Matching Items (3)
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- All Subjects: Micromechanical
- Creators: Chawla, Nikhilesh
Description
Increasing density of microelectronic packages, results in an increase in thermal and mechanical stresses within the various layers of the package. To accommodate the high-performance demands, the materials used in the electronic package would also require improvement. Specifically, the damage that often occurs in solders that function as die-attachment and thermal interfaces need to be addressed. This work evaluates and characterizes thermo-mechanical damage in two material systems – Electroplated Tin and Sintered Nano-Silver solder.
Tin plated electrical contacts are prone to formation of single crystalline tin whiskers which can cause short circuiting. A mechanistic model of their formation, evolution and microstructural influence is still not fully understood. In this work, growth of mechanically induced tin whiskers/hillocks is studied using in situ Nano-indentation and Electron Backscatter Diffraction (EBSD). Electroplated tin was indented and monitored in vacuum to study growth of hillocks without the influence of atmosphere. Thermal aging was done to study the effect of intermetallic compounds. Grain orientation of the hillocks and the plastically deformed region surrounding the indent was studied using Focused Ion Beam (FIB) lift-out technique. In addition, micropillars were milled on the surface of electroplated Sn using FIB to evaluate the yield strength and its relation to Sn grain size.
High operating temperature power electronics use wide band-gap semiconductor devices (Silicon Carbide/Gallium Nitride). The operating temperature of these devices can exceed 250oC, preventing use of traditional Sn-solders as Thermal Interface materials (TIM). At high temperature, the thermomechanical stresses can severely degrade the reliability and life of the device. In this light, new non-destructive approach is needed to understand the damage mechanism when subjected to reliability tests such as thermal cycling. In this work, sintered nano-Silver was identified as a promising high temperature TIM. Sintered nano-Silver samples were fabricated and their shear strength was evaluated. Thermal cycling tests were conducted and damage evolution was characterized using a lab scale 3D X-ray system to periodically assess changes in the microstructure such as cracks, voids, and porosity in the TIM layer. The evolution of microstructure and the effect of cycling temperature during thermal cycling are discussed.
Tin plated electrical contacts are prone to formation of single crystalline tin whiskers which can cause short circuiting. A mechanistic model of their formation, evolution and microstructural influence is still not fully understood. In this work, growth of mechanically induced tin whiskers/hillocks is studied using in situ Nano-indentation and Electron Backscatter Diffraction (EBSD). Electroplated tin was indented and monitored in vacuum to study growth of hillocks without the influence of atmosphere. Thermal aging was done to study the effect of intermetallic compounds. Grain orientation of the hillocks and the plastically deformed region surrounding the indent was studied using Focused Ion Beam (FIB) lift-out technique. In addition, micropillars were milled on the surface of electroplated Sn using FIB to evaluate the yield strength and its relation to Sn grain size.
High operating temperature power electronics use wide band-gap semiconductor devices (Silicon Carbide/Gallium Nitride). The operating temperature of these devices can exceed 250oC, preventing use of traditional Sn-solders as Thermal Interface materials (TIM). At high temperature, the thermomechanical stresses can severely degrade the reliability and life of the device. In this light, new non-destructive approach is needed to understand the damage mechanism when subjected to reliability tests such as thermal cycling. In this work, sintered nano-Silver was identified as a promising high temperature TIM. Sintered nano-Silver samples were fabricated and their shear strength was evaluated. Thermal cycling tests were conducted and damage evolution was characterized using a lab scale 3D X-ray system to periodically assess changes in the microstructure such as cracks, voids, and porosity in the TIM layer. The evolution of microstructure and the effect of cycling temperature during thermal cycling are discussed.
ContributorsLujan Regalado, Irene (Author) / Chawla, Nikhilesh (Thesis advisor) / Frear, Darrel (Committee member) / Rajagopalan, Jagannathan (Committee member) / Jiao, Yang (Committee member) / Arizona State University (Publisher)
Created2018
Description
Nanolaminate composite materials consist of alternating layers of materials at the nanoscale (≤100 nm). Due to the nanometer scale thickness of their layers, these materials display unique and tailorable properties. This enables us to alter both mechanical attributes such as strength and wear properties, as well as functional characteristics such as biocompatibility, optical, and electronic properties. This dissertation focuses on understanding the mechanical behavior of the Al-SiC system. From a practical perspective, these materials exhibit a combination of high toughness and strength which is attractive for many applications. Scientifically, these materials are interesting due to the large elastic modulus mismatch between the layers. This, paired with the small layer thickness, allows a unique opportunity for scientists to study the plastic deformation of metals under extreme amounts of constraint.
Previous studies are limited in scope and a more diverse range of mechanical characterization is required to understand both the advantages and limitations of these materials. One of the major challenges with testing these materials is that they are only able to be made in thicknesses on the order of micrometers so the testing methods are limited to small volume techniques. This work makes use of both microscale testing techniques from the literature as well as novel methodologies. Using these techniques we are able to gain insight into aspects of the material’s mechanical behavior such as the effects of layer orientation, flaw dependent fracture, tension-compression asymmetry, fracture toughness as a function of layer thickness, and shear behavior as a function of layer thickness.
Previous studies are limited in scope and a more diverse range of mechanical characterization is required to understand both the advantages and limitations of these materials. One of the major challenges with testing these materials is that they are only able to be made in thicknesses on the order of micrometers so the testing methods are limited to small volume techniques. This work makes use of both microscale testing techniques from the literature as well as novel methodologies. Using these techniques we are able to gain insight into aspects of the material’s mechanical behavior such as the effects of layer orientation, flaw dependent fracture, tension-compression asymmetry, fracture toughness as a function of layer thickness, and shear behavior as a function of layer thickness.
ContributorsMayer, Carl Randolph (Author) / Chawla, Nikhilesh (Thesis advisor) / Jiang, Hanqing (Committee member) / Molina-Aldareguia, Jon (Committee member) / Rajagopalan, Jagannathan (Committee member) / Arizona State University (Publisher)
Created2016
Description
Ultra High Performance (UHP) cementitious binders are a class of cement-based materials with high strength and ductility, designed for use in precast bridge connections, bridge superstructures, high load-bearing structural members like columns, and in structural repair and strengthening. This dissertation aims to elucidate the chemo-mechanical relationships in complex UHP binders to facilitate better microstructure-based design of these materials and develop machine learning (ML) models to predict their scale-relevant properties from microstructural information.To establish the connection between micromechanical properties and constitutive materials, nanoindentation and scanning electron microscopy experiments are performed on several cementitious pastes. Following Bayesian statistical clustering, mixed reaction products with scattered nanomechanical properties are observed, attributable to the low degree of reaction of the constituent particles, enhanced particle packing, and very low water-to-binder ratio of UHP binders. Relating the phase chemistry to the micromechanical properties, the chemical intensity ratios of Ca/Si and Al/Si are found to be important parameters influencing the incorporation of Al into the C-S-H gel.
ML algorithms for classification of cementitious phases are found to require only the intensities of Ca, Si, and Al as inputs to generate accurate predictions for more homogeneous cement pastes. When applied to more complex UHP systems, the overlapping chemical intensities in the three dominant phases – Ultra High Stiffness (UHS), unreacted cementitious replacements, and clinker – led to ML models misidentifying these three phases. Similarly, a reduced amount of data available on the hard and stiff UHS phases prevents accurate ML regression predictions of the microstructural phase stiffness using only chemical information. The use of generic virtual two-phase microstructures coupled with finite element analysis is also adopted to train MLs to predict composite mechanical properties. This approach applied to three different representations of composite materials produces accurate predictions, thus providing an avenue for image-based microstructural characterization of multi-phase composites such UHP binders. This thesis provides insights into the microstructure of the complex, heterogeneous UHP binders and the utilization of big-data methods such as ML to predict their properties. These results are expected to provide means for rational, first-principles design of UHP mixtures.
ML algorithms for classification of cementitious phases are found to require only the intensities of Ca, Si, and Al as inputs to generate accurate predictions for more homogeneous cement pastes. When applied to more complex UHP systems, the overlapping chemical intensities in the three dominant phases – Ultra High Stiffness (UHS), unreacted cementitious replacements, and clinker – led to ML models misidentifying these three phases. Similarly, a reduced amount of data available on the hard and stiff UHS phases prevents accurate ML regression predictions of the microstructural phase stiffness using only chemical information. The use of generic virtual two-phase microstructures coupled with finite element analysis is also adopted to train MLs to predict composite mechanical properties. This approach applied to three different representations of composite materials produces accurate predictions, thus providing an avenue for image-based microstructural characterization of multi-phase composites such UHP binders. This thesis provides insights into the microstructure of the complex, heterogeneous UHP binders and the utilization of big-data methods such as ML to predict their properties. These results are expected to provide means for rational, first-principles design of UHP mixtures.
ContributorsFord, Emily Lucile (Author) / Neithalath, Narayanan (Thesis advisor) / Rajan, Subramaniam D. (Committee member) / Mobasher, Barzin (Committee member) / Chawla, Nikhilesh (Committee member) / Hoover, Christian G. (Committee member) / Maneparambil, Kailas (Committee member) / Arizona State University (Publisher)
Created2020