ASU Electronic Theses and Dissertations
This collection includes most of the ASU Theses and Dissertations from 2011 to present. ASU Theses and Dissertations are available in downloadable PDF format; however, a small percentage of items are under embargo. Information about the dissertations/theses includes degree information, committee members, an abstract, supporting data or media.
In addition to the electronic theses found in the ASU Digital Repository, ASU Theses and Dissertations can be found in the ASU Library Catalog.
Dissertations and Theses granted by Arizona State University are archived and made available through a joint effort of the ASU Graduate College and the ASU Libraries. For more information or questions about this collection contact or visit the Digital Repository ETD Library Guide or contact the ASU Graduate College at gradformat@asu.edu.
Displaying 1 - 2 of 2
Filtering by
- All Subjects: diffraction
- Creators: Yu, Hongbin
Description
In this work, a highly sensitive strain sensing technique is developed to realize in-plane strain mapping for microelectronic packages or emerging flexible or foldable devices, where mechanical or thermal strain is a major concern that could affect the performance of the working devices or even lead to the failure of the devices. Therefore strain sensing techniques to create a contour of the strain distribution is desired.
The developed highly sensitive micro-strain sensing technique differs from the existing strain mapping techniques, such as digital image correlation (DIC)/micro-Moiré techniques, in terms of working mechanism, by filling a technology gap that requires high spatial resolution while simultaneously maintaining a large field-of-view. The strain sensing mechanism relies on the scanning of a tightly focused laser beam onto the grating that is on the sample surface to detect the change in the diffracted beam angle as a result of the strain. Gratings are fabricated on the target substrates to serve as strain sensors, which carries the strain information in the form of variations in the grating period. The geometric structure of the optical system inherently ensures the high sensitivity for the strain sensing, where the nanoscale change of the grating period is amplified by almost six orders into a diffraction peak shift on the order of several hundred micrometers. It significantly amplifies the small signal measurements so that the desired sensitivity and accuracy can be achieved.
The important features, such as strain sensitivity and spatial resolution, for the strain sensing technique are investigated to evaluate the technique. The strain sensitivity has been validated by measurements on homogenous materials with well known reference values of CTE (coefficient of thermal expansion). 10 micro-strain has been successfully resolved from the silicon CTE extraction measurements. Furthermore, the spatial resolution has been studied on predefined grating patterns, which are assembled to mimic the uneven strain distribution across the sample surface. A resolvable feature size of 10 µm has been achieved with an incident laser spot size of 50 µm in diameter.
In addition, the strain sensing technique has been applied to a composite sample made of SU8 and silicon, as well as the microelectronic packages for thermal strain mappings.
The developed highly sensitive micro-strain sensing technique differs from the existing strain mapping techniques, such as digital image correlation (DIC)/micro-Moiré techniques, in terms of working mechanism, by filling a technology gap that requires high spatial resolution while simultaneously maintaining a large field-of-view. The strain sensing mechanism relies on the scanning of a tightly focused laser beam onto the grating that is on the sample surface to detect the change in the diffracted beam angle as a result of the strain. Gratings are fabricated on the target substrates to serve as strain sensors, which carries the strain information in the form of variations in the grating period. The geometric structure of the optical system inherently ensures the high sensitivity for the strain sensing, where the nanoscale change of the grating period is amplified by almost six orders into a diffraction peak shift on the order of several hundred micrometers. It significantly amplifies the small signal measurements so that the desired sensitivity and accuracy can be achieved.
The important features, such as strain sensitivity and spatial resolution, for the strain sensing technique are investigated to evaluate the technique. The strain sensitivity has been validated by measurements on homogenous materials with well known reference values of CTE (coefficient of thermal expansion). 10 micro-strain has been successfully resolved from the silicon CTE extraction measurements. Furthermore, the spatial resolution has been studied on predefined grating patterns, which are assembled to mimic the uneven strain distribution across the sample surface. A resolvable feature size of 10 µm has been achieved with an incident laser spot size of 50 µm in diameter.
In addition, the strain sensing technique has been applied to a composite sample made of SU8 and silicon, as well as the microelectronic packages for thermal strain mappings.
ContributorsLiang, Hanshuang (Author) / Yu, Hongbin (Thesis advisor) / Poon, Poh Chieh Benny (Committee member) / Jiang, Hanqing (Committee member) / Zhang, Yong-Hang (Committee member) / Arizona State University (Publisher)
Created2014
Description
Though a single mode of energy transfer, optical radiation meaningfully interacts with its surrounding environment at over a wide range of physical length scales. For this reason, its reconstruction and measurement are of great importance in remote sensing, as these multi-scale interactions encode a great deal of information about distant objects, surfaces, and physical phenomena. For some remote sensing applications, obtaining a desired quantity of interest does not necessitate the explicit mapping of each point in object space to an image space with lenses or mirrors. Instead, only edge rays or physical boundaries of the sensing instrument are considered, while the spatial intensity distribution of optical energy received from a distant object informs its position, optical characteristics, or physical/chemical state.
Admittedly specialized, the principals and consequences of non-imaging optics are nevertheless applicable to heterogeneous semiconductor integration and automotive light detection and ranging (LiDAR), two important emerging technologies. Indeed, a review of relevant engineering literature finds two under-addressed remote sensing challenges. The semiconductor industry lacks an optical strain metrology with displacement resolution smaller than 100 nanometers capable of measuring strain fields between high-density interconnect lines. Meanwhile, little attention is paid to the per-meter sensing characteristics of scene-illuminating flash LiDAR in the context of automotive applications, despite the technology’s much lower cost. It is here that non-imaging optics offers intriguing instrument design and explanations of observed sensor performance at vastly different length scales.
In this thesis, an effective non-contact technique for mapping nanoscale mechanical strain fields and out-of-plane surface warping via laser diffraction is demonstrated, with application as a novel metrology for next-generation semiconductor packages. Additionally, object detection distance of low-cost automotive flash LiDAR, on the order of tens of meters, is understood though principals of optical energy transfer from the surface of a remote object to an extended multi-segment detector. Such information is of consequence when designing an automotive perception system to recognize various roadway objects in low-light scenarios.
Admittedly specialized, the principals and consequences of non-imaging optics are nevertheless applicable to heterogeneous semiconductor integration and automotive light detection and ranging (LiDAR), two important emerging technologies. Indeed, a review of relevant engineering literature finds two under-addressed remote sensing challenges. The semiconductor industry lacks an optical strain metrology with displacement resolution smaller than 100 nanometers capable of measuring strain fields between high-density interconnect lines. Meanwhile, little attention is paid to the per-meter sensing characteristics of scene-illuminating flash LiDAR in the context of automotive applications, despite the technology’s much lower cost. It is here that non-imaging optics offers intriguing instrument design and explanations of observed sensor performance at vastly different length scales.
In this thesis, an effective non-contact technique for mapping nanoscale mechanical strain fields and out-of-plane surface warping via laser diffraction is demonstrated, with application as a novel metrology for next-generation semiconductor packages. Additionally, object detection distance of low-cost automotive flash LiDAR, on the order of tens of meters, is understood though principals of optical energy transfer from the surface of a remote object to an extended multi-segment detector. Such information is of consequence when designing an automotive perception system to recognize various roadway objects in low-light scenarios.
ContributorsHoughton, Todd Kristopher (Author) / Yu, Hongbin (Thesis advisor) / Jiang, Hanqing (Committee member) / Jayasuriya, Suren (Committee member) / Zhang, Liang (Committee member) / Arizona State University (Publisher)
Created2020