ASU Electronic Theses and Dissertations
This collection includes most of the ASU Theses and Dissertations from 2011 to present. ASU Theses and Dissertations are available in downloadable PDF format; however, a small percentage of items are under embargo. Information about the dissertations/theses includes degree information, committee members, an abstract, supporting data or media.
In addition to the electronic theses found in the ASU Digital Repository, ASU Theses and Dissertations can be found in the ASU Library Catalog.
Dissertations and Theses granted by Arizona State University are archived and made available through a joint effort of the ASU Graduate College and the ASU Libraries. For more information or questions about this collection contact or visit the Digital Repository ETD Library Guide or contact the ASU Graduate College at gradformat@asu.edu.
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- All Subjects: Reliability
- Creators: Alford, Terry
Description
Stress-related failure such as cracking are an important photovoltaic (PV) reliability issue since it accounts for a high percentage of power losses in the midlife-failure and wear-out failure regimes. Cell cracking can only be correlated with module degradation when cracks are of detectable size and detrimental to the performance. Several techniques have been explored to access the deflection and stress status on solar cell, but they have disadvantages such as high surface sensitivity.
This dissertation presents a new and non-destructive method for mapping the deflection on encapsulated solar cells using X-ray topography (XRT). This method is based on Bragg diffraction imaging, where only the areas that meet diffraction conditions will present contrast. By taking XRT images of the solar cell at various sample positions and applying an in-house developed algorithm framework, the cell‘s deflection map is obtained. Error analysis has demonstrated that the errors from the experiment and the data processing are below 4.4 and 3.3%.
Von Karman plate theory has been applied to access the stress state of the solar cells. Under the assumptions that the samples experience pure bending and plain stress conditions, the principal stresses are obtained from the cell deflection data. Results from a statistical analysis using a Weibull distribution suggest that 0.1% of the data points can contribute to critical failure. Both the soldering and lamination processes put large amounts of stress on solar cells. Even though glass/glass packaging symmetry is preferred over glass/backsheet, the solar cells inside the glass/glass packaging experience significantly more stress. Through a series of in-situ four-point bending test, the assumptions behind Von Karman theory are validated for cases where the neutral plane is displaced by the tensile and compressive stresses.
The deflection and stress mapping method is applied to two next generation PV concepts named Flex-circuit and PVMirror. The Flex-circuit module concept replaces traditional metal ribbons with Al foils for electrical contact and PVMirror concept utilizes a curved PV module design with a dichroic film for thermal storage and electrical output. The XRT framework proposed in this dissertation successfully characterized the impact of various novel interconnection and packaging solutions.
This dissertation presents a new and non-destructive method for mapping the deflection on encapsulated solar cells using X-ray topography (XRT). This method is based on Bragg diffraction imaging, where only the areas that meet diffraction conditions will present contrast. By taking XRT images of the solar cell at various sample positions and applying an in-house developed algorithm framework, the cell‘s deflection map is obtained. Error analysis has demonstrated that the errors from the experiment and the data processing are below 4.4 and 3.3%.
Von Karman plate theory has been applied to access the stress state of the solar cells. Under the assumptions that the samples experience pure bending and plain stress conditions, the principal stresses are obtained from the cell deflection data. Results from a statistical analysis using a Weibull distribution suggest that 0.1% of the data points can contribute to critical failure. Both the soldering and lamination processes put large amounts of stress on solar cells. Even though glass/glass packaging symmetry is preferred over glass/backsheet, the solar cells inside the glass/glass packaging experience significantly more stress. Through a series of in-situ four-point bending test, the assumptions behind Von Karman theory are validated for cases where the neutral plane is displaced by the tensile and compressive stresses.
The deflection and stress mapping method is applied to two next generation PV concepts named Flex-circuit and PVMirror. The Flex-circuit module concept replaces traditional metal ribbons with Al foils for electrical contact and PVMirror concept utilizes a curved PV module design with a dichroic film for thermal storage and electrical output. The XRT framework proposed in this dissertation successfully characterized the impact of various novel interconnection and packaging solutions.
ContributorsMeng, Xiaodong (Author) / Bertoni, Marian I (Thesis advisor) / Meier, Rico (Committee member) / Holman, Zachary C (Committee member) / Alford, Terry (Committee member) / Arizona State University (Publisher)
Created2019
Description
An ongoing effort in the photovoltaic (PV) industry is to reduce the major manufacturing cost components of solar cells, the great majority of which are based on crystalline silicon (c-Si). This includes the substitution of screenprinted silver (Ag) cell contacts with alternative copper (Cu)-based contacts, usually applied with plating. Plated Cu contact schemes have been under study for many years with only minor traction in industrial production. One of the more commonly-cited barriers to the adoption of Cu-based contacts for photovoltaics is long-term reliability, as Cu is a significant contaminant in c-Si, forming precipitates that degrade performance via degradation of diode character and reduction of minority carrier lifetime. Cu contamination from contacts might cause degradation during field deployment if Cu is able to ingress into c-Si. Furthermore, Cu contamination is also known to cause a form of light-induced degradation (LID) which further degrades carrier lifetime when cells are exposed to light.
Prior literature on Cu-contact reliability tended to focus on accelerated testing at the cell and wafer level that may not be entirely replicative of real-world environmental stresses in PV modules. This thesis is aimed at advancing the understanding of Cu-contact reliability from the perspective of quasi-commercial modules under more realistic stresses. In this thesis, c-Si solar cells with Cu-plated contacts are fabricated, made into PV modules, and subjected to environmental stress in an attempt to induce hypothesized failure modes and understand any new vulnerabilities that Cu contacts might introduce. In particular, damp heat stress is applied to conventional, p-type c-Si modules and high efficiency, n-type c-Si heterojunction modules. I present evidence of Cu-induced diode degradation that also depends on PV module materials, as well as degradation unrelated to Cu, and in either case suggest engineering solutions to the observed degradation. In a forensic search for degradation mechanisms, I present novel evidence of Cu outdiffusion from contact layers and encapsulant-driven contact corrosion as potential key factors. Finally, outdoor exposures to light uncover peculiarities in Cu-plated samples, but do not point to especially serious vulnerabilities.
Prior literature on Cu-contact reliability tended to focus on accelerated testing at the cell and wafer level that may not be entirely replicative of real-world environmental stresses in PV modules. This thesis is aimed at advancing the understanding of Cu-contact reliability from the perspective of quasi-commercial modules under more realistic stresses. In this thesis, c-Si solar cells with Cu-plated contacts are fabricated, made into PV modules, and subjected to environmental stress in an attempt to induce hypothesized failure modes and understand any new vulnerabilities that Cu contacts might introduce. In particular, damp heat stress is applied to conventional, p-type c-Si modules and high efficiency, n-type c-Si heterojunction modules. I present evidence of Cu-induced diode degradation that also depends on PV module materials, as well as degradation unrelated to Cu, and in either case suggest engineering solutions to the observed degradation. In a forensic search for degradation mechanisms, I present novel evidence of Cu outdiffusion from contact layers and encapsulant-driven contact corrosion as potential key factors. Finally, outdoor exposures to light uncover peculiarities in Cu-plated samples, but do not point to especially serious vulnerabilities.
ContributorsKaras, Joseph (Author) / Bowden, Stuart (Thesis advisor) / Alford, Terry (Thesis advisor) / Tamizhmani, Govindasamy (Committee member) / Michaelson, Lynne (Committee member) / Arizona State University (Publisher)
Created2020