Matching Items (20)
Description
Asymptotic and Numerical methods are popular in applied electromagnetism. In this work, the two methods are applied for collimated antennas and calibration targets, respectively. As an asymptotic method, the diffracted Gaussian beam approach (DGBA) is developed for design and simulation of collimated multi-reflector antenna systems, based upon Huygens principle and independent Gaussian beam expansion, referred to as the frames. To simulate a reflector antenna in hundreds to thousands of wavelength, it requires 1E7 - 1E9 independent Gaussian beams. To this end, high performance parallel computing is implemented, based on Message Passing Interface (MPI). The second part of the dissertation includes the plane wave scattering from a target consisting of doubly periodic array of sharp conducting circular cones by the magnetic field integral equation (MFIE) via Coiflet based Galerkin's procedure in conjunction with the Floquet theorem. Owing to the orthogonally, compact support, continuity and smoothness of the Coiflets, well-conditioned impedance matrices are obtained. Majority of the matrix entries are obtained in the spectral domain by one-point quadrature with high precision. For the oscillatory entries, spatial domain computation is applied, bypassing the slow convergence of the spectral summation of the non-damping propagating modes. The simulation results are compared with the solutions from an RWG-MLFMA based commercial software, FEKO, and excellent agreement is observed.
ContributorsWang, Le, 1975- (Author) / Pan, George (Thesis advisor) / Yu, Hongyu (Committee member) / Aberle, James T., 1961- (Committee member) / Diaz, Rodolfo (Committee member) / Kitchen, Jennifer (Committee member) / Arizona State University (Publisher)
Created2012
Description
Wide spread adoption of photovoltaic technology is limited by cost. Developing photovoltaics based on low-cost materials and processing techniques is one strategy for reducing the cost of electricity generated by photovoltaics. With this in mind, novel porphyrin and porphyrin-fullerene electropolymers have been developed here at Arizona State University. Porphyrins are attractive for inclusion in the light absorbing layer of photovoltaics due to their high absorption coefficients (on the order of 105 cm-1) and porphyrin-fullerene dyads are attractive for use in photovoltaics due to their ability to produce ultrafast photoinduced charge separation (on the order of 10-15 s). The focus of this thesis is the characterization of the photovoltaic properties of these electropolymer films. Films formed on transparent conductive oxide (TCO) substrates were contacted using a mercury drop electrode in order to measure photocurrent spectra and current-voltage curves. Surface treatment of both the TCO substrate and the mercury drop is shown to have a dramatic effect on the photovoltaic performance of the electropolymer films. Treating the TCO substrates with chlorotrimethylsilane and the mercury drop with hexanethiol was found to produce an optimal tradeoff between photocurrent and photovoltage. Incident photon to current efficiency spectra of the films show that the dominant photocurrent generation mechanism in this system is located at the polymer-mercury interface. The optical field intensity at this interface approaches zero due to interference from the light reflected by the mercury surface. Reliance upon photocurrent generation at this interface limits the performance of this system and suggests that these polymers may be useful in solar cells which have structures optimized to take advantage of their internal optical field distributions.
ContributorsBridgewater, James W (Author) / Gust, Devens (Thesis advisor) / Tao, Nongjian (Thesis advisor) / Gould, Ian (Committee member) / Diaz, Rodolfo (Committee member) / Arizona State University (Publisher)
Created2014
Description
A new loop configuration capable of reducing power radiation magnitudes lower than conventional loops has been developed. This configuration is demonstrated for the case of two coaxial loops of 0.1 meter radius coupled via the magnetic reactive field. Utilizing electromagnetism theory, techniques from antenna design and a new near field design initiative, the ability to design a magnetic field has been investigated by using a full wave simulation tool. The method for realization is initiated from first order physics model, ADS and onto a full wave situation tool for the case of a non-radiating helical loop. The exploration into the design of a magnetic near field while mitigating radiation power is demonstrated using an real number of twists to form a helical wire loop while biasing the integer twisted loop in a non-conventional moebius termination. The helix loop setup as a moebius loop convention can also be expressed as a shorted antenna scheme. The 0.1 meter radius helix antenna is biased with a 1MHz frequency that categorized the antenna loop as electrically small. It is then demonstrated that helical configuration reduces the electric field and mitigates power radiation into the far field. In order to compare the radiated power reduction performance of the helical loop a shielded loop is used as a baseline for comparison. The shielded loop system of the same geometric size and frequency is shown to have power radiation expressed as -46.1 dBm. The power radiated mitigation method of the helix loop reduces the power radiated from the two loop system down to -98.72 dBm.
ContributorsMoreno, Fernando (Author) / Diaz, Rodolfo (Thesis advisor) / Aberle, James T., 1961- (Committee member) / Kozicki, Michael (Committee member) / Arizona State University (Publisher)
Created2015
Description
Semiconductor devices are generally analyzed with relatively simple equations or with detailed computer simulations. Most text-books use these simple equations and show device diagrams that are frequently very simplified and occasionally incorrect. For example, the carrier densities near the pinch-off point in MOSFETs and JFETs and the minority carrier density in the base near the reverse-biased base-collector junction are frequently assumed to be zero or near zero. Also the channel thickness at the pinch-off point is often shown to approach zero. None of these assumptions can be correct. The research in thesis addresses these points. I simulated the carrier densities, potentials, electric fields etc. of MOSFETs, BJTs and JFETs at and near the pinch-off regions to determine exactly what happens there. I also simulated the behavior of the quasi-Fermi levels. For MOSFETs, the channel thickness expands slightly before the pinch-off point and then spreads out quickly in a triangular shape and the space-charge region under the channel actually shrinks as the potential increases from source to drain. For BJTs, with collector-base junction reverse biased, most minority carriers diffuse through the base from emitter to collector very fast, but the minority carrier concentration at the collector-base space-charge region is not zero. For JFETs, the boundaries of the space-charge region are difficult to determine, the channel does not disappear after pinch off, the shape of channel is always tapered, and the carrier concentration in the channel decreases progressively. After simulating traditional sized devices, I also simulated typical nano-scaled devices and show that they behave similarly to large devices. These simulation results provide a more complete understanding of device physics and device operation in those regions usually not addressed in semiconductor device physics books.
ContributorsYang, Xuan (Author) / Schroder, Dieter K. (Thesis advisor) / Vasileska, Dragica (Committee member) / Yu, Hongbin (Committee member) / Arizona State University (Publisher)
Created2011
Description
Programmable metallization cell (PMC) technology is based on an electrochemical phenomenon in which a metallic electrodeposit can be grown or dissolved between two electrodes depending on the voltage applied between them. Devices based on this phenomenon exhibit a unique, self-healing property, as a broken metallic structure can be healed by applying an appropriate voltage between the two broken ends. This work explores methods of fabricating interconnects and switches based on PMC technology on flexible substrates. The objective was the evaluation of the feasibility of using this technology in flexible electronics applications in which reliability is a primary concern. The re-healable property of the interconnect is characterized for the silver doped germanium selenide (Ag-Ge-Se) solid electrolyte system. This property was evaluated by measuring the resistances of the healed interconnect structures and comparing these to the resistances of the unbroken structures. The reliability of the interconnects in both unbroken and healed states is studied by investigating the resistances of the structures to DC voltages, AC voltages and different temperatures as a function of time. This work also explores replacing silver with copper for these interconnects to enhance their reliability. A model for PMC-based switches on flexible substrates is proposed and compared to the observed device behavior with the objective of developing a formal design methodology for these devices. The switches were subjected to voltage sweeps and their resistance was investigated as a function of sweep voltage. The resistance of the switches as a function of voltage pulse magnitude when placed in series with a resistance was also investigated. A model was then developed to explain the behavior of these devices. All observations were based on statistical measurements to account for random errors. The results of this work demonstrate that solid electrolyte based interconnects display self-healing capability, which depends on the applied healing voltage and the current limit. However, they fail at lower current densities than metal interconnects due to an ion-drift induced failure mechanism. The results on the PMC based switches demonstrate that a model comprising a Schottky diode in parallel with a variable resistor predicts the behavior of the device.
ContributorsBaliga, Sunil Ravindranath (Author) / Kozicki, Michael N (Thesis advisor) / Schroder, Dieter K. (Committee member) / Chae, Junseok (Committee member) / Alford, Terry L. (Committee member) / Arizona State University (Publisher)
Created2011
Description
The increased use of commercial complementary metal-oxide-semiconductor (CMOS) technologies in harsh radiation environments has resulted in a new approach to radiation effects mitigation. This approach utilizes simulation to support the design of integrated circuits (ICs) to meet targeted tolerance specifications. Modeling the deleterious impact of ionizing radiation on ICs fabricated in advanced CMOS technologies requires understanding and analyzing the basic mechanisms that result in buildup of radiation-induced defects in specific sensitive regions. Extensive experimental studies have demonstrated that the sensitive regions are shallow trench isolation (STI) oxides. Nevertheless, very little work has been done to model the physical mechanisms that result in the buildup of radiation-induced defects and the radiation response of devices fabricated in these technologies. A comprehensive study of the physical mechanisms contributing to the buildup of radiation-induced oxide trapped charges and the generation of interface traps in advanced CMOS devices is presented in this dissertation. The basic mechanisms contributing to the buildup of radiation-induced defects are explored using a physical model that utilizes kinetic equations that captures total ionizing dose (TID) and dose rate effects in silicon dioxide (SiO2). These mechanisms are formulated into analytical models that calculate oxide trapped charge density (Not) and interface trap density (Nit) in sensitive regions of deep-submicron devices. Experiments performed on field-oxide-field-effect-transistors (FOXFETs) and metal-oxide-semiconductor (MOS) capacitors permit investigating TID effects and provide a comparison for the radiation response of advanced CMOS devices. When used in conjunction with closed-form expressions for surface potential, the analytical models enable an accurate description of radiation-induced degradation of transistor electrical characteristics. In this dissertation, the incorporation of TID effects in advanced CMOS devices into surface potential based compact models is also presented. The incorporation of TID effects into surface potential based compact models is accomplished through modifications of the corresponding surface potential equations (SPE), allowing the inclusion of radiation-induced defects (i.e., Not and Nit) into the calculations of surface potential. Verification of the compact modeling approach is achieved via comparison with experimental data obtained from FOXFETs fabricated in a 90 nm low-standby power commercial bulk CMOS technology and numerical simulations of fully-depleted (FD) silicon-on-insulator (SOI) n-channel transistors.
ContributorsSanchez Esqueda, Ivan (Author) / Barnaby, Hugh J (Committee member) / Schroder, Dieter (Thesis advisor) / Schroder, Dieter K. (Committee member) / Holbert, Keith E. (Committee member) / Gildenblat, Gennady (Committee member) / Arizona State University (Publisher)
Created2011
Description
This thesis discusses the evolution of conduction mechanism in the silver (Ag) on zinc oxide (ZnO) thin film system with respect to the Ag morphology. As a plausible substitute for indium tin oxide (ITO), TCO/Metal/TCO (TMT) structure has received a lot of attentions as a prospective ITO substitute due to its low resistivity and desirable transmittance. However, the detailed conduction mechanism is not fully understood. In an attempt to investigate the conduction mechanism of the ZnO/Ag/ZnO thin film system with respect to the Ag microstructure, the top ZnO layer is removed, which offers a better view of Ag morphology by using scanning electron microscopy (SEM). With 2 nm thick Ag layer, it is seen that the Ag forms discrete islands with small islands size (r), but large separation (s); also the effective resistivity of the system is extremely high. This regime is designated as dielectric zone. In this regime, thermionic emission and activated tunneling conduction mechanisms are considered. Based on simulations, when "s" was beyond 6 nm, thermionic emission dominates; with "s" less than 6 nm, activated tunneling is the dominating mechanism. As the Ag thickness increases, the individual islands coalesce and Ag clusters are formed. At certain Ag thickness, there are one or several Ag clusters that percolate the ZnO film, and the effective resistivity of the system exhibits a tremendous drop simultaneously, because the conducting electrons do not need to overcome huge ZnO barrier to transport. This is recognized as percolation zone. As the Ag thickness grows, Ag film becomes more continuous and there are no individual islands left on the surface. The effective resistivity decreases and is comparable to the characteristics of metallic materials, so this regime is categorized as metallic zone. The simulation of the Ag thin film resistivity is performed in terms of Ag thickness, and the experimental data fits the simulation well, which supports the proposed models. Hall measurement and four point probe measurement are carried out to characterize the electrical properties of the thin film system.
ContributorsZhang, Shengke (Author) / Alford, Terry L. (Thesis advisor) / Schroder, Dieter K. (Committee member) / Tasooji, Amaneh (Committee member) / Arizona State University (Publisher)
Created2012
Description
High-Resistivity Silicon (HRS) substrates are important for low-loss, high-performance microwave and millimeter wave devices in high-frequency telecommunication systems. The highest resistivity of up to ~10,000 ohm.cm is Float Zone (FZ) grown Si which is produced in small quantities and moderate wafer diameter. The more common Czochralski (CZ) Si can achieve resistivities of around 1000 ohm.cm, but the wafers contain oxygen that can lead to thermal donor formation with donor concentration significantly higher (~1015 cm-3) than the dopant concentration (~1012-1013 cm-3) of such high-resistivity Si leading to resistivity changes and possible type conversion of high-resistivity p-type silicon. In this research capacitance-voltage (C-V) characterization is employed to study the donor formation and type conversion of p-type High-resistivity Silicon-On-Insulator (HRSOI) wafers and the challenges involved in C-V characterization of HRSOI wafers using a Schottky contact are highlighted. The maximum capacitance of bulk or Silicon-On-Insulator (SOI) wafers is governed by the gate/contact area. During C-V characterization of high-resistivity SOI wafers with aluminum contacts directly on the Si film (Schottky contact); it was observed that the maximum capacitance is much higher than that due to the contact area, suggesting bias spreading due to the distributed transmission line of the film resistance and the buried oxide capacitance. In addition, an "S"-shape C-V plot was observed in the accumulation region. The effects of various factors, such as: frequency, contact and substrate sizes, gate oxide, SOI film thickness, film and substrate doping, carrier lifetime, contact work-function, temperature, light, annealing temperature and radiation on the C-V characteristics of HRSOI wafers are studied. HRSOI wafers have the best crosstalk prevention capability compared to other types of wafers, which plays a major role in system-on-chip configuration to prevent coupling between high frequency digital and sensitive analog circuits. Substrate crosstalk in HRSOI and various factors affecting the crosstalk, such as: substrate resistivity, separation between devices, buried oxide (BOX) thickness, radiation, temperature, annealing, light, and device types are discussed. Also various ways to minimize substrate crosstalk are studied and a new characterization method is proposed. Owing to their very low doping concentrations and the presence of oxygen in CZ wafers, HRS wafers pose a challenge in resistivity measurement using conventional techniques such as four-point probe and Hall measurement methods. In this research the challenges in accurate resistivity measurement using four-point probe, Hall method, and C-V profile are highlighted and a novel approach to extract resistivity of HRS wafers based on Impedance Spectroscopy measurements using polymer dielectrics such as Polystyrene and Poly Methyl Methacrylate (PMMA) is proposed.
ContributorsNayak, Pinakpani (Author) / Schroder, Dieter K. (Thesis advisor) / Vasileska, Dragica (Committee member) / Kozicki, Michael (Committee member) / Aberle, James T., 1961- (Committee member) / Arizona State University (Publisher)
Created2012
Description
Programmable metallization cell (PMC) technology employs the mechanisms of metal ion transport in solid electrolytes (SE) and electrochemical redox reactions in order to form metallic electrodeposits. When a positive bias is applied to an anode opposite to a cathode, atoms at the anode are oxidized to ions and dissolve into the SE. Under the influence of the electric field, the ions move to the cathode and become reduced to form the electrodeposits. These electrodeposits are filamentary in nature and persistent, and since they are metallic can alter the physical characteristics of the material on which they are formed. PMCs can be used as next generation memories, radio frequency (RF) switches and physical unclonable functions (PUFs).
The morphology of the filaments is impacted by the biasing conditions. Under a relatively high applied electric field, they form as dendritic elements with a low fractal dimension (FD), whereas a low electric field leads to high FD features. Ion depletion effects in the SE due to low ion diffusivity/mobility also influences the morphology by limiting the ion supply into the growing electrodeposit.
Ion transport in SE is due to hopping transitions driven by drift and diffusion force. A physical model of ion hopping with Brownian motion has been proposed, in which the ion transitions are random when time window is larger than characteristic time. The random growth process of filaments in PMC adds entropy to the electrodeposition, which leads to random features in the dendritic patterns. Such patterns has extremely high information capacity due to the fractal nature of the electrodeposits.
In this project, lateral-growth PMCs were fabricated, whose LRS resistance is less than 10Ω, which can be used as RF switches. Also, an array of radial-growth PMCs was fabricated, on which multiple dendrites, all with different shapes, could be grown simultaneously. Those patterns can be used as secure keys in PUFs and authentication can be performed by optical scanning.
A kinetic Monte Carlo (KMC) model is developed to simulate the ion transportation in SE under electric field. The simulation results matched experimental data well that validated the ion hopping model.
The morphology of the filaments is impacted by the biasing conditions. Under a relatively high applied electric field, they form as dendritic elements with a low fractal dimension (FD), whereas a low electric field leads to high FD features. Ion depletion effects in the SE due to low ion diffusivity/mobility also influences the morphology by limiting the ion supply into the growing electrodeposit.
Ion transport in SE is due to hopping transitions driven by drift and diffusion force. A physical model of ion hopping with Brownian motion has been proposed, in which the ion transitions are random when time window is larger than characteristic time. The random growth process of filaments in PMC adds entropy to the electrodeposition, which leads to random features in the dendritic patterns. Such patterns has extremely high information capacity due to the fractal nature of the electrodeposits.
In this project, lateral-growth PMCs were fabricated, whose LRS resistance is less than 10Ω, which can be used as RF switches. Also, an array of radial-growth PMCs was fabricated, on which multiple dendrites, all with different shapes, could be grown simultaneously. Those patterns can be used as secure keys in PUFs and authentication can be performed by optical scanning.
A kinetic Monte Carlo (KMC) model is developed to simulate the ion transportation in SE under electric field. The simulation results matched experimental data well that validated the ion hopping model.
ContributorsYu, Weijie (Author) / Kozicki, Michael N (Thesis advisor) / Barnaby, Hugh (Thesis advisor) / Diaz, Rodolfo (Committee member) / Goryll, Michael (Committee member) / Arizona State University (Publisher)
Created2015
Description
As integrated technologies are scaling down, there is an increasing trend in the
process,voltage and temperature (PVT) variations of highly integrated RF systems.
Accounting for these variations during the design phase requires tremendous amount
of time for prediction of RF performance and optimizing it accordingly. Thus, there
is an increasing gap between the need to relax the RF performance requirements at
the design phase for rapid development and the need to provide high performance
and low cost RF circuits that function with PVT variations. No matter how care-
fully designed, RF integrated circuits (ICs) manufactured with advanced technology
nodes necessitate lengthy post-production calibration and test cycles with expensive
RF test instruments. Hence design-for-test (DFT) is proposed for low-cost and fast
measurement of performance parameters during both post-production and in-eld op-
eration. For example, built-in self-test (BIST) is a DFT solution for low-cost on-chip
measurement of RF performance parameters. In this dissertation, three aspects of
automated test and calibration, including DFT mathematical model, BIST hardware
and built-in calibration are covered for RF front-end blocks.
First, the theoretical foundation of a post-production test of RF integrated phased
array antennas is proposed by developing the mathematical model to measure gain
and phase mismatches between antenna elements without any electrical contact. The
proposed technique is fast, cost-efficient and uses near-field measurement of radiated
power from antennas hence, it requires single test setup, it has easy implementation
and it is short in time which makes it viable for industrialized high volume integrated
IC production test.
Second, a BIST model intended for the characterization of I/Q offset, gain and
phase mismatch of IQ transmitters without relying on external equipment is intro-
duced. The proposed BIST method is based on on-chip amplitude measurement as
in prior works however,here the variations in the BIST circuit do not affect the target
parameter estimation accuracy since measurements are designed to be relative. The
BIST circuit is implemented in 130nm technology and can be used for post-production
and in-field calibration.
Third, a programmable low noise amplifier (LNA) is proposed which is adaptable
to different application scenarios depending on the specification requirements. Its
performance is optimized with regards to required specifications e.g. distance, power
consumption, BER, data rate, etc.The statistical modeling is used to capture the
correlations among measured performance parameters and calibration modes for fast
adaptation. Machine learning technique is used to capture these non-linear correlations and build the probability distribution of a target parameter based on measurement results of the correlated parameters. The proposed concept is demonstrated by
embedding built-in tuning knobs in LNA design in 130nm technology. The tuning
knobs are carefully designed to provide independent combinations of important per-
formance parameters such as gain and linearity. Minimum number of switches are
used to provide the desired tuning range without a need for an external analog input.
process,voltage and temperature (PVT) variations of highly integrated RF systems.
Accounting for these variations during the design phase requires tremendous amount
of time for prediction of RF performance and optimizing it accordingly. Thus, there
is an increasing gap between the need to relax the RF performance requirements at
the design phase for rapid development and the need to provide high performance
and low cost RF circuits that function with PVT variations. No matter how care-
fully designed, RF integrated circuits (ICs) manufactured with advanced technology
nodes necessitate lengthy post-production calibration and test cycles with expensive
RF test instruments. Hence design-for-test (DFT) is proposed for low-cost and fast
measurement of performance parameters during both post-production and in-eld op-
eration. For example, built-in self-test (BIST) is a DFT solution for low-cost on-chip
measurement of RF performance parameters. In this dissertation, three aspects of
automated test and calibration, including DFT mathematical model, BIST hardware
and built-in calibration are covered for RF front-end blocks.
First, the theoretical foundation of a post-production test of RF integrated phased
array antennas is proposed by developing the mathematical model to measure gain
and phase mismatches between antenna elements without any electrical contact. The
proposed technique is fast, cost-efficient and uses near-field measurement of radiated
power from antennas hence, it requires single test setup, it has easy implementation
and it is short in time which makes it viable for industrialized high volume integrated
IC production test.
Second, a BIST model intended for the characterization of I/Q offset, gain and
phase mismatch of IQ transmitters without relying on external equipment is intro-
duced. The proposed BIST method is based on on-chip amplitude measurement as
in prior works however,here the variations in the BIST circuit do not affect the target
parameter estimation accuracy since measurements are designed to be relative. The
BIST circuit is implemented in 130nm technology and can be used for post-production
and in-field calibration.
Third, a programmable low noise amplifier (LNA) is proposed which is adaptable
to different application scenarios depending on the specification requirements. Its
performance is optimized with regards to required specifications e.g. distance, power
consumption, BER, data rate, etc.The statistical modeling is used to capture the
correlations among measured performance parameters and calibration modes for fast
adaptation. Machine learning technique is used to capture these non-linear correlations and build the probability distribution of a target parameter based on measurement results of the correlated parameters. The proposed concept is demonstrated by
embedding built-in tuning knobs in LNA design in 130nm technology. The tuning
knobs are carefully designed to provide independent combinations of important per-
formance parameters such as gain and linearity. Minimum number of switches are
used to provide the desired tuning range without a need for an external analog input.
ContributorsShafiee, Maryam (Author) / Ozev, Sule (Thesis advisor) / Diaz, Rodolfo (Committee member) / Ogras, Umit Y. (Committee member) / Bakkaloglu, Bertan (Committee member) / Arizona State University (Publisher)
Created2018