Matching Items (77)
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Description
This thesis is a study of Bandwidth limitation of basestation power amplifier and its Doherty application. Fundamentally, bandwidth of a power amplifier (PA) is limited by both its input and output prematch networks and its Doherty architecture, specifically the impedance inverter between the main and auxiliary amplifier. In this study,

This thesis is a study of Bandwidth limitation of basestation power amplifier and its Doherty application. Fundamentally, bandwidth of a power amplifier (PA) is limited by both its input and output prematch networks and its Doherty architecture, specifically the impedance inverter between the main and auxiliary amplifier. In this study, only the output prematch network and the Doherty architecture follows are being investigated. A new proposed impedance inverter in the Doherty architecture exhibits an extended bandwidth compared to traditional quarterwave line.

Base on the loadline analysis, output impedance of the power amplifier can be represented by a loadline resistor and an output shunt capacitor. Base on this simple model, the maximum allowed bandwidth of the output impedance of the power amplifier can be estimated using the Bode-Fano method. However, since power amplifier is in fact nonlinear, harmonic balance simulation is used to loadpull the device across a broad range of frequencies. Base on the simulated large signal impedance at maximum power, the prematch circuitry can be designed. On a system level, the prematch power amplifier is used in Doherty amplifier. Two different prematch circuitries, T- section and shunt L methods are investigated along with their comparison in the Doherty architecture at both back off power and peak power condition. The last section of the thesis will be incorporating the proposed impedance inverter structure between the main and auxiliary amplifiers.

The simulated results showed the shunt L prematch topology has the least impedance dispersion across frequency. Along with the new impedance inverter structure, the 65% efficiency bandwidth improves by 50% compared to the original impedance inverter structure at back off power level.
ContributorsYang, Nick (Author) / Pan, George (Committee member) / Aberle, James T (Committee member) / Yu, Hongyu (Committee member) / Arizona State University (Publisher)
Created2014
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Description
Programmable metallization cell (PMC) technology is based on an electrochemical phenomenon in which a metallic electrodeposit can be grown or dissolved between two electrodes depending on the voltage applied between them. Devices based on this phenomenon exhibit a unique, self-healing property, as a broken metallic structure can be healed by

Programmable metallization cell (PMC) technology is based on an electrochemical phenomenon in which a metallic electrodeposit can be grown or dissolved between two electrodes depending on the voltage applied between them. Devices based on this phenomenon exhibit a unique, self-healing property, as a broken metallic structure can be healed by applying an appropriate voltage between the two broken ends. This work explores methods of fabricating interconnects and switches based on PMC technology on flexible substrates. The objective was the evaluation of the feasibility of using this technology in flexible electronics applications in which reliability is a primary concern. The re-healable property of the interconnect is characterized for the silver doped germanium selenide (Ag-Ge-Se) solid electrolyte system. This property was evaluated by measuring the resistances of the healed interconnect structures and comparing these to the resistances of the unbroken structures. The reliability of the interconnects in both unbroken and healed states is studied by investigating the resistances of the structures to DC voltages, AC voltages and different temperatures as a function of time. This work also explores replacing silver with copper for these interconnects to enhance their reliability. A model for PMC-based switches on flexible substrates is proposed and compared to the observed device behavior with the objective of developing a formal design methodology for these devices. The switches were subjected to voltage sweeps and their resistance was investigated as a function of sweep voltage. The resistance of the switches as a function of voltage pulse magnitude when placed in series with a resistance was also investigated. A model was then developed to explain the behavior of these devices. All observations were based on statistical measurements to account for random errors. The results of this work demonstrate that solid electrolyte based interconnects display self-healing capability, which depends on the applied healing voltage and the current limit. However, they fail at lower current densities than metal interconnects due to an ion-drift induced failure mechanism. The results on the PMC based switches demonstrate that a model comprising a Schottky diode in parallel with a variable resistor predicts the behavior of the device.
ContributorsBaliga, Sunil Ravindranath (Author) / Kozicki, Michael N (Thesis advisor) / Schroder, Dieter K. (Committee member) / Chae, Junseok (Committee member) / Alford, Terry L. (Committee member) / Arizona State University (Publisher)
Created2011
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Description
This thesis investigated two different thermal flow sensors for intravascular shear stress analysis. They were based on heat transfer principle, which heat convection from the resistively heated element to the flowing fluid was measured as a function of the changes in voltage. For both sensors, the resistively heated elements were

This thesis investigated two different thermal flow sensors for intravascular shear stress analysis. They were based on heat transfer principle, which heat convection from the resistively heated element to the flowing fluid was measured as a function of the changes in voltage. For both sensors, the resistively heated elements were made of Ti/Pt strips with the thickness 0.12 µm and 0.02 µm. The resistance of the sensing element was measured at approximately 1.6-1.7 kohms;. A linear relation between the resistance and temperature was established over the temperature ranging from 22 degree Celsius to 80 degree Celsius and the temperature coefficient of resistance (TCR) was at approximately 0.12 %/degree Celsius. The first thermal flow sensor was one-dimensional (1-D) flexible shear stress sensor. The structure was sensing element sandwiched by a biocompatible polymer "poly-para-xylylene", also known as Parylene, which provided both insulation of electrodes and flexibility of the sensors. A constant-temperature (CT) circuit was designed as the read out circuit based on 0.6 µm CMOS (Complementary metal-oxide-semiconductor) process. The 1-D shear stress sensor suffered from a large measurement error. Because when the sensor was inserted into blood vessels, it was impossible to mount the sensor to the wall as calibrated in micro fluidic channels. According to the previous simulation work, the shear stress was varying and the sensor itself changed the shear stress distribution. We proposed a three-dimensional (3-D) thermal flow sensor, with three-axis of sensing elements integrated in one sensor. It was in the similar shape as a hexagonal prism with diagonal of 1000 µm. On the top of the sensor, there were five bond pads for external wires over 500 µm thick silicon substrate. In each nonadjacent side surface, there was a bended parylene branch with one sensing element. Based on the unique 3-D structure, the sensor was able to obtain data along three axes. With computational fluid dynamics (CFD) model, it is possible to locate the sensor in the blood vessels and give us a better understanding of shear stress distribution in the presence of time-varying component of blood flow and realize more accurate assessment of intravascular convective heat transfer.
ContributorsTang, Rui (Author) / Yu, Hongyu (Thesis advisor) / Jiang, Hanqing (Committee member) / Pan, George (Committee member) / Arizona State University (Publisher)
Created2011
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Description
Negative bias temperature instability (NBTI) and channel hot carrier (CHC) are important reliability issues impacting analog circuit performance and lifetime. Compact reliability models and efficient simulation methods are essential for circuit level reliability prediction. This work proposes a set of compact models of NBTI and CHC effects for analog and

Negative bias temperature instability (NBTI) and channel hot carrier (CHC) are important reliability issues impacting analog circuit performance and lifetime. Compact reliability models and efficient simulation methods are essential for circuit level reliability prediction. This work proposes a set of compact models of NBTI and CHC effects for analog and mixed-signal circuit, and a direct prediction method which is different from conventional simulation methods. This method is applied in circuit benchmarks and evaluated. This work helps with improving efficiency and accuracy of circuit aging prediction.
ContributorsZheng, Rui (Author) / Cao, Yu (Thesis advisor) / Yu, Hongyu (Committee member) / Bakkaloglu, Bertan (Committee member) / Arizona State University (Publisher)
Created2011
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Description
Sensing and controlling current flow is a fundamental requirement for many electronic systems, including power management (DC-DC converters and LDOs), battery chargers, electric vehicles, solenoid positioning, motor control, and power monitoring. Current Shunt Monitor (CSM) systems have various applications for precise current monitoring of those aforementioned applications. CSMs enable current

Sensing and controlling current flow is a fundamental requirement for many electronic systems, including power management (DC-DC converters and LDOs), battery chargers, electric vehicles, solenoid positioning, motor control, and power monitoring. Current Shunt Monitor (CSM) systems have various applications for precise current monitoring of those aforementioned applications. CSMs enable current measurement across an external sense resistor (RS) in series to current flow. Two different types of CSMs designed and characterized in this paper. First design used direct current reading method and the other design used indirect current reading method. Proposed CSM systems can sense power supply current ranging from 1mA to 200mA for the direct current reading topology and from 1mA to 500mA for the indirect current reading topology across a typical board Cu-trace resistance of 1 ohm with less than 10 µV input-referred offset, 0.3 µV/°C offset drift and 0.1% accuracy for both topologies. Proposed systems avoid using a costly zero-temperature coefficient (TC) sense resistor that is normally used in typical CSM systems. Instead, both of the designs used existing Cu-trace on the printed circuit board (PCB) in place of the costly resistor. The systems use chopper stabilization at the front-end amplifier signal path to suppress input-referred offset down to less than 10 µV. Switching current-mode (SI) FIR filtering technique is used at the instrumentation amplifier output to filter out the chopping ripple caused by input offset and flicker noise by averaging half of the phase 1 signal and the other half of the phase 2 signal. In addition, residual offset mainly caused by clock feed-through and charge injection of the chopper switches at the chopping frequency and its multiple frequencies notched out by the since response of the SI-FIR filter. A frequency domain Sigma Delta ADC which is used for the indirect current reading type design enables a digital interface to processor applications with minimally added circuitries to build a simple 1st order Sigma Delta ADC. The CSMs are fabricated on a 0.7µm CMOS process with 3 levels of metal, with maximum Vds tolerance of 8V and operates across a common mode range of 0 to 26V for the direct current reading type and of 0 to 30V for the indirect current reading type achieving less than 10nV/sqrtHz of flicker noise at 100 Hz for both approaches. By using a semi-digital SI-FIR filter, residual chopper offset is suppressed down to 0.5mVpp from a baseline of 8mVpp, which is equivalent to 25dB suppression.
ContributorsYeom, Hyunsoo (Author) / Bakkaloglu, Bertan (Thesis advisor) / Kiaei, Sayfe (Committee member) / Ozev, Sule (Committee member) / Yu, Hongyu (Committee member) / Arizona State University (Publisher)
Created2011
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Description
In this thesis, I present a lab-on-a-chip (LOC) that can separate and detect Escherichia Coli (E. coli) in simulated urine samples for Urinary Tract Infection (UTI) diagnosis. The LOC consists of two (concentration and sensing) chambers connected in series and an integrated impedance detector. The two-chamber approach is designed to

In this thesis, I present a lab-on-a-chip (LOC) that can separate and detect Escherichia Coli (E. coli) in simulated urine samples for Urinary Tract Infection (UTI) diagnosis. The LOC consists of two (concentration and sensing) chambers connected in series and an integrated impedance detector. The two-chamber approach is designed to reduce the non-specific absorption of proteins, e.g. albumin, that potentially co-exist with E. coli in urine. I directly separate E. coli K-12 from a urine cocktail in a concentration chamber containing micro-sized magnetic beads (5 µm in diameter) conjugated with anti-E. coli antibodies. The immobilized E. coli are transferred to a sensing chamber for the impedance measurement. The measurement at the concentration chamber suffers from non-specific absorption of albumin on the gold electrode, which may lead to a false positive response. By contrast, the measured impedance at the sensing chamber shows ~60 kÙ impedance change between 6.4x104 and 6.4x105 CFU/mL, covering the threshold of UTI (105 CFU/mL). The sensitivity of the LOC for detecting E. coli is characterized to be at least 3.4x104 CFU/mL. I also characterized the LOC for different age groups and white blood cell spiked samples. These preliminary data show promising potential for application in portable LOC devices for UTI detection.
ContributorsKim, Sangpyeong (Author) / Chae, Junseok (Thesis advisor) / Phillips, Stephen M. (Committee member) / Blain Christen, Jennifer M. (Committee member) / Arizona State University (Publisher)
Created2011
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Description
Microelectrodes have been used as the neural interface to record brain's neural activities. Most of these electrodes are fixed positioned. Neural signal normally degrades over time due to the body immune response and brain micromotion that move the neurons away from the microelectrode. MEMS technology under SUMMiT VTM processes has

Microelectrodes have been used as the neural interface to record brain's neural activities. Most of these electrodes are fixed positioned. Neural signal normally degrades over time due to the body immune response and brain micromotion that move the neurons away from the microelectrode. MEMS technology under SUMMiT VTM processes has developed miniaturized version of moveable microelectrodes that have the ability to recover the neural signal degradation by searching new cluster of neurons. To move the MEMS microelectrode a combination of four voltage waveforms must be applied to four thermally actuated microactuators. Previous design has used OmneticTM interconnect to transfer the waveforms from the external signal generators to the MEMS device. Unfortunately, the mechanism to attach and detach the OmneticTM interconnect introduce mechanical stress into the brain tissue that often caused raptures in the blood vessel. The goal of this project is to create an integrated System-On-Package Signal Generator that can be implanted on the brain of a rodent. A wireless system and a microcontroller are integrated together with the signal generators. The integrated system can be used to generate a series of voltage waveforms that can be customized to drive an array of MEMS movable microelectrodes when a triggered signal is received wirelessly. 3D stacking technique has been used to develop this Integrated System. 3D stacks lead to several favorable factors, such as (a) reduction in the power consumption of the system, (b) reduction in the overall form-factor of the package, and (c) significant reduction the weight of the package. There are a few challenges that must be overcome in this project, such as a commercially available microcontroller normally have an output voltage of 3.3 V to 5.5 V; however, a voltage of 7 - 8V is required to move the MEMS movable microelectrodes. To acquire higher density neural recording, more number of microelectrodes are needed. In this project, SoP Signal Generator is design to drive independently 3 moveable microelectrodes. Therefore, 12 voltage waveform are required. . However, the use of 12 signal generators is not a workable option since the system will be significantly large. This brings us to the other challenge, the limiting size of the rodent brain. Due to this factor, the SoP Signal Generator has to be deisgned to be able to fit without causing much pressure to the rodent's brain. For the first challenge, which is the limited output voltage of 3.3V on the microcontroller, the RC555 timers are used as an amplifier in addition to generating the signals. Demultiplexers have been for the next challenge, which is the need of 24 waveforms to drive 3 electrodes. For each waveform, 1 demultiplexer is used, making a total of 4 demultiplexers used in the entire system, which is a significant improvement from using 12 signal generators. The last challenge can be approached using 3D system stacking technique as mentioned above. The research aims of this project can be described as follows: (1) the testing and realization of the system part, and the designing of the system in a PCB level, (2) implementing and testing the SoP Signal Generator with the MEMS movable microelectrodes, The final outcome of this project can be used not only for neural applications, but also for more general applications that requires customized signal generations and wireless data transmission.
ContributorsTee, Zikai (Author) / Muthuswamy, Jitendran (Thesis advisor) / Sutanto, Jemmy (Committee member) / Yu, Hongyu (Committee member) / Arizona State University (Publisher)
Created2012
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Description
There is a tremendous need for wireless biological signals acquisition for the microelectrode-based neural interface to reduce the mechanical impacts introduced by wire-interconnects system. Long wire connections impede the ability to continuously record the neural signal for chronic application from the rodent's brain. Furthermore, connecting and/or disconnecting Omnetics interconnects often

There is a tremendous need for wireless biological signals acquisition for the microelectrode-based neural interface to reduce the mechanical impacts introduced by wire-interconnects system. Long wire connections impede the ability to continuously record the neural signal for chronic application from the rodent's brain. Furthermore, connecting and/or disconnecting Omnetics interconnects often introduces mechanical stress which causes blood vessel to rupture and leads to trauma to the brain tissue. Following the initial implantation trauma, glial tissue formation around the microelectrode and may possibly lead to the microelectrode signal degradation. The aim of this project is to design, develop, and test a compact and power efficient integrated system (IS) that is able to (a) wirelessly transmit triggering signal from the computer to the signal generator which supplies voltage waveforms that move the MEMS microelectrodes, (b) wirelessly transmit neural data from the brain to the external computer, and (c) provide an electrical interface for a closed loop control to continuously move the microelectrode till a proper quality of neural signal is achieved. One of the main challenges of this project is the limited data transmission rate of the commercially available wireless system to transmit 400 kbps of digitized neural signals/electrode, which include spikes, local field potential (LFP), and noise. A commercially available Bluetooth module is only capable to transmit at a total of 115 kbps data transfer rate. The approach to this challenge is to digitize the analog neural signal with a lower accuracy ADC to lower the data rate, so that is reasonable to wirelessly transfer neural data of one channel. In addition, due to the limited space and weight bearing capability to the rodent's head, a compact and power efficient integrated system is needed to reduce the packaged volume and power consumption. 3D SoP technology has been used to stack the PCBs in a 3D form-factor, proper routing designs and techniques are implemented to reduce the electrical routing resistances and the parasitic RC delay. It is expected that this 3D design will reduce the power consumption significantly in comparison to the 2D one. The progress of this project is divided into three different phases, which can be outlined as follow: a) Design, develop, and test Bluetooth wireless system to transmit the triggering signal from the computer to the signal generator. The system is designed for three moveable microelectrodes. b) Design, develop, and test Bluetooth wireless system to wirelessly transmit an amplified (200 gain) neural signal from one single electrode to an external computer. c) Design, develop, and test a closed loop control system that continuously moves a microelectrode in searching of an acceptable quality of neural spikes. The outcome of this project can be used not only for the need of neural application but also for a wider and general applications that requires customized signal generations and wireless data transmission.
ContributorsZhou, Li (Author) / Muthuswamy, Jitendran (Thesis advisor) / Sutanto, Jemmy (Thesis advisor) / Yu, Hongyu (Committee member) / Arizona State University (Publisher)
Created2012
Description
Obtaining local electrochemical (EC) information is extremely important for understanding basic surface reactions, and for many applications. Scanning electrochemical microscopy (SECM) can obtain local EC information by scanning a microelectrode across the surface. Although powerful, SECM is slow, the scanning microelectrode may perturb reaction and the measured signal decreases with

Obtaining local electrochemical (EC) information is extremely important for understanding basic surface reactions, and for many applications. Scanning electrochemical microscopy (SECM) can obtain local EC information by scanning a microelectrode across the surface. Although powerful, SECM is slow, the scanning microelectrode may perturb reaction and the measured signal decreases with the size of microelectrode. This thesis demonstrates a new imaging technique based on a principle that is completely different from the conventional EC detection technologies. The technique, referred to as plasmonic-based electrochemical imaging (PECI), images local EC current (both faradaic and non-faradaic) without using a scanning microelectrode. Because PECI response is an optical signal originated from surface plasmon resonance (SPR), PECI is fast and non-invasive and its signal is proportional to incident light intensity, thus does not decrease with the area of interest. A complete theory is developed in this thesis work to describe the relationship between EC current and PECI signal. EC current imaging at various fixed potentials and local cyclic voltammetry methods are developed and demonstrated with real samples. Fast imaging rate (up to 100,000 frames per second) with 0.2×3µm spatial resolution and 0.3 pA detection limit have been achieved. Several PECI applications have been developed to demonstrate the unique strengths of the new imaging technology. For example, trace particles in fingerprint is detected by PECI, a capability that cannot be achieved with the conventional EC technologies. Another example is PECI imaging of EC reaction and interfacial impedance of graphene of different thicknesses. In addition, local square wave voltammetry capability is demonstrated and applied to study local catalytic current of platinum nanoparticle microarray. This thesis also describes a related but different research project that develops a new method to measure surface charge densities of SPR sensor chips, and micro- and nano-particles. A third project of this thesis is to develop a method to expand the conventional SPR detection and imaging technology by including a waveguide mode. This innovation creates a sensitive detection of bulk index of refraction, which overcomes the limitation that the conventional SPR can probe only changes near the sensor surface within ~200 nm.
ContributorsShan, Xiaonan (Author) / Tao, Nongjian (Thesis advisor) / Chae, Junseok (Committee member) / Christen, Jennifer Blain (Committee member) / Hayes, Mark (Committee member) / Arizona State University (Publisher)
Created2011
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Description
A dual-channel directional digital hearing aid (DHA) front-end using a fully differential difference amplifier (FDDA) based Microphone interface circuit (MIC) for a capacitive Micro Electro Mechanical Systems (MEMS) microphones and an adaptive-power analog font end (AFE) is presented. The Microphone interface circuit based on FDDA converts

A dual-channel directional digital hearing aid (DHA) front-end using a fully differential difference amplifier (FDDA) based Microphone interface circuit (MIC) for a capacitive Micro Electro Mechanical Systems (MEMS) microphones and an adaptive-power analog font end (AFE) is presented. The Microphone interface circuit based on FDDA converts the capacitance variations into voltage signal, achieves a noise of 32 dB SPL (sound pressure level) and an SNR of 72 dB, additionally it also performs single to differential conversion allowing for fully differential analog signal chain. The analog front-end consists of 40dB VGA and a power scalable continuous time sigma delta ADC, with 68dB SNR dissipating 67u¬W from a 1.2V supply. The ADC implements a self calibrating feedback DAC, for calibrating the 2nd order non-linearity. The VGA and power scalable ADC is fabricated on 0.25 um CMOS TSMC process. The dual channels of the DHA are precisely matched and achieve about 0.5dB gain mismatch, resulting in greater than 5dB directivity index. This will enable a highly integrated and low power DHA
ContributorsNaqvi, Syed Roomi (Author) / Kiaei, Sayfe (Thesis advisor) / Bakkaloglu, Bertan (Committee member) / Chae, Junseok (Committee member) / Barnby, Hugh (Committee member) / Aberle, James T., 1961- (Committee member) / Arizona State University (Publisher)
Created2011