Matching Items (7)
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- All Subjects: Photovoltaic Cells
- All Subjects: Thermal interface materials
- Creators: Wang, Liping
Description
Thermal interface materials (TIMs) are extensively used in thermal management applications especially in the microelectronics industry. With the advancement in microprocessors design and speed, the thermal management is becoming more complex. With these advancements in microelectronics, there have been parallel advancements in thermal interface materials. Given the vast number of available TIM types, selection of the material for each specific application is crucial. Most of the metrologies currently available on the market are designed to qualify TIMs between two perfectly flat surfaces, mimicking an ideal scenario. However, in realistic applications parallel surfaces may not be the case. In this study, a unique characterization method is proposed to address the need for TIMs characterization between non-parallel surfaces. Two different metrologies are custom-designed and built to measure the impact of tilt angle on the performance of TIMs. The first metrology, Angular TIM Tester, is based on the ASTM D5470 standard with flexibility to perform characterization of the sample under induced tilt angle of the rods. The second metrology, Bare Die Tilting Metrology, is designed to validate the performance of TIM under induced tilt angle between the bare die and the cooling solution in an "in-situ" package testing format. Several types of off-the-shelf thermal interface materials were tested and the results are outlined in the study. Data were collected using both metrologies for all selected materials. It was found that small tilt angles, up to 0.6°, have an impact on thermal resistance of all materials especially for in-situ testing. In addition, resistance change between 0° and the selected tilt angle was found to be in close agreement between the two metrologies for paste-based materials and phase-change material. However, a clear difference in the thermal performance of the tested materials was observed between the two metrologies for the gap filler materials.
ContributorsHarris, Enisa (Author) / Phelan, Patrick (Thesis advisor) / Calhoun, Ronald (Committee member) / Devasenathipathy, Shankar (Committee member) / Arizona State University (Publisher)
Created2011
Description
Soft polymer composites with improved thermal conductivity are needed for the thermal management of electronics. Interfacial thermal boundary resistance, however, prevents the efficient use of many high thermal conductivity fill materials. Magnetic alignment of ferrous fill material enforces percolation of the high thermal conductivity fill, thereby shifting the governing boundary resistance to the particle- particle interfaces and increasing the directional thermal conductivity of the polymer composite. Magnetic alignment maximizes the thermal conductivity while minimizing composite stiffening at a fill fraction of half the maximum packing factor. The directional thermal conductivity of the composite is improved by more than 2-fold. Particle-particle contact engineering is then introduced to decrease the particle- particle boundary resistance and further improve the thermal conductivity of the composite.
The interface between rigid fill particles is a point contact with very little interfacial area connecting them. Silver and gallium-based liquid metal (LM) coatings provide soft interfaces that, under pressure, increase the interfacial area between particles and decrease the particle-particle boundary resistance. These engineered contacts are investigated both in and out of the polymer matrix and with and without magnetic alignment of the fill. Magnetically aligned in the polymer matrix, 350nm- thick silver coatings on nickel particles produce a 1.8-fold increase in composite thermal conductivity over the aligned bare-nickel composites. The LM coatings provide similar enhancements, but require higher volumes of LM to do so. This is due to the rapid formation of gallium oxide, which introduces additional thermal boundaries and decreases the benefit of the LM coatings.
The oxide shell of LM droplets (LMDs) can be ruptured using pressure. The pressure needed to rupture LMDs matches closely to thin-walled pressure vessel theory. Furthermore, the addition of tungsten particles stabilizes the mixture for use at higher pressures. Finally, thiols and hydrochloric acid weaken the oxide shell and boost the thermal performance of the beds of LMDs by 50% at pressures much lower than 1 megapascal (MPa) to make them more suitable for use in TIMs.
The interface between rigid fill particles is a point contact with very little interfacial area connecting them. Silver and gallium-based liquid metal (LM) coatings provide soft interfaces that, under pressure, increase the interfacial area between particles and decrease the particle-particle boundary resistance. These engineered contacts are investigated both in and out of the polymer matrix and with and without magnetic alignment of the fill. Magnetically aligned in the polymer matrix, 350nm- thick silver coatings on nickel particles produce a 1.8-fold increase in composite thermal conductivity over the aligned bare-nickel composites. The LM coatings provide similar enhancements, but require higher volumes of LM to do so. This is due to the rapid formation of gallium oxide, which introduces additional thermal boundaries and decreases the benefit of the LM coatings.
The oxide shell of LM droplets (LMDs) can be ruptured using pressure. The pressure needed to rupture LMDs matches closely to thin-walled pressure vessel theory. Furthermore, the addition of tungsten particles stabilizes the mixture for use at higher pressures. Finally, thiols and hydrochloric acid weaken the oxide shell and boost the thermal performance of the beds of LMDs by 50% at pressures much lower than 1 megapascal (MPa) to make them more suitable for use in TIMs.
ContributorsRalphs, Matthew (Author) / Rykaczewski, Konrad (Thesis advisor) / Wang, Robert Y (Thesis advisor) / Phelan, Patrick (Committee member) / Wang, Liping (Committee member) / Devasenathipathy, Shankar (Committee member) / Arizona State University (Publisher)
Created2019
Description
This is a two-part thesis.
Part 1 of this thesis investigates the influence of spatial temperature distribution on the accuracy of performance data of photovoltaic (PV) modules in outdoor conditions and provides physical approaches to improve the spatial temperature distribution of the test modules so an accurate performance data can be obtained in the field. Conventionally, during outdoor performance testing, a single thermocouple location is used on the backsheet or back glass of a test module. This study clearly indicates that there is a large spatial temperature difference between various thermocouple locations within a module. Two physical approaches or configurations were experimented to improve the spatial temperature uniformity: thermally insulating the inner and outer surface of the frame; backsheet and inner surface of the frame. All the data were compared with un-insulated conventional configuration. This study was performed in an array setup of six modules under two different preconditioning electrical configurations, Voc and MPPT over several clear sunny days. This investigation concludes that the best temperature uniformity and the most accurate I-V data can be obtained only by thermally insulating the inner and outer frame surfaces or by using the average of four thermocouple temperatures, as specified in IEC 61853-2, without any thermal insulation.
Part 2 of this thesis analyzes the field data obtained from old PV power plants using various statistical techniques to identify the most influential degradation modes on fielded PV modules in two different climates: hot-dry (Arizona); cold-dry (New York). Performance data and visual inspection data of 647 modules fielded in five different power plants were analyzed. Statistical tests including hypothesis testing were carried out to identify the I-V parameter(s) that are affected the most. The affected performance parameters (Isc, Voc, FF and Pmax) were then correlated with the defects to determine the most dominant defect affecting power degradation. Analysis indicates that the cell interconnect discoloration (or solder bond deterioration) is the dominant defect in hot-dry climate leading to series resistance increase and power loss, while encapsulant delamination is being the most dominant defect in cold-dry climate leading to cell mismatch and power loss.
Part 1 of this thesis investigates the influence of spatial temperature distribution on the accuracy of performance data of photovoltaic (PV) modules in outdoor conditions and provides physical approaches to improve the spatial temperature distribution of the test modules so an accurate performance data can be obtained in the field. Conventionally, during outdoor performance testing, a single thermocouple location is used on the backsheet or back glass of a test module. This study clearly indicates that there is a large spatial temperature difference between various thermocouple locations within a module. Two physical approaches or configurations were experimented to improve the spatial temperature uniformity: thermally insulating the inner and outer surface of the frame; backsheet and inner surface of the frame. All the data were compared with un-insulated conventional configuration. This study was performed in an array setup of six modules under two different preconditioning electrical configurations, Voc and MPPT over several clear sunny days. This investigation concludes that the best temperature uniformity and the most accurate I-V data can be obtained only by thermally insulating the inner and outer frame surfaces or by using the average of four thermocouple temperatures, as specified in IEC 61853-2, without any thermal insulation.
Part 2 of this thesis analyzes the field data obtained from old PV power plants using various statistical techniques to identify the most influential degradation modes on fielded PV modules in two different climates: hot-dry (Arizona); cold-dry (New York). Performance data and visual inspection data of 647 modules fielded in five different power plants were analyzed. Statistical tests including hypothesis testing were carried out to identify the I-V parameter(s) that are affected the most. The affected performance parameters (Isc, Voc, FF and Pmax) were then correlated with the defects to determine the most dominant defect affecting power degradation. Analysis indicates that the cell interconnect discoloration (or solder bond deterioration) is the dominant defect in hot-dry climate leading to series resistance increase and power loss, while encapsulant delamination is being the most dominant defect in cold-dry climate leading to cell mismatch and power loss.
ContributorsUmachandran, Neelesh (Author) / Tamizhmani, Govindasamy (Thesis advisor) / Wang, Liping (Committee member) / Phelan, Patrick (Committee member) / Arizona State University (Publisher)
Created2015
Description
The operating temperature of photovoltaic (PV) modules is affected by external factors such as irradiance, wind speed and ambient temperature as well as internal factors like material properties and design properties. These factors can make a difference in the operating temperatures between cells within a module and between modules within a plant. This is a three-part thesis.
Part 1 investigates the behavior of temperature distribution of PV cells within a module through outdoor temperature monitoring under various operating conditions (Pmax, Voc and Isc) and examines deviation in the temperature coefficient values pertaining to this temperature variation. ANOVA, a statistical tool, was used to study the influence of various factors on temperature variation. This study also investigated the thermal non-uniformity affecting I-V parameters and performance of four different PV technologies (crystalline silicon, CdTe, CIGS, a-Si). Two new approaches (black-colored frame and aluminum tape on back-sheet) were implemented in addition to the two previously-used approaches (thermally insulating the frame, and frame and back sheet) to study temperature uniformity improvements within c-Si PV modules on a fixed latitude-tilt array. This thesis concludes that frame thermal insulation and black frame help reducing thermal gradients and next best viable option to improve temperature uniformity measurements is by using average of four thermocouples as per IEC 61853-2 standard.
Part 2 analyzes the temperature data for two power plants (fixed-tilt and one-axis) to study the temperature variation across the cells in a module and across the modules in a power plant. The module placed in the center of one-axis power plant had higher temperature, whereas in fixed-tilt power plant, the module in north-west direction had higher temperatures. Higher average operating temperatures were observed in one-axis tracking as compared to the fixed-tilt PV power plant, thereby expected to lowering their lifetime.
Part 3 focuses on determination of a thermal model coefficients, using parameters similar to Uc and Uv thermal loss factors used in PVsyst, for modules of four different PV technologies experiencing hot-desert climate conditions by statistically correlating a year-long monitored data. Thermal models help to effectively quantity factors influencing module temperatures to estimate performance and energy models.
Part 1 investigates the behavior of temperature distribution of PV cells within a module through outdoor temperature monitoring under various operating conditions (Pmax, Voc and Isc) and examines deviation in the temperature coefficient values pertaining to this temperature variation. ANOVA, a statistical tool, was used to study the influence of various factors on temperature variation. This study also investigated the thermal non-uniformity affecting I-V parameters and performance of four different PV technologies (crystalline silicon, CdTe, CIGS, a-Si). Two new approaches (black-colored frame and aluminum tape on back-sheet) were implemented in addition to the two previously-used approaches (thermally insulating the frame, and frame and back sheet) to study temperature uniformity improvements within c-Si PV modules on a fixed latitude-tilt array. This thesis concludes that frame thermal insulation and black frame help reducing thermal gradients and next best viable option to improve temperature uniformity measurements is by using average of four thermocouples as per IEC 61853-2 standard.
Part 2 analyzes the temperature data for two power plants (fixed-tilt and one-axis) to study the temperature variation across the cells in a module and across the modules in a power plant. The module placed in the center of one-axis power plant had higher temperature, whereas in fixed-tilt power plant, the module in north-west direction had higher temperatures. Higher average operating temperatures were observed in one-axis tracking as compared to the fixed-tilt PV power plant, thereby expected to lowering their lifetime.
Part 3 focuses on determination of a thermal model coefficients, using parameters similar to Uc and Uv thermal loss factors used in PVsyst, for modules of four different PV technologies experiencing hot-desert climate conditions by statistically correlating a year-long monitored data. Thermal models help to effectively quantity factors influencing module temperatures to estimate performance and energy models.
ContributorsPavgi, Ashwini (Author) / Tamizhmani, Govindasamy (Thesis advisor) / Phelan, Patrick (Thesis advisor) / Wang, Liping (Committee member) / Arizona State University (Publisher)
Created2016
Description
Solar photovoltaic (PV) industry is tipped to be one of the front-runners in the renewable industry. Typically, PV module manufacturers provide a linear or step warranty of 80% of original power over 25 years. This power loss during the field exposure is primarily attributed to the development of performance affecting defects in the PV modules. As many as 86 different defects can occur in a PV module. One of the major defects that can cause significant power loss is the interconnect metallization system (IMS) degradation which is the focus of this thesis. The IMS is composed of cell-interconnect (cell-ribbon interconnect) and string-interconnect (ribbon-ribbon interconnect). The cell interconnect is in turn composed of silver metallization (fingers and busbars) and solder bonds between silver busbar and copper ribbon. Weak solder bonding between copper ribbon and busbar of a cell results in increase of series resistance that in turn affects the fill factor causing a power drop. In this thesis work, the results obtained from various non-destructive and destructive experiments performed on modules exposed in three different climates (Arizona - Hot and Dry, Mexico - Warm and Humid, and California - Temperate) are presented. These experiments include light I-V measurements, dark I-V measurements, infrared imaging, extraction of test samples from the modules, peel strength measurements and four-point resistance measurements. The extraction of test samples was performed using a mechanical method and a chemical method. The merits and demerits of these two methods are presented. A drop of 10.33% in fill factor was observed for a 0.05Ω increase in the series resistance of the modules investigated in this work. Different combinations in a cell that can cause series resistance increase were considered and their effect on fill factor were observed using four-point probe experiments. Peel test experiments were conducted to correlate the effect of series resistance on the ribbon peel strength. Finally, climate specific thermal modelling was performed for 4 different sites over 20 years in order to calculate the accumulated thermal fatigue and also to evaluate its correlation, if any, with the increase of series resistance.
ContributorsTummala, Abhishiktha (Author) / Tamizhmani, Govindasamy (Thesis advisor) / Phelan, Patrick (Thesis advisor) / Wang, Liping (Committee member) / Arizona State University (Publisher)
Created2016
Description
In recent years, solar photovoltaic (PV) industry has seen lots of improvements in technology and of growth in market with crystalline silicon PV modules being the most widely used technology. Plant inspections are gaining much importance to identify and quantitatively determine the impacts of various visual defects on performance. There are about 86 different types of defects found in the PV modules installed in various climates and most of them can be visually observed. However, a quantitative determination of impact or risk of each of identified defect on performance is challenging. Thus, it is utmost important to quantify the risk for each of the visual defects without any human subjectivity. The best way to quantify the risk of each defect is to perform current-voltage measurements of the defective modules installed in the plant but it requires disruption of plant operation, expensive measuring equipment and intensive human resources. One of the most riskiest and dominant visual defects is encapsulant browning which affects the PV module performance in the form of current degradation. The present study deals with developing an automated image processing tool which can address the issues of human subjectivity on browning level impacting performance. The image processing tool developed in this work can be directly used to quantify the impact of browning on performance without intrusively disconnecting the modules from the plant. In this work, the quantified browning level impact on performance has also been experimentally validated through a correlation study using short-circuit current and reflectance/transmittance measurements of browned PV modules retrieved from aged plants/systems installed in diverse climatic conditions. The primary goal of the image processing tool developed in this work is to determine the performance impact of encapsulant browning without interrupting the plant operation for I-V measurements. The use of image processing tool provides a single numerical value, called browning index (BI), which can accurately quantify browning levels on modules and also correlate with the performance and reflectance/transmittance parameters of the modules.
ContributorsGudla, Sushanth (Author) / Govindasamy, Tamizhmani (Thesis advisor) / Patrick, Phelan E (Thesis advisor) / Wang, Liping (Committee member) / Arizona State University (Publisher)
Created2016
Description
Advancements in thermal interface materials (TIMs) allows for the creation of new and more powerful electronics as they increase the heat transfer from the component to the heat sink. Current industrial options provide decent heat transfer, but the creation of TIMs with higher thermal conductivities is needed. In addition, if these TIMs are elastic in nature, their effectiveness can greatly increase as they can deal with changing interfaces without degradation of their properties. The research performed delves into this idea, creating elastic TIMs using liquid metal (LM), in this case galinstan, along with other matrix particles embedded in Polydimethylsiloxane (PDMS) to create an easy to use, relatively inexpensive, thermally conductive, but electrically insulative, pad with increased thermal conductivity from industrial solutions.
The pads were created using varying amounts of LM and matrix materials ranging from copper microspheres to diamond powder mixed into PDMS using a high-speed mixer. The material was then cast into molds and cured to create the pads. Once the pads were created, the difficulty came in quantifying their thermal properties. A stepped bar apparatus (SBA) following ASTM D5470 was created to measure the thermal resistance of the pads but it was determined that thermal conductivity was a more usable metric of the pads’ performance. This meant that the pad’s in-situ thickness was needed during testing, prompting the installation of a linear encoder to measure the thickness. The design and analysis of the necessary modification and proposed future design is further detailed in the following paper.
The pads were created using varying amounts of LM and matrix materials ranging from copper microspheres to diamond powder mixed into PDMS using a high-speed mixer. The material was then cast into molds and cured to create the pads. Once the pads were created, the difficulty came in quantifying their thermal properties. A stepped bar apparatus (SBA) following ASTM D5470 was created to measure the thermal resistance of the pads but it was determined that thermal conductivity was a more usable metric of the pads’ performance. This meant that the pad’s in-situ thickness was needed during testing, prompting the installation of a linear encoder to measure the thickness. The design and analysis of the necessary modification and proposed future design is further detailed in the following paper.
ContributorsKemme, Nicholas (Author) / Rykaczewski, Konrad (Thesis advisor) / Wang, Robert (Thesis advisor) / Wang, Liping (Committee member) / Arizona State University (Publisher)
Created2017