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- All Subjects: Shock (Mechanics)
- Creators: Solanki, Kiran
- Creators: Chawla, Nikhilesh
- Creators: Peralta, Pedro
- Creators: Chowdhury, Swaptik
Description
With the increasing focus on developing environmentally benign electronic packages, lead-free solder alloys have received a great deal of attention. Mishandling of packages, during manufacture, assembly, or by the user may cause failure of solder joint. A fundamental understanding of the behavior of lead-free solders under mechanical shock conditions is lacking. Reliable experimental and numerical analysis of lead-free solder joints in the intermediate strain rate regime need to be investigated. This dissertation mainly focuses on exploring the mechanical shock behavior of lead-free tin-rich solder alloys via multiscale modeling and numerical simulations. First, the macroscopic stress/strain behaviors of three bulk lead-free tin-rich solders were tested over a range of strain rates from 0.001/s to 30/s. Finite element analysis was conducted to determine appropriate specimen geometry that could reach a homogeneous stress/strain field and a relatively high strain rate. A novel self-consistent true stress correction method is developed to compensate the inaccuracy caused by the triaxial stress state at the post-necking stage. Then the material property of micron-scale intermetallic was examined by micro-compression test. The accuracy of this measure is systematically validated by finite element analysis, and empirical adjustments are provided. Moreover, the interfacial property of the solder/intermetallic interface is investigated, and a continuum traction-separation law of this interface is developed from an atomistic-based cohesive element method. The macroscopic stress/strain relation and microstructural properties are combined together to form a multiscale material behavior via a stochastic approach for both solder and intermetallic. As a result, solder is modeled by porous plasticity with random voids, and intermetallic is characterized as brittle material with random vulnerable region. Thereafter, the porous plasticity fracture of the solders and the brittle fracture of the intermetallics are coupled together in one finite element model. Finally, this study yields a multiscale model to understand and predict the mechanical shock behavior of lead-free tin-rich solder joints. Different fracture patterns are observed for various strain rates and/or intermetallic thicknesses. The predictions have a good agreement with the theory and experiments.
ContributorsFei, Huiyang (Author) / Jiang, Hanqing (Thesis advisor) / Chawla, Nikhilesh (Thesis advisor) / Tasooji, Amaneh (Committee member) / Mobasher, Barzin (Committee member) / Rajan, Subramaniam D. (Committee member) / Arizona State University (Publisher)
Created2011
Description
The mechanical behavior of Pb-free solder alloys is important, since they must maintain mechanical integrity under thermomechanical fatigue, creep, and mechanical shock conditions. Mechanical shock, in particular, has become an increasing concern in the electronics industry, since electronic packages can be subjected to mechanical shock by mishandling during manufacture or by accidental dropping. In this study, the mechanical shock behavior of Sn and Sn-Ag-Cu alloys was systematically analyzed over the strain rate range 10-3 - 30 s-1 in bulk samples, and over 10-3 - 12 s-1 on the single solder joint level. More importantly, the influences of solder microstructure and intermetallic compounds (IMC) on mechanical shock resistance were quantified. A thorough microstructural characterization of Sn-rich alloys was conducted using synchrotron x-ray computed tomography. The three-dimensional morphology and distribution of contiguous phases and precipitates was analyzed. A multiscale approach was utilized to characterize Sn-rich phases on the microscale with x-ray tomography and focused ion beam tomography to characterize nanoscale precipitates. A high strain rate servohydraulic test system was developed in conjunction with a modified tensile specimen geometry and a high speed camera for quantifying deformation. The effect of microstructure and applied strain rate on the local strain and strain rate distributions were quantified using digital image correlation. Necking behavior was analyzed using a novel mirror fixture, and the triaxial stresses associated with necking were corrected using a self-consistent method to obtain the true stress-true strain constitutive behavior. Fracture mechanisms were quantified as a function of strain rate. Finally, the relationship between solder microstructure and intermetallic compound layer thickness with the mechanical shock resistance of Sn-3.8Ag-0.7Cu solder joints was characterized. It was found that at low strain rates the dynamic solder joint strength was controlled by the solder microstructure, while at high strain rates it was controlled by the IMC layer. The influences of solder microstructure and IMC layer thickness were then isolated using extended reflow or isothermal aging treatments. It was found that at large IMC layer thicknesses the trend described above does not hold true. The fracture mechanisms associated with the dynamic solder joint strength regimes were analyzed.
ContributorsYazzie, Kyle (Author) / Chawla, Nikhilesh (Thesis advisor) / Sane, Sandeep (Committee member) / Jiang, Hanqing (Committee member) / Krause, Stephen (Committee member) / Arizona State University (Publisher)
Created2012
Description
Pb-free solder joints are commonly used as interconnects in semiconductor packaging. One of the major defects affecting the mechanical performance of solder joints are reflow pores that form during processing. These pores exhibit significant variability in size and distribution, and understanding the effects of pore geometry on failure is an important reliability concern. In this thesis, the pore microstructures of solder joint samples and the localized plastic deformation around individual pores was characterized in 3D using lab scale X-ray Microtomography. To observe the deformation of a solder joint in 3D, a solder joint was imaged with Microtomography after reflow and then deformed in shear in several loading steps with additional tomography data taken between each. The 3D tomography datasets were then segmented using the 3D Livewire technique into regions corresponding to solder and pores, and used to generate 3D models of the joint at each strain value using Mimics software. The extent of deformation of individual pores in the joint as a function of strain was quantified using sphericity measurements, and correlated with the observed cracking in the joint. In addition, the error inherent in the data acquisition and 3D modeling process was also quantified. The progression of damage observed with X-ray Microtomography was then used to validate the deformation and failure predicted by a Finite Element (FE) simulation. The FE model was based on the as-reflowed tomography data, and incorporated a ductile damage failure model to simulate fracture. Using the measured sphericity change and cracking information obtained from the tomography data, the FE model is shown to correctly capture the broad plastic deformation and strain localization seen in the actual joint, as well as the crack propagation. Lastly, Digital Image Correlation was investigated as a method of obtaining improved local strain measurements in 3D. This technique measures the displacement of the inherent microstructural features of the joint, and can give localized strain measurements that can be directly comparable to that predicted by modeling. The technique is demonstrated in 2D on Pb-Sn solder, and example 3D data is presented for future analysis.
ContributorsPadilla, Erick (Author) / Chawla, Nikhilesh (Thesis advisor) / Alford, Terry (Committee member) / Krause, Stephen (Committee member) / Arizona State University (Publisher)
Created2012
Description
With increasing concerns of the intrinsic toxicity of lead (Pb) in electronics, a series of tin (Sn) based alloys involving silver (Ag) and copper (Cu) have been proposed as replacements for Pb-Sn solder and widely accepted by industry. However, they have a higher melting point and often exhibit poorer damage tolerance than Pb-Sn alloys. Recently, a new class of alloys with trace amount of rare-earth (RE) elements has been discovered and investigated. In previous work from Prof. Chawla's group, it has been shown that cerium (Ce)-based Pb-free solder are less prone to oxidation and Sn whiskering, and exhibit desirable attributes of microstructural refinement and enhanced ductility relative to lanthanum (La)-based Sn-3.9Ag-0.7Cu (SAC) alloy. Although the formation of RESn3 was believed to be directly responsible for the enhanced ductility in RE-containing SAC solder by allowing microscopic voids to nucleate throughout the solder volume, this cavitation-based mechanism needs to be validated experimentally and numerically. Additionally, since the previous study has exhibited the realistic feasibility of Ce-based SAC lead-free solder alloy as a replacement to conventional SAC alloys, in this study, the proposed objective focuses on the in in-depth understanding of mechanism of enhanced ductility in Ce-based SAC alloy and possible issues associated with integration of this new class of solder into electronic industry, including: (a) study of long-term thermal and mechanical stability on industrial metallization, (b) examine the role of solder volume and wetting behavior of the new solder, relative to Sn-3.9Ag-0.7Cu alloys, (c) conduct experiments of new solder alloys in the form of mechanical shock and electromigration. The research of this new class alloys will be conducted in industrially relevant conditions, and the results would serve as the first step toward integration of these new, next generation solders into the industry.
ContributorsXie, Huxiao (Author) / Chawla, Nikhilesh (Thesis advisor) / Krause, Stephen (Committee member) / Solanki, Kiran (Committee member) / Mirpuri, Kabir (Committee member) / Arizona State University (Publisher)
Created2012
Description
A finite element model that replicates the experimental procedure to test and certify soft body armor has been developed. The model consists of four components: bullet, clay, straps, and shoot pack with different material models that closely capture the behavior of each component when subjected to ballistic impact loading. To test the fidelity of the model, three metrics are used - back face signature (BFS), the number of penetrated shoot pack layers, and the number of damaged shoot pack layers on the clay side of the shoot pack assembly. In addition, the shape and size of the bullet, and the shape and size of the hole in the shoot pack are also considered as qualitative measures to assess the developed model. The focus of this research work is to improve the shoot pack material model, while the constitutive model for the components is taken from earlier work done at ASU. Results show considerable improvement in the model in terms of capturing the number of penetrated layers, the size and shape of the holes in the shoot pack layer, and the predicted BFS. The developed finite element models can be used to predict the behavior of soft body armor for different initial conditions, shoot pack materials, and arrangement of the layers.
ContributorsPechetti, Sateesh (Author) / Rajan, Subramaniam (Thesis advisor) / Mignolet, Marc (Committee member) / Solanki, Kiran (Committee member) / Arizona State University (Publisher)
Created2024
Description
Uranium Dioxide (UO2) is a significant nuclear fission fuel, which is widely used
in nuclear reactors. Understanding the influence of microstructure on thermo-mechanical behavior of UO2 is extremely important to predict its performance. In particular, evaluating mechanical properties, such as elasticity, plasticity and creep at sub-grain length scales is key to developing this understanding as well as building multi-scale models of fuel behavior with predicting capabilities. In this work, modeling techniques were developed to study effects of microstructure on Young’s modulus, which was selected as a key representative property that affects overall mechanical behavior, using experimental data obtained from micro-cantilever bending testing as benchmarks. Beam theory was firstly introduced to calculate Young's modulus of UO2 from the experimental data and then three-dimensional finite element models of the micro-cantilever beams were constructed to simulate bending tests in UO2 at room temperature. The influence of the pore distribution was studied to explain the discrepancy between predicted values and experimental results. Results indicate that results of tests are significantly affected by porosity given that both pore size and spacing in the samples are of the order of the micro-beam dimensions. Microstructure reconstruction was conducted with images collected from three-dimensional serial sectioning using focused ion beam (FIB) and electron backscattering diffraction (EBSD) and pore clusters were placed at different locations along the length of the beam. Results indicate that the presence of pore clusters close to the substrate, i.e., the clamp of the micro-cantilever beam, has the strongest effect on load-deflection behavior, leading to a reduction of stiffness that is the largest for any location of the pore cluster. Furthermore, it was also found from both numerical and i
analytical models that pore clusters located towards the middle of the span and close to the end of the beam only have a very small effect on the load-deflection behavior, and it is concluded that better estimates of Young's modulus can be obtained from micro- cantilever experiments by using microstructurally explicit models that account for porosity in about one half of the beam length close to the clamp. This, in turn, provides an avenue to simplify micro-scale experiments and their analysis.
in nuclear reactors. Understanding the influence of microstructure on thermo-mechanical behavior of UO2 is extremely important to predict its performance. In particular, evaluating mechanical properties, such as elasticity, plasticity and creep at sub-grain length scales is key to developing this understanding as well as building multi-scale models of fuel behavior with predicting capabilities. In this work, modeling techniques were developed to study effects of microstructure on Young’s modulus, which was selected as a key representative property that affects overall mechanical behavior, using experimental data obtained from micro-cantilever bending testing as benchmarks. Beam theory was firstly introduced to calculate Young's modulus of UO2 from the experimental data and then three-dimensional finite element models of the micro-cantilever beams were constructed to simulate bending tests in UO2 at room temperature. The influence of the pore distribution was studied to explain the discrepancy between predicted values and experimental results. Results indicate that results of tests are significantly affected by porosity given that both pore size and spacing in the samples are of the order of the micro-beam dimensions. Microstructure reconstruction was conducted with images collected from three-dimensional serial sectioning using focused ion beam (FIB) and electron backscattering diffraction (EBSD) and pore clusters were placed at different locations along the length of the beam. Results indicate that the presence of pore clusters close to the substrate, i.e., the clamp of the micro-cantilever beam, has the strongest effect on load-deflection behavior, leading to a reduction of stiffness that is the largest for any location of the pore cluster. Furthermore, it was also found from both numerical and i
analytical models that pore clusters located towards the middle of the span and close to the end of the beam only have a very small effect on the load-deflection behavior, and it is concluded that better estimates of Young's modulus can be obtained from micro- cantilever experiments by using microstructurally explicit models that account for porosity in about one half of the beam length close to the clamp. This, in turn, provides an avenue to simplify micro-scale experiments and their analysis.
ContributorsGong, Bowen (Author) / Peralta, Pedro (Thesis advisor) / Rajagopalan, Jagannathan (Committee member) / Solanki, Kiran (Committee member) / Arizona State University (Publisher)
Created2015
Description
Shock loading is a complex phenomenon that can lead to failure mechanisms such as strain localization, void nucleation and growth, and eventually spall fracture. The length scale of damage with respect to that of the surrounding microstructure has proven to be a key aspect in determining sites of failure initiation. Studying incipient stages of spall damage is of paramount importance to accurately determine initiation sites in the material microstructure where damage will nucleate and grow and to formulate continuum models that account for the variability of the damage process due to microstructural heterogeneity, which is the focus of this research. Shock loading experiments were conducted via flyer-plate impact tests for pressures of 2-6 GPa and strain rates of 105/s on copper polycrystals of varying thermomechanical processing conditions. Serial cross sectioning of recovered target disks was performed along with electron microscopy, electron backscattering diffraction (EBSD), focused ion beam (FIB) milling, and 3-D X-ray tomogrpahy (XRT) to gain 2-D and 3-D information on the spall plane and surrounding microstructure. Statistics on grain boundaries (GB) containing damage were obtained from 2-D data and GBs of misorientations 25° and 50° were found to have the highest probability to contain damage in as-received (AR), heat treated (HT), and fully recrystallized (FR) microstructures, while {111} Σ3 GBs were globally strong. The AR microstructure’s probability peak was the most pronounced indicating GB strength is the dominant factor for damage nucleation. 3-D XRT data was used to digitally render the spall planes of the AR, HT, and FR microstructures. From shape fitting the voids to ellipsoids, it was found that the AR microstructure contained greater than 55% intergranular damage, whereas the HT and FR microstructures contained predominantly transgranular and coalesced damage modes, respectively. 3-D reconstructions of large volume damage sites in shocked Cu multicrystals showed preference for damage nucleation at GBs between adjacent grains of a high Taylor factor mismatches as well as an angle between the shock direction and the GB physical normal of ~30°-45°. 3-D FIB sectioning of individual voids led to the discovery of uniform plastic zones ~25-50% the size of the void diameter and plastic deformation directions were characterized via local average misorientation maps. Incipient transgranular voids revealed from the sectioning process were present in grains of high Taylor factors along the shock direction, which is expected as materials with a low Taylor factor along the shock direction are susceptible to growth due their accomodation of plastic deformation. Fabrication of square waves using photolithography and chemical etching was developed to study the nature of plasticity at GBs away from the spall plane. Grains oriented close to <0 1 1> had half the residual amplitudes than grains oriented close to <0 0 1>.
ContributorsBrown, Andrew (Author) / Peralta, Pedro (Committee member) / Mignolet, Marc (Committee member) / Sieradzki, Karl (Committee member) / Solanki, Kiran (Committee member) / Jiang, Hanqing (Committee member) / Arizona State University (Publisher)
Created2015
Description
This study explores the possibility of two matrices containing metallic particulates to act as smart materials by sensing of strain due to the presence of the conducting particles in the matrix. The first matrix is a regular Portland cement-based one while the second is a novel iron-based, carbonated binder developed at ASU. Four different iron replacement percentages by volume (10%, 20%, 30% and 40%) in a Portland cement matrix were selected, whereas the best performing iron carbonate matrix developed was used. Electrical impedance spectroscopy was used to obtain the characteristic Nyquist plot before and after application of flexural load. Electrical circuit models were used to extract the changes in electrical properties under application of load. Strain sensing behavior was evaluated with respect to application of different stress levels and varying replacement levels of the inclusion. A similar approach was used to study the strain sensing capabilities of novel iron carbonate binder. It was observed that the strain sensing efficiency increased with increasing iron percentage and the resistivity increased with increase in load (or applied stress) for both the matrices. It is also found that the iron carbonate binder is more efficient in strain sensing as it had a higher gage factor when compared to the OPC matrix containing metallic inclusions.
Analytical equations (Maxwell) were used to extract frequency dependent electrical conductivity and permittivity of the cement paste (or the host matrix), interface, inclusion (iron) and voids to develop a generic electro-mechanical coupling model to for the strain sensing behavior. COMSOL Multiphysics 5.2a was used as finite element analysis software to develop the model. A MATLAB formulation was used to generate the microstructure with different volume fractions of inclusions. Material properties were assigned (the frequency dependent electrical parameters) and the coupled structural and electrical physics interface in COMSOL was used to model the strain sensing response. The experimental change in resistance matched well with the simulated values, indicating the applicability of the model to predict the strain sensing response of particulate composite systems.
Analytical equations (Maxwell) were used to extract frequency dependent electrical conductivity and permittivity of the cement paste (or the host matrix), interface, inclusion (iron) and voids to develop a generic electro-mechanical coupling model to for the strain sensing behavior. COMSOL Multiphysics 5.2a was used as finite element analysis software to develop the model. A MATLAB formulation was used to generate the microstructure with different volume fractions of inclusions. Material properties were assigned (the frequency dependent electrical parameters) and the coupled structural and electrical physics interface in COMSOL was used to model the strain sensing response. The experimental change in resistance matched well with the simulated values, indicating the applicability of the model to predict the strain sensing response of particulate composite systems.
ContributorsChowdhury, Swaptik (Author) / Neithalath, Narayanan (Thesis advisor) / Rajan, Subramaniam D. (Committee member) / Hoover, Christian G (Committee member) / Arizona State University (Publisher)
Created2017
Description
Characterization and modeling of deformation and failure in metallic materials under extreme conditions, such as the high loads and strain rates found under shock loading due to explosive detonation and high velocity-impacts, are extremely important for a wide variety of military and industrial applications. When a shock wave causes stress in a material that exceeds the elastic limit, plasticity and eventually spallation occur in the material. The process of spall fracture, which in ductile materials stems from strain localization, void nucleation, growth and coalescence, can be caused by microstructural heterogeneity. The analysis of void nucleation performed from a microstructurally explicit simulation of a spall damage evolution in a multicrystalline copper indicated triple junctions as the preferred sites for incipient damage nucleation revealing 75% of them with at least two grain boundaries with misorientation angle between 20-55°. The analysis suggested the nature of the boundaries connecting at a triple junction is an indicator of their tendency to localize spall damage. The results also showed that damage propagated preferentially into one of the high angle boundaries after voids nucleate at triple junctions. Recently the Rayleigh-Taylor Instability (RTI) and the Richtmyer-Meshkov Instability (RMI) have been used to deduce dynamic material strength at very high pressures and strain rates. The RMI is used in this work since it allows using precise diagnostics such as Transient Imaging Displacement Interferometry (TIDI) due to its slower linear growth rate. The Preston-Tonks-Wallace (PTW) model is used to study the effects of dynamic strength on the behavior of samples with a fed-thru RMI, induced via direct laser drive on a perturbed surface, on stability of the shock front and the dynamic evolution of the amplitudes and velocities of the perturbation imprinted on the back (flat) surface by the perturbed shock front. Simulation results clearly showed that the amplitude of the hydrodynamic instability increases with a decrease in strength and vice versa and that the amplitude of the perturbed shock front produced by the fed-thru RMI is also affected by strength in the same way, which provides an alternative to amplitude measurements to study strength effects under dynamic conditions. Simulation results also indicate the presence of second harmonics in the surface perturbation after a certain time, which were also affected by the material strength.
ContributorsGautam, Sudrishti (Author) / Peralta, Pedro (Thesis advisor) / Oswald, Jay (Committee member) / Solanki, Kiran (Committee member) / Arizona State University (Publisher)
Created2016