This collection includes most of the ASU Theses and Dissertations from 2011 to present. ASU Theses and Dissertations are available in downloadable PDF format; however, a small percentage of items are under embargo. Information about the dissertations/theses includes degree information, committee members, an abstract, supporting data or media.

In addition to the electronic theses found in the ASU Digital Repository, ASU Theses and Dissertations can be found in the ASU Library Catalog.

Dissertations and Theses granted by Arizona State University are archived and made available through a joint effort of the ASU Graduate College and the ASU Libraries. For more information or questions about this collection contact or visit the Digital Repository ETD Library Guide or contact the ASU Graduate College at gradformat@asu.edu.

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Description
Aluminum alloys and their composites are attractive materials for applications requiring high strength-to-weight ratios and reasonable cost. Many of these applications, such as those in the aerospace industry, undergo fatigue loading. An understanding of the microstructural damage that occurs in these materials is critical in assessing their fatigue resistance. Two

Aluminum alloys and their composites are attractive materials for applications requiring high strength-to-weight ratios and reasonable cost. Many of these applications, such as those in the aerospace industry, undergo fatigue loading. An understanding of the microstructural damage that occurs in these materials is critical in assessing their fatigue resistance. Two distinct experimental studies were performed to further the understanding of fatigue damage mechanisms in aluminum alloys and their composites, specifically fracture and plasticity. Fatigue resistance of metal matrix composites (MMCs) depends on many aspects of composite microstructure. Fatigue crack growth behavior is particularly dependent on the reinforcement characteristics and matrix microstructure. The goal of this work was to obtain a fundamental understanding of fatigue crack growth behavior in SiC particle-reinforced 2080 Al alloy composites. In situ X-ray synchrotron tomography was performed on two samples at low (R=0.1) and at high (R=0.6) R-ratios. The resulting reconstructed images were used to obtain three-dimensional (3D) rendering of the particles and fatigue crack. Behaviors of the particles and crack, as well as their interaction, were analyzed and quantified. Four-dimensional (4D) visual representations were constructed to aid in the overall understanding of damage evolution. During fatigue crack growth in ductile materials, a plastic zone is created in the region surrounding the crack tip. Knowledge of the plastic zone is important for the understanding of fatigue crack formation as well as subsequent growth behavior. The goal of this work was to quantify the 3D size and shape of the plastic zone in 7075 Al alloys. X-ray synchrotron tomography and Laue microdiffraction were used to non-destructively characterize the volume surrounding a fatigue crack tip. The precise 3D crack profile was segmented from the reconstructed tomography data. Depth-resolved Laue patterns were obtained using differential-aperture X-ray structural microscopy (DAXM), from which peak-broadening characteristics were quantified. Plasticity, as determined by the broadening of diffracted peaks, was mapped in 3D. Two-dimensional (2D) maps of plasticity were directly compared to the corresponding tomography slices. A 3D representation of the plastic zone surrounding the fatigue crack was generated by superimposing the mapped plasticity on the 3D crack profile.
ContributorsHruby, Peter (Author) / Chawla, Nikhilesh (Thesis advisor) / Solanki, Kiran (Committee member) / Liu, Yongming (Committee member) / Arizona State University (Publisher)
Created2014
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Description
Special thermal interface materials are required for connecting devices that operate at high temperatures up to 300°C. Because devices used in power electronics, such as GaN, SiC, and other wide bandgap semiconductors, can reach very high temperatures (beyond 250°C), a high melting point, and high thermal & electrical conductivity are

Special thermal interface materials are required for connecting devices that operate at high temperatures up to 300°C. Because devices used in power electronics, such as GaN, SiC, and other wide bandgap semiconductors, can reach very high temperatures (beyond 250°C), a high melting point, and high thermal & electrical conductivity are required for the thermal interface material. Traditional solder materials for packaging cannot be used for these applications as they do not meet these requirements. Sintered nano-silver is a good candidate on account of its high thermal and electrical conductivity and very high melting point. The high temperature operating conditions of these devices lead to very high thermomechanical stresses that can adversely affect performance and also lead to failure. A number of these devices are mission critical and, therefore, there is a need for very high reliability. Thus, computational and nondestructive techniques and design methodology are needed to determine, characterize, and design the packages. Actual thermal cycling tests can be very expensive and time consuming. It is difficult to build test vehicles in the lab that are very close to the production level quality and therefore making comparisons or making predictions becomes a very difficult exercise. Virtual testing using a Finite Element Analysis (FEA) technique can serve as a good alternative. In this project, finite element analysis is carried out to help achieve this objective. A baseline linear FEA is performed to determine the nature and magnitude of stresses and strains that occur during the sintering step. A nonlinear coupled thermal and mechanical analysis is conducted for the sintering step to study the behavior more accurately and in greater detail. Damage and fatigue analysis are carried out for multiple thermal cycling conditions. The results are compared with the actual results from a prior study. A process flow chart outlining the FEA modeling process is developed as a template for the future work. A Coffin-Manson type relationship is developed to help determine the accelerated aging conditions and predict life for different service conditions.
ContributorsAmla, Tarun (Author) / Chawla, Nikhilesh (Thesis advisor) / Jiao, Yang (Committee member) / Liu, Yongming (Committee member) / Zhuang, Houlong (Committee member) / Jiang, Hanqing (Committee member) / Arizona State University (Publisher)
Created2020