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Thermal management of electronics is critical to meet the increasing demand for high power and performance. Thermal interface materials (TIMs) play a key role in dissipating heat away from the microelectronic chip and hence are a crucial component in electronics cooling. Challenges persist with overcoming the interfacial boundary resistance and

Thermal management of electronics is critical to meet the increasing demand for high power and performance. Thermal interface materials (TIMs) play a key role in dissipating heat away from the microelectronic chip and hence are a crucial component in electronics cooling. Challenges persist with overcoming the interfacial boundary resistance and filler particle connectivity in TIMs to achieve thermal percolation while maintaining mechanical compliance. Gallium-based liquid metal (LM) capsules offer a unique set of thermal-mechanical characteristics that make them suitable candidates for high-performance TIM fillers. This dissertation research focuses on resolving the fundamental challenges posed by integration of LM fillers in polymer matrix. First, the rupture mechanics of LM capsules under pressure is identified as a key factor that dictates the thermal connectivity between LM-based fillers. This mechanism of oxide “popping” in LM particle beds independent of the matrix material provides insights in overcoming the particle-particle connectivity challenges. Second, the physical barrier introduced due to the polymer matrix needs to be overcome to achieve thermal percolation. Matrix fluid viscosity impacts thermal transport, with high viscosity uncured matrix inhibiting the thermal bridging of fillers. In addition, incorporation of solid metal co-fillers that react with LM fillers is adopted to facilitate popping of LM oxide in uncured polymer to overcome this matrix barrier. Solid silver metal additives are used to rupture the LM oxide, form inter-metallic alloy (IMC), and act as thermal anchors within the matrix. This results in the formation of numerous thermal percolation paths and hence enhances heat transport within the composite. Further, preserving this microstructure of interconnected multiphase filler system with thermally conductive percolation pathways in a cured polymer matrix is critical to designing high-performing TIM pads. Viscosity of the precursor polymer solution prior to curing plays a major role in the resulting thermal conductivity. A multipronged strategy is developed that synergistically combines reactive solid and liquid fillers, a polymer matrix with low pre-cure viscosity, and mechanical compression during thermal curing. The results of this dissertation aim to provide fundamental insights into the integration of LMs in polymer composites and give design knobs to develop high thermally conducting soft composites.
ContributorsUppal, Aastha (Author) / Rykaczewski, Konrad (Thesis advisor) / Wang, Robert (Thesis advisor) / Kwon, Beomjin (Committee member) / Choksi, Gaurang (Committee member) / Phelan, Patrick (Committee member) / Arizona State University (Publisher)
Created2022
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Description
Soft thermal interface materials (TIMs) are critical for improving the thermal management of advanced microelectronic devices. Despite containing high thermal conductivity filler materials, TIM performance is limited by thermal resistances between fillers, filler-matrix, and external contact resistance. Recently, room-temperature liquid metals (LMs) started to be adapted as an alternative TIM

Soft thermal interface materials (TIMs) are critical for improving the thermal management of advanced microelectronic devices. Despite containing high thermal conductivity filler materials, TIM performance is limited by thermal resistances between fillers, filler-matrix, and external contact resistance. Recently, room-temperature liquid metals (LMs) started to be adapted as an alternative TIM for their low thermal resistance and fluidic nature. However, LM-based TIMs face challenges due to their low viscosity, non-wetting qualities, chemical reactivity, and corrosiveness towards aluminum.To address these concerns, this dissertation research investigates fundamental LM properties and assesses their utility for developing multiphase LM composites with strong thermal properties. Augmentation of LM with gallium oxide and air capsules lead to LM-base foams with improved spreading and patterning. Gallium oxides are responsible for stabilizing LM foam structures which is observed through electron microscopy, revealing a temporal evolution of air voids after shear mixing in air. The presence of air bubbles and oxide fragments in LM decreases thermal conductivity while increasing its viscosity as the shear mixing time is prolonged. An overall mechanism for foam generation in LM is presented in two stages: 1) oxide fragment accumulation and 2) air bubble entrapment and propagation. To avoid the low thermal conductivity air content, mixing of non-reactive particles of tungsten or silicon carbide (SiC) into LM forms paste-like LM-based mixtures that exhibit tunable high thermal conductivity 2-3 times beyond the matrix material. These filler materials remain chemically stable and do not react with LM over time while suspended. Gallium oxide-mediated wetting mechanisms for these non-wetting fillers are elucidated in oxygen rich and deficient environments. Three-phase composites consisting of LM and Ag-coated SiC fillers dispersed in a noncuring silicone oil matrix address LM-corrosion related issues. Ag-coated SiC particles enable improved wetting of the LM, and the results show that applied pressure is necessary for bridging of these LM-coated particles to improve filler thermal resistance. Compositional tuning between the fillers leads to thermal improvements in this multiphase composite. The results of this dissertation work aim to advance our current understanding of LMs and how to design LM-based composite materials for improved TIMs and other soft thermal applications.
ContributorsKong, Wilson (Author) / Wang, Robert Y (Thesis advisor) / Rykaczewski, Konrad (Thesis advisor) / Green, Matthew D (Committee member) / Tongay, Sefaattin (Committee member) / Arizona State University (Publisher)
Created2021