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Description
Currently Java is making its way into the embedded systems and mobile devices like androids. The programs written in Java are compiled into machine independent binary class byte codes. A Java Virtual Machine (JVM) executes these classes. The Java platform additionally specifies the Java Native Interface (JNI). JNI allows Java

Currently Java is making its way into the embedded systems and mobile devices like androids. The programs written in Java are compiled into machine independent binary class byte codes. A Java Virtual Machine (JVM) executes these classes. The Java platform additionally specifies the Java Native Interface (JNI). JNI allows Java code that runs within a JVM to interoperate with applications or libraries that are written in other languages and compiled to the host CPU ISA. JNI plays an important role in embedded system as it provides a mechanism to interact with libraries specific to the platform. This thesis addresses the overhead incurred in the JNI due to reflection and serialization when objects are accessed on android based mobile devices. It provides techniques to reduce this overhead. It also provides an API to access objects through its reference through pinning its memory location. The Android emulator was used to evaluate the performance of these techniques and we observed that there was 5 - 10 % performance gain in the new Java Native Interface.
ContributorsChandrian, Preetham (Author) / Lee, Yann-Hang (Thesis advisor) / Davulcu, Hasan (Committee member) / Li, Baoxin (Committee member) / Arizona State University (Publisher)
Created2011
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Description
With the increasing focus on developing environmentally benign electronic packages, lead-free solder alloys have received a great deal of attention. Mishandling of packages, during manufacture, assembly, or by the user may cause failure of solder joint. A fundamental understanding of the behavior of lead-free solders under mechanical shock conditions is

With the increasing focus on developing environmentally benign electronic packages, lead-free solder alloys have received a great deal of attention. Mishandling of packages, during manufacture, assembly, or by the user may cause failure of solder joint. A fundamental understanding of the behavior of lead-free solders under mechanical shock conditions is lacking. Reliable experimental and numerical analysis of lead-free solder joints in the intermediate strain rate regime need to be investigated. This dissertation mainly focuses on exploring the mechanical shock behavior of lead-free tin-rich solder alloys via multiscale modeling and numerical simulations. First, the macroscopic stress/strain behaviors of three bulk lead-free tin-rich solders were tested over a range of strain rates from 0.001/s to 30/s. Finite element analysis was conducted to determine appropriate specimen geometry that could reach a homogeneous stress/strain field and a relatively high strain rate. A novel self-consistent true stress correction method is developed to compensate the inaccuracy caused by the triaxial stress state at the post-necking stage. Then the material property of micron-scale intermetallic was examined by micro-compression test. The accuracy of this measure is systematically validated by finite element analysis, and empirical adjustments are provided. Moreover, the interfacial property of the solder/intermetallic interface is investigated, and a continuum traction-separation law of this interface is developed from an atomistic-based cohesive element method. The macroscopic stress/strain relation and microstructural properties are combined together to form a multiscale material behavior via a stochastic approach for both solder and intermetallic. As a result, solder is modeled by porous plasticity with random voids, and intermetallic is characterized as brittle material with random vulnerable region. Thereafter, the porous plasticity fracture of the solders and the brittle fracture of the intermetallics are coupled together in one finite element model. Finally, this study yields a multiscale model to understand and predict the mechanical shock behavior of lead-free tin-rich solder joints. Different fracture patterns are observed for various strain rates and/or intermetallic thicknesses. The predictions have a good agreement with the theory and experiments.
ContributorsFei, Huiyang (Author) / Jiang, Hanqing (Thesis advisor) / Chawla, Nikhilesh (Thesis advisor) / Tasooji, Amaneh (Committee member) / Mobasher, Barzin (Committee member) / Rajan, Subramaniam D. (Committee member) / Arizona State University (Publisher)
Created2011
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Description
Reliable extraction of human pose features that are invariant to view angle and body shape changes is critical for advancing human movement analysis. In this dissertation, the multifactor analysis techniques, including the multilinear analysis and the multifactor Gaussian process methods, have been exploited to extract such invariant pose features from

Reliable extraction of human pose features that are invariant to view angle and body shape changes is critical for advancing human movement analysis. In this dissertation, the multifactor analysis techniques, including the multilinear analysis and the multifactor Gaussian process methods, have been exploited to extract such invariant pose features from video data by decomposing various key contributing factors, such as pose, view angle, and body shape, in the generation of the image observations. Experimental results have shown that the resulting pose features extracted using the proposed methods exhibit excellent invariance properties to changes in view angles and body shapes. Furthermore, using the proposed invariant multifactor pose features, a suite of simple while effective algorithms have been developed to solve the movement recognition and pose estimation problems. Using these proposed algorithms, excellent human movement analysis results have been obtained, and most of them are superior to those obtained from state-of-the-art algorithms on the same testing datasets. Moreover, a number of key movement analysis challenges, including robust online gesture spotting and multi-camera gesture recognition, have also been addressed in this research. To this end, an online gesture spotting framework has been developed to automatically detect and learn non-gesture movement patterns to improve gesture localization and recognition from continuous data streams using a hidden Markov network. In addition, the optimal data fusion scheme has been investigated for multicamera gesture recognition, and the decision-level camera fusion scheme using the product rule has been found to be optimal for gesture recognition using multiple uncalibrated cameras. Furthermore, the challenge of optimal camera selection in multi-camera gesture recognition has also been tackled. A measure to quantify the complementary strength across cameras has been proposed. Experimental results obtained from a real-life gesture recognition dataset have shown that the optimal camera combinations identified according to the proposed complementary measure always lead to the best gesture recognition results.
ContributorsPeng, Bo (Author) / Qian, Gang (Thesis advisor) / Ye, Jieping (Committee member) / Li, Baoxin (Committee member) / Spanias, Andreas (Committee member) / Arizona State University (Publisher)
Created2011
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Description
Process variations have become increasingly important for scaled technologies starting at 45nm. The increased variations are primarily due to random dopant fluctuations, line-edge roughness and oxide thickness fluctuation. These variations greatly impact all aspects of circuit performance and pose a grand challenge to future robust IC design. To improve robustness,

Process variations have become increasingly important for scaled technologies starting at 45nm. The increased variations are primarily due to random dopant fluctuations, line-edge roughness and oxide thickness fluctuation. These variations greatly impact all aspects of circuit performance and pose a grand challenge to future robust IC design. To improve robustness, efficient methodology is required that considers effect of variations in the design flow. Analyzing timing variability of complex circuits with HSPICE simulations is very time consuming. This thesis proposes an analytical model to predict variability in CMOS circuits that is quick and accurate. There are several analytical models to estimate nominal delay performance but very little work has been done to accurately model delay variability. The proposed model is comprehensive and estimates nominal delay and variability as a function of transistor width, load capacitance and transition time. First, models are developed for library gates and the accuracy of the models is verified with HSPICE simulations for 45nm and 32nm technology nodes. The difference between predicted and simulated σ/μ for the library gates is less than 1%. Next, the accuracy of the model for nominal delay is verified for larger circuits including ISCAS'85 benchmark circuits. The model predicted results are within 4% error of HSPICE simulated results and take a small fraction of the time, for 45nm technology. Delay variability is analyzed for various paths and it is observed that non-critical paths can become critical because of Vth variation. Variability on shortest paths show that rate of hold violations increase enormously with increasing Vth variation.
ContributorsGummalla, Samatha (Author) / Chakrabarti, Chaitali (Thesis advisor) / Cao, Yu (Thesis advisor) / Bakkaloglu, Bertan (Committee member) / Arizona State University (Publisher)
Created2011
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Description
One of the challenges in future semiconductor device design is excessive rise of power dissipation and device temperatures. With the introduction of new geometrically confined device structures like SOI, FinFET, nanowires and continuous incorporation of new materials with poor thermal conductivities in the device active region, the device thermal problem

One of the challenges in future semiconductor device design is excessive rise of power dissipation and device temperatures. With the introduction of new geometrically confined device structures like SOI, FinFET, nanowires and continuous incorporation of new materials with poor thermal conductivities in the device active region, the device thermal problem is expected to become more challenging in coming years. This work examines the degradation in the ON-current due to self-heating effects in 10 nm channel length silicon nanowire transistors. As part of this dissertation, a 3D electrothermal device simulator is developed that self-consistently solves electron Boltzmann transport equation with 3D energy balance equations for both the acoustic and the optical phonons. This device simulator predicts temperature variations and other physical and electrical parameters across the device for different bias and boundary conditions. The simulation results show insignificant current degradation for nanowire self-heating because of pronounced velocity overshoot effect. In addition, this work explores the role of various placement of the source and drain contacts on the magnitude of self-heating effect in nanowire transistors. This work also investigates the simultaneous influence of self-heating and random charge effects on the magnitude of the ON current for both positively and negatively charged single charges. This research suggests that the self-heating effects affect the ON-current in two ways: (1) by lowering the barrier at the source end of the channel, thus allowing more carriers to go through, and (2) via the screening effect of the Coulomb potential. To examine the effect of temperature dependent thermal conductivity of thin silicon films in nanowire transistors, Selberherr's thermal conductivity model is used in the device simulator. The simulations results show larger current degradation because of self-heating due to decreased thermal conductivity . Crystallographic direction dependent thermal conductivity is also included in the device simulations. Larger degradation is observed in the current along the [100] direction when compared to the [110] direction which is in agreement with the values for the thermal conductivity tensor provided by Zlatan Aksamija.
ContributorsHossain, Arif (Author) / Vasileska, Dragica (Thesis advisor) / Ahmed, Shaikh (Committee member) / Bakkaloglu, Bertan (Committee member) / Goodnick, Stephen (Committee member) / Arizona State University (Publisher)
Created2011
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Description
A dual-channel directional digital hearing aid (DHA) front-end using a fully differential difference amplifier (FDDA) based Microphone interface circuit (MIC) for a capacitive Micro Electro Mechanical Systems (MEMS) microphones and an adaptive-power analog font end (AFE) is presented. The Microphone interface circuit based on FDDA converts

A dual-channel directional digital hearing aid (DHA) front-end using a fully differential difference amplifier (FDDA) based Microphone interface circuit (MIC) for a capacitive Micro Electro Mechanical Systems (MEMS) microphones and an adaptive-power analog font end (AFE) is presented. The Microphone interface circuit based on FDDA converts the capacitance variations into voltage signal, achieves a noise of 32 dB SPL (sound pressure level) and an SNR of 72 dB, additionally it also performs single to differential conversion allowing for fully differential analog signal chain. The analog front-end consists of 40dB VGA and a power scalable continuous time sigma delta ADC, with 68dB SNR dissipating 67u¬W from a 1.2V supply. The ADC implements a self calibrating feedback DAC, for calibrating the 2nd order non-linearity. The VGA and power scalable ADC is fabricated on 0.25 um CMOS TSMC process. The dual channels of the DHA are precisely matched and achieve about 0.5dB gain mismatch, resulting in greater than 5dB directivity index. This will enable a highly integrated and low power DHA
ContributorsNaqvi, Syed Roomi (Author) / Kiaei, Sayfe (Thesis advisor) / Bakkaloglu, Bertan (Committee member) / Chae, Junseok (Committee member) / Barnby, Hugh (Committee member) / Aberle, James T., 1961- (Committee member) / Arizona State University (Publisher)
Created2011
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Description
Concrete columns constitute the fundamental supports of buildings, bridges, and various other infrastructures, and their failure could lead to the collapse of the entire structure. As such, great effort goes into improving the fire resistance of such columns. In a time sensitive fire situation, a delay in the failure of

Concrete columns constitute the fundamental supports of buildings, bridges, and various other infrastructures, and their failure could lead to the collapse of the entire structure. As such, great effort goes into improving the fire resistance of such columns. In a time sensitive fire situation, a delay in the failure of critical load bearing structures can lead to an increase in time allowed for the evacuation of occupants, recovery of property, and access to the fire. Much work has been done in improving the structural performance of concrete including reducing column sizes and providing a safer structure. As a result, high-strength (HS) concrete has been developed to fulfill the needs of such improvements. HS concrete varies from normal-strength (NS) concrete in that it has a higher stiffness, lower permeability and larger durability. This, unfortunately, has resulted in poor performance under fire. The lower permeability allows for water vapor to build up causing HS concrete to suffer from explosive spalling under rapid heating. In addition, the coefficient of thermal expansion (CTE) of HS concrete is lower than that of NS concrete. In this study, the effects of introducing a region of crumb rubber concrete into a steel-reinforced concrete column were analyzed. The inclusion of crumb rubber concrete into a column will greatly increase the thermal resistivity of the overall column, leading to a reduction in core temperature as well as the rate at which the column is heated. Different cases were analyzed while varying the positioning of the crumb-rubber region to characterize the effect of position on the improvement of fire resistance. Computer simulated finite element analysis was used to calculate the temperature and strain distribution with time across the column's cross-sectional area with specific interest in the steel - concrete region. Of the several cases which were investigated, it was found that the improvement of time before failure ranged between 32 to 45 minutes.
ContributorsZiadeh, Bassam Mohammed (Author) / Phelan, Patrick (Thesis advisor) / Kaloush, Kamil (Thesis advisor) / Jiang, Hanqing (Committee member) / Arizona State University (Publisher)
Created2011
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Description
With the introduction of compressed sensing and sparse representation,many image processing and computer vision problems have been looked at in a new way. Recent trends indicate that many challenging computer vision and image processing problems are being solved using compressive sensing and sparse representation algorithms. This thesis assays some applications

With the introduction of compressed sensing and sparse representation,many image processing and computer vision problems have been looked at in a new way. Recent trends indicate that many challenging computer vision and image processing problems are being solved using compressive sensing and sparse representation algorithms. This thesis assays some applications of compressive sensing and sparse representation with regards to image enhancement, restoration and classication. The first application deals with image Super-Resolution through compressive sensing based sparse representation. A novel framework is developed for understanding and analyzing some of the implications of compressive sensing in reconstruction and recovery of an image through raw-sampled and trained dictionaries. Properties of the projection operator and the dictionary are examined and the corresponding results presented. In the second application a novel technique for representing image classes uniquely in a high-dimensional space for image classification is presented. In this method, design and implementation strategy of the image classification system through unique affine sparse codes is presented, which leads to state of the art results. This further leads to analysis of some of the properties attributed to these unique sparse codes. In addition to obtaining these codes, a strong classier is designed and implemented to boost the results obtained. Evaluation with publicly available datasets shows that the proposed method outperforms other state of the art results in image classication. The final part of the thesis deals with image denoising with a novel approach towards obtaining high quality denoised image patches using only a single image. A new technique is proposed to obtain highly correlated image patches through sparse representation, which are then subjected to matrix completion to obtain high quality image patches. Experiments suggest that there may exist a structure within a noisy image which can be exploited for denoising through a low-rank constraint.
ContributorsKulkarni, Naveen (Author) / Li, Baoxin (Thesis advisor) / Ye, Jieping (Committee member) / Sen, Arunabha (Committee member) / Arizona State University (Publisher)
Created2011
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Description
Residue number systems have gained significant importance in the field of high-speed digital signal processing due to their carry-free nature and speed-up provided by parallelism. The critical aspect in the application of RNS is the selection of the moduli set and the design of the conversion units. There have been

Residue number systems have gained significant importance in the field of high-speed digital signal processing due to their carry-free nature and speed-up provided by parallelism. The critical aspect in the application of RNS is the selection of the moduli set and the design of the conversion units. There have been several RNS moduli sets proposed for the implementation of digital filters. However, some are unbalanced and some do not provide the required dynamic range. This thesis addresses the drawbacks of existing RNS moduli sets and proposes a new moduli set for efficient implementation of FIR filters. An efficient VLSI implementation model has been derived for the design of a reverse converter from RNS to the conventional two's complement representation. This model facilitates the realization of a reverse converter for better performance with less hardware complexity when compared with the reverse converter designs of the existing balanced 4-moduli sets. Experimental results comparing multiply and accumulate units using RNS that are implemented using the proposed four-moduli set with the state-of-the-art balanced four-moduli sets, show large improvements in area (46%) and power (43%) reduction for various dynamic ranges. RNS FIR filters using the proposed moduli-set and existing balanced 4-moduli set are implemented in RTL and compared for chip area and power and observed 20% improvements. This thesis also presents threshold logic implementation of the reverse converter.
ContributorsChalivendra, Gayathri (Author) / Vrudhula, Sarma (Thesis advisor) / Shrivastava, Aviral (Committee member) / Bakkaloglu, Bertan (Committee member) / Arizona State University (Publisher)
Created2011
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Description
Current sensing ability is one of the most desirable features of contemporary current or voltage mode controlled DC-DC converters. Current sensing can be used for over load protection, multi-stage converter load balancing, current-mode control, multi-phase converter current-sharing, load independent control, power efficiency improvement etc. There are handful existing approaches for

Current sensing ability is one of the most desirable features of contemporary current or voltage mode controlled DC-DC converters. Current sensing can be used for over load protection, multi-stage converter load balancing, current-mode control, multi-phase converter current-sharing, load independent control, power efficiency improvement etc. There are handful existing approaches for current sensing such as external resistor sensing, triode mode current mirroring, observer sensing, Hall-Effect sensors, transformers, DC Resistance (DCR) sensing, Gm-C filter sensing etc. However, each method has one or more issues that prevent them from being successfully applied in DC-DC converter, e.g. low accuracy, discontinuous sensing nature, high sensitivity to switching noise, high cost, requirement of known external power filter components, bulky size, etc. In this dissertation, an offset-independent inductor Built-In Self Test (BIST) architecture is proposed which is able to measure the inductor inductance and DCR. The measured DCR enables the proposed continuous, lossless, average current sensing scheme. A digital Voltage Mode Control (VMC) DC-DC buck converter with the inductor BIST and current sensing architecture is designed, fabricated, and experimentally tested. The average measurement errors for inductance, DCR and current sensing are 2.1%, 3.6%, and 1.5% respectively. For the 3.5mm by 3.5mm die area, inductor BIST and current sensing circuits including related pins only consume 5.2% of the die area. BIST mode draws 40mA current for a maximum time period of 200us upon start-up and the continuous current sensing consumes about 400uA quiescent current. This buck converter utilizes an adaptive compensator. It could update compensator internally so that the overall system has a proper loop response for large range inductance and load current. Next, a digital Average Current Mode Control (ACMC) DC-DC buck converter with the proposed average current sensing circuits is designed and tested. To reduce chip area and power consumption, a 9 bits hybrid Digital Pulse Width Modulator (DPWM) which uses a Mixed-mode DLL (MDLL) is also proposed. The DC-DC converter has a maximum of 12V input, 1-11 V output range, and a maximum of 3W output power. The maximum error of one least significant bit (LSB) delay of the proposed DPWM is less than 1%.
ContributorsLiu, Tao (Author) / Bakkaloglu, Bertan (Thesis advisor) / Ozev, Sule (Committee member) / Vermeire, Bert (Committee member) / Cao, Yu (Committee member) / Arizona State University (Publisher)
Created2011