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- Genre: Doctoral Dissertation
- Status: Published
Description
In recent years we have witnessed a shift towards multi-processor system-on-chips (MPSoCs) to address the demands of embedded devices (such as cell phones, GPS devices, luxury car features, etc.). Highly optimized MPSoCs are well-suited to tackle the complex application demands desired by the end user customer. These MPSoCs incorporate a constellation of heterogeneous processing elements (PEs) (general purpose PEs and application-specific integrated circuits (ASICS)). A typical MPSoC will be composed of a application processor, such as an ARM Coretex-A9 with cache coherent memory hierarchy, and several application sub-systems. Each of these sub-systems are composed of highly optimized instruction processors, graphics/DSP processors, and custom hardware accelerators. Typically, these sub-systems utilize scratchpad memories (SPM) rather than support cache coherency. The overall architecture is an integration of the various sub-systems through a high bandwidth system-level interconnect (such as a Network-on-Chip (NoC)). The shift to MPSoCs has been fueled by three major factors: demand for high performance, the use of component libraries, and short design turn around time. As customers continue to desire more and more complex applications on their embedded devices the performance demand for these devices continues to increase. Designers have turned to using MPSoCs to address this demand. By using pre-made IP libraries designers can quickly piece together a MPSoC that will meet the application demands of the end user with minimal time spent designing new hardware. Additionally, the use of MPSoCs allows designers to generate new devices very quickly and thus reducing the time to market. In this work, a complete MPSoC synthesis design flow is presented. We first present a technique \cite{leary1_intro} to address the synthesis of the interconnect architecture (particularly Network-on-Chip (NoC)). We then address the synthesis of the memory architecture of a MPSoC sub-system \cite{leary2_intro}. Lastly, we present a co-synthesis technique to generate the functional and memory architectures simultaneously. The validity and quality of each synthesis technique is demonstrated through extensive experimentation.
ContributorsLeary, Glenn (Author) / Chatha, Karamvir S (Thesis advisor) / Vrudhula, Sarma (Committee member) / Shrivastava, Aviral (Committee member) / Beraha, Rudy (Committee member) / Arizona State University (Publisher)
Created2013
Description
Multicore processors have proliferated in nearly all forms of computing, from servers, desktop, to smartphones. The primary reason for this large adoption of multicore processors is due to its ability to overcome the power-wall by providing higher performance at a lower power consumption rate. With multi-cores, there is increased need for dynamic energy management (DEM), much more than for single-core processors, as DEM for multi-cores is no more a mechanism just to ensure that a processor is kept under specified temperature limits, but also a set of techniques that manage various processor controls like dynamic voltage and frequency scaling (DVFS), task migration, fan speed, etc. to achieve a stated objective. The objectives span a wide range from maximizing throughput, minimizing power consumption, reducing peak temperature, maximizing energy efficiency, maximizing processor reliability, and so on, along with much more wider constraints of temperature, power, timing, and reliability constraints. Thus DEM can be very complex and challenging to achieve. Since often times many DEMs operate together on a single processor, there is a need to unify various DEM techniques. This dissertation address such a need. In this work, a framework for DEM is proposed that provides a unifying processor model that includes processor power, thermal, timing, and reliability models, supports various DEM control mechanisms, many different objective functions along with equally diverse constraint specifications. Using the framework, a range of novel solutions is derived for instances of DEM problems, that include maximizing processor performance, energy efficiency, or minimizing power consumption, peak temperature under constraints of maximum temperature, memory reliability and task deadlines. Finally, a robust closed-loop controller to implement the above solutions on a real processor platform with a very low operational overhead is proposed. Along with the controller design, a model identification methodology for obtaining the required power and thermal models for the controller is also discussed. The controller is architecture independent and hence easily portable across many platforms. The controller has been successfully deployed on Intel Sandy Bridge processor and the use of the controller has increased the energy efficiency of the processor by over 30%
ContributorsHanumaiah, Vinay (Author) / Vrudhula, Sarma (Thesis advisor) / Chatha, Karamvir (Committee member) / Chakrabarti, Chaitali (Committee member) / Rodriguez, Armando (Committee member) / Askin, Ronald (Committee member) / Arizona State University (Publisher)
Created2013
Description
The space environment comprises cosmic ray particles, heavy ions and high energy electrons and protons. Microelectronic circuits used in space applications such as satellites and space stations are prone to upsets induced by these particles. With transistor dimensions shrinking due to continued scaling, terrestrial integrated circuits are also increasingly susceptible to radiation upsets. Hence radiation hardening is a requirement for microelectronic circuits used in both space and terrestrial applications.
This work begins by exploring the different radiation hardened flip-flops that have been proposed in the literature and classifies them based on the different hardening techniques.
A reduced power delay element for the temporal hardening of sequential digital circuits is presented. The delay element single event transient tolerance is demonstrated by simulations using it in a radiation hardened by design master slave flip-flop (FF). Using the proposed delay element saves up to 25% total FF power at 50% activity factor. The delay element is used in the implementation of an 8-bit, 8051 designed in the TSMC 130 nm bulk CMOS.
A single impinging ionizing radiation particle is increasingly likely to upset multiple circuit nodes and produce logic transients that contribute to the soft error rate in most modern scaled process technologies. The design of flip-flops is made more difficult with increasing multi-node charge collection, which requires that charge storage and other sensitive nodes be separated so that one impinging radiation particle does not affect redundant nodes simultaneously. We describe a correct-by-construction design methodology to determine a-priori which hardened FF nodes must be separated, as well as a general interleaving scheme to achieve this separation. We apply the methodology to radiation hardened flip-flops and demonstrate optimal circuit physical organization for protection against multi-node charge collection.
Finally, the methodology is utilized to provide critical node separation for a new hardened flip-flop design that reduces the power and area by 31% and 35% respectively compared to a temporal FF with similar hardness. The hardness is verified and compared to other published designs via the proposed systematic simulation approach that comprehends multiple node charge collection and tests resiliency to upsets at all internal and input nodes. Comparison of the hardness, as measured by estimated upset cross-section, is made to other published designs. Additionally, the importance of specific circuit design aspects to achieving hardness is shown.
This work begins by exploring the different radiation hardened flip-flops that have been proposed in the literature and classifies them based on the different hardening techniques.
A reduced power delay element for the temporal hardening of sequential digital circuits is presented. The delay element single event transient tolerance is demonstrated by simulations using it in a radiation hardened by design master slave flip-flop (FF). Using the proposed delay element saves up to 25% total FF power at 50% activity factor. The delay element is used in the implementation of an 8-bit, 8051 designed in the TSMC 130 nm bulk CMOS.
A single impinging ionizing radiation particle is increasingly likely to upset multiple circuit nodes and produce logic transients that contribute to the soft error rate in most modern scaled process technologies. The design of flip-flops is made more difficult with increasing multi-node charge collection, which requires that charge storage and other sensitive nodes be separated so that one impinging radiation particle does not affect redundant nodes simultaneously. We describe a correct-by-construction design methodology to determine a-priori which hardened FF nodes must be separated, as well as a general interleaving scheme to achieve this separation. We apply the methodology to radiation hardened flip-flops and demonstrate optimal circuit physical organization for protection against multi-node charge collection.
Finally, the methodology is utilized to provide critical node separation for a new hardened flip-flop design that reduces the power and area by 31% and 35% respectively compared to a temporal FF with similar hardness. The hardness is verified and compared to other published designs via the proposed systematic simulation approach that comprehends multiple node charge collection and tests resiliency to upsets at all internal and input nodes. Comparison of the hardness, as measured by estimated upset cross-section, is made to other published designs. Additionally, the importance of specific circuit design aspects to achieving hardness is shown.
ContributorsShambhulingaiah, Sandeep (Author) / Clark, Lawrence (Thesis advisor) / Holbert, Keith E. (Committee member) / Seo, Jae sun (Committee member) / Allee, David (Committee member) / Arizona State University (Publisher)
Created2015
Description
CMOS technology is expected to enter the 10nm regime for future integrated circuits (IC). Such aggressive scaling leads to vastly increased variability, posing a grand challenge to robust IC design. Variations in CMOS are often divided into two types: intrinsic variations and process-induced variations. Intrinsic variations are limited by fundamental physics. They are inherent to CMOS structure, considered as one of the ultimate barriers to the continual scaling of CMOS devices. In this work the three primary intrinsic variations sources are studied, including random dopant fluctuation (RDF), line-edge roughness (LER) and oxide thickness fluctuation (OTF). The research is focused on the modeling and simulation of those variations and their scaling trends. Besides the three variations, a time dependent variation source, Random Telegraph Noise (RTN) is also studied. Different from the other three variations, RTN does not contribute much to the total variation amount, but aggregate the worst case of Vth variations in CMOS. In this work a TCAD based simulation study on RTN is presented, and a new SPICE based simulation method for RTN is proposed for time domain circuit analysis. Process-induced variations arise from the imperfection in silicon fabrication, and vary from foundries to foundries. In this work the layout dependent Vth shift due to Rapid-Thermal Annealing (RTA) are investigated. In this work, we develop joint thermal/TCAD simulation and compact modeling tools to analyze performance variability under various layout pattern densities and RTA conditions. Moreover, we propose a suite of compact models that bridge the underlying RTA process with device parameter change for efficient design optimization.
ContributorsYe, Yun, Ph.D (Author) / Cao, Yu (Thesis advisor) / Yu, Hongbin (Committee member) / Song, Hongjiang (Committee member) / Clark, Lawrence (Committee member) / Arizona State University (Publisher)
Created2011
Description
The geometric growth in the integrated circuit technology due to transistor scaling also with system-on-chip design strategy, the complexity of the integrated circuit has increased manifold. Short time to market with high reliability and performance is one of the most competitive challenges. Both custom and ASIC design methodologies have evolved over the time to cope with this but the high manual labor in custom and statistic design in ASIC are still causes of concern. This work proposes a new circuit design strategy that focuses mostly on arrayed structures like TLB, RF, Cache, IPCAM etc. that reduces the manual effort to a great extent and also makes the design regular, repetitive still achieving high performance. The method proposes making the complete design custom schematic but using the standard cells. This requires adding some custom cells to the already exhaustive library to optimize the design for performance. Once schematic is finalized, the designer places these standard cells in a spreadsheet, placing closely the cells in the critical paths. A Perl script then generates Cadence Encounter compatible placement file. The design is then routed in Encounter. Since designer is the best judge of the circuit architecture, placement by the designer will allow achieve most optimal design. Several designs like IPCAM, issue logic, TLB, RF and Cache designs were carried out and the performance were compared against the fully custom and ASIC flow. The TLB, RF and Cache were the part of the HEMES microprocessor.
ContributorsMaurya, Satendra Kumar (Author) / Clark, Lawrence T (Thesis advisor) / Holbert, Keith E. (Committee member) / Vrudhula, Sarma (Committee member) / Allee, David (Committee member) / Arizona State University (Publisher)
Created2012
Description
Semiconductor scaling technology has led to a sharp growth in transistor counts. This has resulted in an exponential increase on both power dissipation and heat flux (or power density) in modern microprocessors. These microprocessors are integrated as the major components in many modern embedded devices, which offer richer features and attain higher performance than ever before. Therefore, power and thermal management have become the significant design considerations for modern embedded devices. Dynamic voltage/frequency scaling (DVFS) and dynamic power management (DPM) are two well-known hardware capabilities offered by modern embedded processors. However, the power or thermal aware performance optimization is not fully explored for the mainstream embedded processors with discrete DVFS and DPM capabilities. Many key problems have not been answered yet. What is the maximum performance that an embedded processor can achieve under power or thermal constraint for a periodic application? Does there exist an efficient algorithm for the power or thermal management problems with guaranteed quality bound? These questions are hard to be answered because the discrete settings of DVFS and DPM enhance the complexity of many power and thermal management problems, which are generally NP-hard. The dissertation presents a comprehensive study on these NP-hard power and thermal management problems for embedded processors with discrete DVFS and DPM capabilities. In the domain of power management, the dissertation addresses the power minimization problem for real-time schedules, the energy-constrained make-span minimization problem on homogeneous and heterogeneous chip multiprocessors (CMP) architectures, and the battery aware energy management problem with nonlinear battery discharging model. In the domain of thermal management, the work addresses several thermal-constrained performance maximization problems for periodic embedded applications. All the addressed problems are proved to be NP-hard or strongly NP-hard in the study. Then the work focuses on the design of the off-line optimal or polynomial time approximation algorithms as solutions in the problem design space. Several addressed NP-hard problems are tackled by dynamic programming with optimal solutions and pseudo-polynomial run time complexity. Because the optimal algorithms are not efficient in worst case, the fully polynomial time approximation algorithms are provided as more efficient solutions. Some efficient heuristic algorithms are also presented as solutions to several addressed problems. The comprehensive study answers the key questions in order to fully explore the power and thermal management potentials on embedded processors with discrete DVFS and DPM capabilities. The provided solutions enable the theoretical analysis of the maximum performance for periodic embedded applications under power or thermal constraints.
ContributorsZhang, Sushu (Author) / Chatha, Karam S (Thesis advisor) / Cao, Yu (Committee member) / Konjevod, Goran (Committee member) / Vrudhula, Sarma (Committee member) / Xue, Guoliang (Committee member) / Arizona State University (Publisher)
Created2012
Description
Thanks to continuous technology scaling, intelligent, fast and smaller digital systems are now available at affordable costs. As a result, digital systems have found use in a wide range of application areas that were not even imagined before, including medical (e.g., MRI, remote or post-operative monitoring devices, etc.), automotive (e.g., adaptive cruise control, anti-lock brakes, etc.), security systems (e.g., residential security gateways, surveillance devices, etc.), and in- and out-of-body sensing (e.g., capsule swallowed by patients measuring digestive system pH, heart monitors, etc.). Such computing systems, which are completely embedded within the application, are called embedded systems, as opposed to general purpose computing systems. In the design of such embedded systems, power consumption and reliability are indispensable system requirements. In battery operated portable devices, the battery is the single largest factor contributing to device cost, weight, recharging time, frequency and ultimately its usability. For example, in the Apple iPhone 4 smart-phone, the battery is $40\%$ of the device weight, occupies $36\%$ of its volume and allows only $7$ hours (over 3G) of talk time. As embedded systems find use in a range of sensitive applications, from bio-medical applications to safety and security systems, the reliability of the computations performed becomes a crucial factor. At our current technology-node, portable embedded systems are prone to expect failures due to soft errors at the rate of once-per-year; but with aggressive technology scaling, the rate is predicted to increase exponentially to once-per-hour. Over the years, researchers have been successful in developing techniques, implemented at different layers of the design-spectrum, to improve system power efficiency and reliability. Among the layers of design abstraction, I observe that the interface between the compiler and processor micro-architecture possesses a unique potential for efficient design optimizations. A compiler designer is able to observe and analyze the application software at a finer granularity; while the processor architect analyzes the system output (power, performance, etc.) for each executed instruction. At the compiler micro-architecture interface, if the system knowledge at the two design layers can be integrated, design optimizations at the two layers can be modified to efficiently utilize available resources and thereby achieve appreciable system-level benefits. To this effect, the thesis statement is that, ``by merging system design information at the compiler and micro-architecture design layers, smart compilers can be developed, that achieve reliable and power-efficient embedded computing through: i) Pure compiler techniques, ii) Hybrid compiler micro-architecture techniques, and iii) Compiler-aware architectures''. In this dissertation demonstrates, through contributions in each of the three compiler-based techniques, the effectiveness of smart compilers in achieving power-efficiency and reliability in embedded systems.
ContributorsJeyapaul, Reiley (Author) / Shrivastava, Aviral (Thesis advisor) / Vrudhula, Sarma (Committee member) / Clark, Lawrence (Committee member) / Colbourn, Charles (Committee member) / Arizona State University (Publisher)
Created2012
Description
Threshold logic has been studied by at least two independent group of researchers. One group of researchers studied threshold logic with the intention of building threshold logic circuits. The earliest research to this end was done in the 1960's. The major work at that time focused on studying mathematical properties of threshold logic as no efficient circuit implementations of threshold logic were available. Recently many post-CMOS (Complimentary Metal Oxide Semiconductor) technologies that implement threshold logic have been proposed along with efficient CMOS implementations. This has renewed the effort to develop efficient threshold logic design automation techniques. This work contributes to this ongoing effort. Another group studying threshold logic did so, because the building block of neural networks - the Perceptron, is identical to the threshold element implementing a threshold function. Neural networks are used for various purposes as data classifiers. This work contributes tangentially to this field by proposing new methods and techniques to study and analyze functions implemented by a Perceptron After completion of the Human Genome Project, it has become evident that most biological phenomenon is not caused by the action of single genes, but due to the complex interaction involving a system of genes. In recent times, the `systems approach' for the study of gene systems is gaining popularity. Many different theories from mathematics and computer science has been used for this purpose. Among the systems approaches, the Boolean logic gene model has emerged as the current most popular discrete gene model. This work proposes a new gene model based on threshold logic functions (which are a subset of Boolean logic functions). The biological relevance and utility of this model is argued illustrated by using it to model different in-vivo as well as in-silico gene systems.
ContributorsLinge Gowda, Tejaswi (Author) / Vrudhula, Sarma (Thesis advisor) / Shrivastava, Aviral (Committee member) / Chatha, Karamvir (Committee member) / Kim, Seungchan (Committee member) / Arizona State University (Publisher)
Created2012
Description
Negative bias temperature instability (NBTI) is a leading aging mechanism in modern digital and analog circuits. Recent NBTI data exhibits an excessive amount of randomness and fast recovery, which are difficult to be handled by conventional power-law model (tn). Such discrepancies further pose the challenge on long-term reliability prediction under statistical variations and Dynamic Voltage Scaling (DVS) in real circuit operation. To overcome these barriers, the modeling effort in this work (1) practically explains the aging statistics due to randomness in number of traps with log(t) model, accurately predicting the mean and variance shift; (2) proposes cycle-to-cycle model (from the first-principle of trapping) to handle aging under multiple supply voltages, predicting the non-monotonic behavior under DVS (3) presents a long-term model to estimate a tight upper bound of dynamic aging over multiple cycles, and (4) comprehensively validates the new set of aging models with 65nm statistical silicon data. Compared to previous models, the new set of aging models capture the aging variability and the essential role of the recovery phase under DVS, reducing unnecessary guard-banding during the design stage. With CMOS technology scaling, design for reliability has become an important step in the design cycle, and increased the need for efficient and accurate aging simulation methods during the design stage. NBTI induced delay shifts in logic paths are asymmetric in nature, as opposed to averaging effect due to recovery assumed in traditional aging analysis. Timing violations due to aging, in particular, are very sensitive to the standby operation regime of a digital circuit. In this report, by identifying the critical moments in circuit operation and considering the asymmetric aging effects, timing violations under NBTI effect are correctly predicted. The unique contributions of the simulation flow include: (1) accurate modeling of aging induced delay shift due to threshold voltage (Vth) shift using only the delay dependence on supply voltage from cell library; (2) simulation flow for asymmetric aging analysis is proposed and conducted at critical points in circuit operation; (3) setup and hold timing violations due to NBTI aging in logic and clock buffer are investigated in sequential circuits and (4) proposed framework is tested in VLSI applications such DDR memory circuits. This methodology is comprehensively demonstrated with ISCAS89 benchmark circuits using a 45nm Nangate standard cell library characterized using predictive technology models. Our proposed design margin assessment provides design insights and enables resilient techniques for mitigating digital circuit aging.
ContributorsVelamala, Jyothi Bhaskarr (Author) / Cao, Yu (Thesis advisor) / Clark, Lawrence (Committee member) / Chakrabarti, Chaitali (Committee member) / Yu, Hongbin (Committee member) / Arizona State University (Publisher)
Created2012
Description
In recent years, we have observed the prevalence of stream applications in many embedded domains. Stream programs distinguish themselves from traditional sequential programming languages through well defined independent actors, explicit data communication, and stable code/data access patterns. In order to achieve high performance and low power, scratch pad memory (SPM) has been introduced in today's embedded multicore processors. Current design frameworks for developing stream applications on SPM enhanced embedded architectures typically do not include a compiler that can perform automatic partitioning, mapping and scheduling under limited on-chip SPM capacities and memory access delays. Consequently, many designs are implemented manually, which leads to lengthy tasks and inferior designs. In this work, optimization techniques that automatically compile stream programs onto embedded multi-core architectures are proposed. As an initial case study, we implemented an automatic target recognition (ATR) algorithm on the IBM Cell Broadband Engine (BE). Then integer linear programming (ILP) and heuristic approaches were proposed to schedule stream programs on a single core embedded processor that has an SPM with code overlay. Later, ILP and heuristic approaches for Compiling Stream programs on SPM enhanced Multicore Processors (CSMP) were studied. The proposed CSMP ILP and heuristic approaches do not optimize for cycles in stream applications. Further, the number of software pipeline stages in the implementation is dependent on actor to processing engine (PE) mapping and is uncontrollable. We next presented a Retiming technique for Throughput optimization on Embedded Multi-core processors (RTEM). RTEM approach inherently handles cycles and can accept an upper bound on the number of software pipeline stages to be generated. We further enhanced RTEM by incorporating unrolling (URSTEM) that preserves all the beneficial properties of RTEM heuristic and also scales with the number of PEs through unrolling.
ContributorsChe, Weijia (Author) / Chatha, Karam Singh (Thesis advisor) / Vrudhula, Sarma (Committee member) / Chakrabarti, Chaitali (Committee member) / Shrivastava, Aviral (Committee member) / Arizona State University (Publisher)
Created2012