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- All Subjects: current sensing
- Creators: Bakkaloglu, Bertan
- Creators: Kilgore, Stephen
Description
Electromigration in metal interconnects is the most pernicious failure mechanism in semiconductor integrated circuits (ICs). Early electromigration investigations were primarily focused on aluminum interconnects for silicon-based ICs. An alternative metallization compatible with gallium arsenide (GaAs) was required in the development of high-powered radio frequency (RF) compound semiconductor devices operating at higher current densities and elevated temperatures. Gold-based metallization was implemented on GaAs devices because it uniquely forms a very low resistance ohmic contact and gold interconnects have superior electrical and thermal conductivity properties. Gold (Au) was also believed to have improved resistance to electromigration due to its higher melting temperature, yet electromigration reliability data on passivated Au interconnects is scarce and inadequate in the literature. Therefore, the objective of this research was to characterize the electromigration lifetimes of passivated Au interconnects under precisely controlled stress conditions with statistically relevant quantities to obtain accurate model parameters essential for extrapolation to normal operational conditions. This research objective was accomplished through measurement of electromigration lifetimes of large quantities of passivated electroplated Au interconnects utilizing high-resolution in-situ resistance monitoring equipment. Application of moderate accelerated stress conditions with a current density limited to 2 MA/cm2 and oven temperatures in the range of 300°C to 375°C avoided electrical overstress and severe Joule-heated temperature gradients. Temperature coefficients of resistance (TCRs) were measured to determine accurate Joule-heated Au interconnect film temperatures. A failure criterion of 50% resistance degradation was selected to prevent thermal runaway and catastrophic metal ruptures that are problematic of open circuit failure tests. Test structure design was optimized to reduce resistance variation and facilitate failure analysis. Characterization of the Au microstructure yielded a median grain size of 0.91 ìm. All Au lifetime distributions followed log-normal distributions and Black's model was found to be applicable. An activation energy of 0.80 ± 0.05 eV was measured from constant current electromigration tests at multiple temperatures. A current density exponent of 1.91 was extracted from multiple current densities at a constant temperature. Electromigration-induced void morphology along with these model parameters indicated grain boundary diffusion is dominant and the void nucleation mechanism controlled the failure time.
ContributorsKilgore, Stephen (Author) / Adams, James (Thesis advisor) / Schroder, Dieter (Thesis advisor) / Krause, Stephen (Committee member) / Gaw, Craig (Committee member) / Arizona State University (Publisher)
Created2013
Description
Current sensing ability is one of the most desirable features of contemporary current or voltage mode controlled DC-DC converters. Current sensing can be used for over load protection, multi-stage converter load balancing, current-mode control, multi-phase converter current-sharing, load independent control, power efficiency improvement etc. There are handful existing approaches for current sensing such as external resistor sensing, triode mode current mirroring, observer sensing, Hall-Effect sensors, transformers, DC Resistance (DCR) sensing, Gm-C filter sensing etc. However, each method has one or more issues that prevent them from being successfully applied in DC-DC converter, e.g. low accuracy, discontinuous sensing nature, high sensitivity to switching noise, high cost, requirement of known external power filter components, bulky size, etc. In this dissertation, an offset-independent inductor Built-In Self Test (BIST) architecture is proposed which is able to measure the inductor inductance and DCR. The measured DCR enables the proposed continuous, lossless, average current sensing scheme. A digital Voltage Mode Control (VMC) DC-DC buck converter with the inductor BIST and current sensing architecture is designed, fabricated, and experimentally tested. The average measurement errors for inductance, DCR and current sensing are 2.1%, 3.6%, and 1.5% respectively. For the 3.5mm by 3.5mm die area, inductor BIST and current sensing circuits including related pins only consume 5.2% of the die area. BIST mode draws 40mA current for a maximum time period of 200us upon start-up and the continuous current sensing consumes about 400uA quiescent current. This buck converter utilizes an adaptive compensator. It could update compensator internally so that the overall system has a proper loop response for large range inductance and load current. Next, a digital Average Current Mode Control (ACMC) DC-DC buck converter with the proposed average current sensing circuits is designed and tested. To reduce chip area and power consumption, a 9 bits hybrid Digital Pulse Width Modulator (DPWM) which uses a Mixed-mode DLL (MDLL) is also proposed. The DC-DC converter has a maximum of 12V input, 1-11 V output range, and a maximum of 3W output power. The maximum error of one least significant bit (LSB) delay of the proposed DPWM is less than 1%.
ContributorsLiu, Tao (Author) / Bakkaloglu, Bertan (Thesis advisor) / Ozev, Sule (Committee member) / Vermeire, Bert (Committee member) / Cao, Yu (Committee member) / Arizona State University (Publisher)
Created2011
Description
Sensing and controlling current flow is a fundamental requirement for many electronic systems, including power management (DC-DC converters and LDOs), battery chargers, electric vehicles, solenoid positioning, motor control, and power monitoring. Current Shunt Monitor (CSM) systems have various applications for precise current monitoring of those aforementioned applications. CSMs enable current measurement across an external sense resistor (RS) in series to current flow. Two different types of CSMs designed and characterized in this paper. First design used direct current reading method and the other design used indirect current reading method. Proposed CSM systems can sense power supply current ranging from 1mA to 200mA for the direct current reading topology and from 1mA to 500mA for the indirect current reading topology across a typical board Cu-trace resistance of 1 ohm with less than 10 µV input-referred offset, 0.3 µV/°C offset drift and 0.1% accuracy for both topologies. Proposed systems avoid using a costly zero-temperature coefficient (TC) sense resistor that is normally used in typical CSM systems. Instead, both of the designs used existing Cu-trace on the printed circuit board (PCB) in place of the costly resistor. The systems use chopper stabilization at the front-end amplifier signal path to suppress input-referred offset down to less than 10 µV. Switching current-mode (SI) FIR filtering technique is used at the instrumentation amplifier output to filter out the chopping ripple caused by input offset and flicker noise by averaging half of the phase 1 signal and the other half of the phase 2 signal. In addition, residual offset mainly caused by clock feed-through and charge injection of the chopper switches at the chopping frequency and its multiple frequencies notched out by the since response of the SI-FIR filter. A frequency domain Sigma Delta ADC which is used for the indirect current reading type design enables a digital interface to processor applications with minimally added circuitries to build a simple 1st order Sigma Delta ADC. The CSMs are fabricated on a 0.7µm CMOS process with 3 levels of metal, with maximum Vds tolerance of 8V and operates across a common mode range of 0 to 26V for the direct current reading type and of 0 to 30V for the indirect current reading type achieving less than 10nV/sqrtHz of flicker noise at 100 Hz for both approaches. By using a semi-digital SI-FIR filter, residual chopper offset is suppressed down to 0.5mVpp from a baseline of 8mVpp, which is equivalent to 25dB suppression.
ContributorsYeom, Hyunsoo (Author) / Bakkaloglu, Bertan (Thesis advisor) / Kiaei, Sayfe (Committee member) / Ozev, Sule (Committee member) / Yu, Hongyu (Committee member) / Arizona State University (Publisher)
Created2011
Description
The growing demand for high performance and power hungry portable electronic devices has resulted in alarmingly serious thermal concerns in recent times. The power management system of such devices has thus become increasingly more vital. An integral component of this system is a Low-Dropout Regulator (LDO) which inherently generates a low-noise power supply. Such power supplies are crucial for noise sensitive analog blocks like analog-to-digital converters, phase locked loops, radio-frequency circuits, etc. At higher output power however, a single LDO suffers from increased heat dissipation leading to thermal issues.
This research presents a novel approach to equally and accurately share a large output load current across multiple parallel LDOs to spread the dissipated heat uniformly. The proposed techniques to achieve a high load sharing accuracy of 1% include an innovative fully-integrated accurate current sensing technique based on Dynamic Element Matching and an integrator based servo loop with a low offset feedback amplifier. A novel compensation scheme based on a switched capacitor resistor is referenced to address the high 2A output current specification per LDO across an output voltage range of 1V to 3V. The presented scheme also reduces stringent requirements on off-chip board traces and number of off-chip components thereby making it suitable for portable hand-held systems. The proposed approach can theoretically be extended to any number of parallel LDOs increasing the output current range extensively. The designed load sharing LDO features fast transient response for a low quiescent current consumption of 300µA with a power-supply rejection of 60.7dB at DC. The proposed load sharing technique is verified through extensive simulations for various sources and ranges of mismatch across process, voltage and temperature.
This research presents a novel approach to equally and accurately share a large output load current across multiple parallel LDOs to spread the dissipated heat uniformly. The proposed techniques to achieve a high load sharing accuracy of 1% include an innovative fully-integrated accurate current sensing technique based on Dynamic Element Matching and an integrator based servo loop with a low offset feedback amplifier. A novel compensation scheme based on a switched capacitor resistor is referenced to address the high 2A output current specification per LDO across an output voltage range of 1V to 3V. The presented scheme also reduces stringent requirements on off-chip board traces and number of off-chip components thereby making it suitable for portable hand-held systems. The proposed approach can theoretically be extended to any number of parallel LDOs increasing the output current range extensively. The designed load sharing LDO features fast transient response for a low quiescent current consumption of 300µA with a power-supply rejection of 60.7dB at DC. The proposed load sharing technique is verified through extensive simulations for various sources and ranges of mismatch across process, voltage and temperature.
ContributorsTalele, Bhushan (Author) / Bakkaloglu, Bertan (Thesis advisor) / Kitchen, Jennifer (Committee member) / Seo, Jae-Sun (Committee member) / Arizona State University (Publisher)
Created2017
Description
The increase in computing power has simultaneously increased the demand for input/output (I/O) bandwidth. Unfortunately, the speed of I/O and memory interconnects have not kept pace. Thus, processor-based systems are I/O and interconnect limited. The memory aggregated bandwidth is not scaling fast enough to keep up with increasing bandwidth demands. The term "memory wall" has been coined to describe this phenomenon.
A new memory bus concept that has the potential to push double data rate (DDR) memory speed to 30 Gbit/s is presented. We propose to map the conventional DDR bus to a microwave link using a multicarrier frequency division multiplexing scheme. The memory bus is formed using a microwave signal carried within a waveguide. We call this approach multicarrier memory channel architecture (MCMCA). In MCMCA, each memory signal is modulated onto an RF carrier using 64-QAM format or higher. The carriers are then routed using substrate integrated waveguide (SIW) interconnects. At the receiver, the memory signals are demodulated and then delivered to SDRAM devices. We pioneered the usage of SIW as memory channel interconnects and demonstrated that it alleviates the memory bandwidth bottleneck. We demonstrated SIW performance superiority over conventional transmission line in immunity to cross-talk and electromagnetic interference. We developed a methodology based on design of experiment (DOE) and response surface method techniques that optimizes the design of SIW interconnects and minimizes its performance fluctuations under material and manufacturing variations. Along with using SIW, we implemented a multicarrier architecture which enabled the aggregated DDR bandwidth to reach 30 Gbit/s. We developed an end-to-end system model in Simulink and demonstrated the MCMCA performance for ultra-high throughput memory channel.
Experimental characterization of the new channel shows that by using judicious frequency division multiplexing, as few as one SIW interconnect is sufficient to transmit the 64 DDR bits. Overall aggregated bus data rate achieves 240 GBytes/s data transfer with EVM not exceeding 2.26% and phase error of 1.07 degree or less.
A new memory bus concept that has the potential to push double data rate (DDR) memory speed to 30 Gbit/s is presented. We propose to map the conventional DDR bus to a microwave link using a multicarrier frequency division multiplexing scheme. The memory bus is formed using a microwave signal carried within a waveguide. We call this approach multicarrier memory channel architecture (MCMCA). In MCMCA, each memory signal is modulated onto an RF carrier using 64-QAM format or higher. The carriers are then routed using substrate integrated waveguide (SIW) interconnects. At the receiver, the memory signals are demodulated and then delivered to SDRAM devices. We pioneered the usage of SIW as memory channel interconnects and demonstrated that it alleviates the memory bandwidth bottleneck. We demonstrated SIW performance superiority over conventional transmission line in immunity to cross-talk and electromagnetic interference. We developed a methodology based on design of experiment (DOE) and response surface method techniques that optimizes the design of SIW interconnects and minimizes its performance fluctuations under material and manufacturing variations. Along with using SIW, we implemented a multicarrier architecture which enabled the aggregated DDR bandwidth to reach 30 Gbit/s. We developed an end-to-end system model in Simulink and demonstrated the MCMCA performance for ultra-high throughput memory channel.
Experimental characterization of the new channel shows that by using judicious frequency division multiplexing, as few as one SIW interconnect is sufficient to transmit the 64 DDR bits. Overall aggregated bus data rate achieves 240 GBytes/s data transfer with EVM not exceeding 2.26% and phase error of 1.07 degree or less.
ContributorsBensalem, Brahim (Author) / Aberle, James T. (Thesis advisor) / Bakkaloglu, Bertan (Committee member) / Tirkas, Panayiotis A. (Committee member) / Kitchen, Jennifer (Committee member) / Arizona State University (Publisher)
Created2018
Description
The development of portable electronic systems has been a fundamental factor to the emergence of new applications including ubiquitous smart devices, self-driving vehicles. Power-Management Integrated Circuits (PMICs) which are a key component of such systems must maintain high efficiency and reliability for the final system to be appealing from a size and cost perspective. As technology advances, such portable systems require high output currents at low voltages from their PMICs leading to thermal reliability concerns. The reliability and power integrity of PMICs in such systems also degrades when operated in harsh environments. This dissertation presents solutions to solve two such reliability problems.The first part of this work presents a scalable, daisy-chain solution to parallelize multiple low-dropout linear (LDO) regulators to increase the total output current at low voltages. This printed circuit board (PCB) friendly approach achieves output current sharing without the need for any off-chip active or passive components or matched PCB traces thus reducing the overall system cost. Fully integrated current sensing based on dynamic element matching eliminates the need for any off-chip current sensing components. A current sharing accuracy of 2.613% and 2.789% for output voltages of 3V and 1V respectively and an output current of 2A per LDO are measured for the parallel LDO system implemented in a 0.18μm process. Thermal images demonstrate that the parallel LDO system achieves thermal equilibrium and stable reliable operation.
The remainder of the thesis deals with time-domain switching regulators for high-reliability applications. A time-domain based buck and boost controller with time as the processing variable is developed for use in harsh environments. The controller features adaptive on-time / off-time generation for quasi-constant switching frequency and a time-domain comparator to implement current-mode hysteretic control. A triple redundant bandgap reference is also developed to mitigate the effects of radiation. Measurement results are showcased for a buck and boost converter with a common controller IC implemented in a 0.18μm process and an external power stage. The converter achieves a peak efficiency of 92.22% as a buck for an output current of 5A and an output voltage of 5V. Similarly, the converter achieves an efficiency of 95.97% as a boost for an output current of 1.25A and an output voltage of 30.4V.
ContributorsTalele, Bhushan (Author) / Bakkaloglu, Bertan (Thesis advisor) / Garrity, Douglas (Committee member) / Seo, Jae-Sun (Committee member) / Kitchen, Jennifer (Committee member) / Arizona State University (Publisher)
Created2021