. This work is aimed to further the community's understanding of failure-causing electromigration processes in industrially relevant material systems for microelectronic interconnect applications and to advance the capability of available characterization techniques for their interrogation.
In order to enhance the attenuation contrast observed in multi-phase material systems, a modeling approach has been developed to predict settings for the controllable imaging parameters which yield relatively high detection rates over the range of x-ray energies for which maximum attenuation contrast is expected in the polychromatic x-ray imaging system. In order to develop this predictive tool, a model has been constructed for the Bremsstrahlung spectrum of an x-ray tube, and calculations for the detector's efficiency over the relevant range of x-ray energies have been made, and the product of emitted and detected spectra has been used to calculate the effective x-ray imaging spectrum. An approach has also been established for filtering `zinger' noise in x-ray radiographs, which has proven problematic at high x-ray energies used for solder imaging. The performance of this filter has been compared with a known existing method and the results indicate a significant increase in the accuracy of zinger filtered radiographs.
The obtained results indicate the conception of a powerful means for the study of failure causing processes in solder systems used as interconnects in microelectronic packaging devices. These results include the volumetric quantification of parameters which are indicative of both electromigration tolerance of solders and the dominant mechanisms for atomic migration in response to current stressing. This work is aimed to further the community's understanding of failure-causing electromigration processes in industrially relevant material systems for microelectronic interconnect applications and to advance the capability of available characterization techniques for their interrogation.
ContributorsMertens, James Charles Edwin (Author) / Chawla, Nikhilesh (Thesis advisor) / Alford, Terry (Committee member) / Jiao, Yang (Committee member) / Neithalath, Narayanan (Committee member) / Arizona State University (Publisher)
Created2015