Matching Items (8)
Filtering by
- All Subjects: Microelectromechanical Systems
- Creators: Ozev, Sule
- Creators: Abbas, James
- Member of: ASU Electronic Theses and Dissertations
Description
Micro Electro Mechanical Systems (MEMS) is one of the fastest growing field in silicon industry. Low cost production is key for any company to improve their market share. MEMS testing is challenging since input to test a MEMS device require physical stimulus like acceleration, pressure etc. Also, MEMS device vary with process and requires calibration to make them reliable. This increases test cost and testing time. This challenge can be overcome by combining electrical stimulus based testing along with statistical analysis on MEMS response for electrical stimulus and also limited physical stimulus response data. This thesis proposes electrical stimulus based built in self test(BIST) which can be used to get MEMS data and later this data can be used for statistical analysis. A capacitive MEMS accelerometer is considered to test this BIST approach. This BIST circuit overhead is less and utilizes most of the standard readout circuit. This thesis discusses accelerometer response for electrical stimulus and BIST architecture. As a part of this BIST circuit, a second order sigma delta modulator has been designed. This modulator has a sampling frequency of 1MHz and bandwidth of 6KHz. SNDR of 60dB is achieved with 1Vpp differential input signal and 3.3V supply
ContributorsKundur, Vinay (Author) / Bakkaloglu, Bertan (Committee member) / Ozev, Sule (Committee member) / Kiaei, Sayfe (Committee member) / Arizona State University (Publisher)
Created2013
Description
Advances in implantable MEMS technology has made possible adaptive micro-robotic implants that can track and record from single neurons in the brain. Development of autonomous neural interfaces opens up exciting possibilities of micro-robots performing standard electrophysiological techniques that would previously take researchers several hundred hours to train and achieve the desired skill level. It would result in more reliable and adaptive neural interfaces that could record optimal neural activity 24/7 with high fidelity signals, high yield and increased throughput. The main contribution here is validating adaptive strategies to overcome challenges in autonomous navigation of microelectrodes inside the brain. The following issues pose significant challenges as brain tissue is both functionally and structurally dynamic: a) time varying mechanical properties of the brain tissue-microelectrode interface due to the hyperelastic, viscoelastic nature of brain tissue b) non-stationarities in the neural signal caused by mechanical and physiological events in the interface and c) the lack of visual feedback of microelectrode position in brain tissue. A closed loop control algorithm is proposed here for autonomous navigation of microelectrodes in brain tissue while optimizing the signal-to-noise ratio of multi-unit neural recordings. The algorithm incorporates a quantitative understanding of constitutive mechanical properties of soft viscoelastic tissue like the brain and is guided by models that predict stresses developed in brain tissue during movement of the microelectrode. An optimal movement strategy is developed that achieves precise positioning of microelectrodes in the brain by minimizing the stresses developed in the surrounding tissue during navigation and maximizing the speed of movement. Results of testing the closed-loop control paradigm in short-term rodent experiments validated that it was possible to achieve a consistently high quality SNR throughout the duration of the experiment. At the systems level, new generation of MEMS actuators for movable microelectrode array are characterized and the MEMS device operation parameters are optimized for improved performance and reliability. Further, recommendations for packaging to minimize the form factor of the implant; design of device mounting and implantation techniques of MEMS microelectrode array to enhance the longevity of the implant are also included in a top-down approach to achieve a reliable brain interface.
ContributorsAnand, Sindhu (Author) / Muthuswamy, Jitendran (Thesis advisor) / Tillery, Stephen H (Committee member) / Buneo, Christopher (Committee member) / Abbas, James (Committee member) / Tsakalis, Konstantinos (Committee member) / Arizona State University (Publisher)
Created2013
Description
The applications which use MEMS accelerometer have been on rise and many new fields which are using the MEMS devices have been on rise. The industry is trying to reduce the cost of production of these MEMS devices. These devices are manufactured using micromachining and the interface circuitry is manufactured using CMOS and the final product is integrated on to a single chip. Amount spent on testing of the MEMS devices make up a considerable share of the total final cost of the device. In order to save the cost and time spent on testing, researchers have been trying to develop different methodologies. At present, MEMS devices are tested using mechanical stimuli to measure the device parameters and for calibration the device. This testing is necessary since the MEMS process is not a very well controlled process unlike CMOS. This is done using an ATE and the cost of using ATE (automatic testing equipment) contribute to 30-40% of the devices final cost. This thesis proposes an architecture which can use an Electrical Signal to stimulate the MEMS device and use the data from the MEMS response in approximating the calibration coefficients efficiently. As a proof of concept, we have designed a BIST (Built-in self-test) circuit for MEMS accelerometer. The BIST has an electrical stimulus generator, Capacitance-to-voltage converter, ∑ ∆ ADC. This thesis explains in detail the design of the Electrical stimulus generator. We have also designed a technique to correlate the parameters obtained from electrical stimuli to those obtained by mechanical stimuli. This method is cost effective since the additional circuitry needed to implement BIST is less since the technique utilizes most of the existing standard readout circuitry already present.
ContributorsJangala Naga, Naveen Sai (Author) / Ozev, Sule (Thesis advisor) / Bakkaloglu, Bertan (Committee member) / Kiaei, Sayfe (Committee member) / Arizona State University (Publisher)
Created2014
Description
Efficiency of components is an ever increasing area of importance to portable applications, where a finite battery means finite operating time. Higher efficiency devices need to be designed that don't compromise on the performance that the consumer has come to expect. Class D amplifiers deliver on the goal of increased efficiency, but at the cost of distortion. Class AB amplifiers have low efficiency, but high linearity. By modulating the supply voltage of a Class AB amplifier to make a Class H amplifier, the efficiency can increase while still maintaining the Class AB level of linearity. A 92dB Power Supply Rejection Ratio (PSRR) Class AB amplifier and a Class H amplifier were designed in a 0.24um process for portable audio applications. Using a multiphase buck converter increased the efficiency of the Class H amplifier while still maintaining a fast response time to respond to audio frequencies. The Class H amplifier had an efficiency above the Class AB amplifier by 5-7% from 5-30mW of output power without affecting the total harmonic distortion (THD) at the design specifications. The Class H amplifier design met all design specifications and showed performance comparable to the designed Class AB amplifier across 1kHz-20kHz and 0.01mW-30mW. The Class H design was able to output 30mW into 16Ohms without any increase in THD. This design shows that Class H amplifiers merit more research into their potential for increasing efficiency of audio amplifiers and that even simple designs can give significant increases in efficiency without compromising linearity.
ContributorsPeterson, Cory (Author) / Bakkaloglu, Bertan (Thesis advisor) / Barnaby, Hugh (Committee member) / Kiaei, Sayfe (Committee member) / Arizona State University (Publisher)
Created2013
Description
Class D Amplifiers are widely used in portable systems such as mobile phones to achieve high efficiency. The demands of portable electronics for low power consumption to extend battery life and reduce heat dissipation mandate efficient, high-performance audio amplifiers. The high efficiency of Class D amplifiers (CDAs) makes them particularly attractive for portable applications. The Digital class D amplifier is an interesting solution to increase the efficiency of embedded systems. However, this solution is not good enough in terms of PWM stage linearity and power supply rejection. An efficient control is needed to correct the error sources in order to get a high fidelity sound quality in the whole audio range of frequencies. A fundamental analysis on various error sources due to non idealities in the power stage have been discussed here with key focus on Power supply perturbations driving the Power stage of a Class D Audio Amplifier. Two types of closed loop Digital Class D architecture for PSRR improvement have been proposed and modeled. Double sided uniform sampling modulation has been used. One of the architecture uses feedback around the power stage and the second architecture uses feedback into digital domain. Simulation & experimental results confirm that the closed loop PSRR & PS-IMD improve by around 30-40 dB and 25 dB respectively.
ContributorsChakraborty, Bijeta (Author) / Bakkaloglu, Bertan (Thesis advisor) / Garrity, Douglas (Committee member) / Ozev, Sule (Committee member) / Arizona State University (Publisher)
Created2012
Description
ABSTRACT
Designers creating the next generation remote sensing enabled smart devices need to overcome the challenges of prevailing ventures including time to market and expense.
To reduce the time and effort involved in initial prototyping, a good reference design is often desired and warranted. This paper provides the necessary reference materials for Designers to implement a wireless solution efficiently and effectively.
This document is intended for users with limited Bluetooth technology experience.
Many sensing-enabled devices require a ‘hard-wire’ or cable link to a host monitoring system. This can limit the potential for product advancements by anchoring the system to a single location preventing portability and the convenience of a remote system. By removing the “wired” or cabled portion from a design, a broader scope of devices becomes feasible.
One common problematic area for these types of sensors is within the internal medicine field. Proximity sensing is far more practical and less invasive to implement than surgical implantation. Bluetooth Low Energy (BLE) systems solve the hard wired problem by decoupling the physical sensor from the host system through a BLE transceiver that can send information to an external monitoring system. This wireless link enables new sensor technology to be leveraged into previously unobtainable markets; such as, internal medicine, wearable devices, and Infotainment to name a few. Wireless technology for sensor systems are a potentially disruptive technology changing the way environmental monitoring is implemented and considered.
With this BLE design reference, products can be created with new capabilities to advance current technologies for military, commercial, industrial and medical sectors in rapid succession.
Designers creating the next generation remote sensing enabled smart devices need to overcome the challenges of prevailing ventures including time to market and expense.
To reduce the time and effort involved in initial prototyping, a good reference design is often desired and warranted. This paper provides the necessary reference materials for Designers to implement a wireless solution efficiently and effectively.
This document is intended for users with limited Bluetooth technology experience.
Many sensing-enabled devices require a ‘hard-wire’ or cable link to a host monitoring system. This can limit the potential for product advancements by anchoring the system to a single location preventing portability and the convenience of a remote system. By removing the “wired” or cabled portion from a design, a broader scope of devices becomes feasible.
One common problematic area for these types of sensors is within the internal medicine field. Proximity sensing is far more practical and less invasive to implement than surgical implantation. Bluetooth Low Energy (BLE) systems solve the hard wired problem by decoupling the physical sensor from the host system through a BLE transceiver that can send information to an external monitoring system. This wireless link enables new sensor technology to be leveraged into previously unobtainable markets; such as, internal medicine, wearable devices, and Infotainment to name a few. Wireless technology for sensor systems are a potentially disruptive technology changing the way environmental monitoring is implemented and considered.
With this BLE design reference, products can be created with new capabilities to advance current technologies for military, commercial, industrial and medical sectors in rapid succession.
ContributorsHughes, Clinton Francis (Author) / Blain Christen, Jennifer (Thesis advisor) / Ozev, Sule (Committee member) / Ogras, Umit Y. (Committee member) / Aberle, James T., 1961- (Committee member) / Arizona State University (Publisher)
Created2015
Description
Long-term monitoring of deep brain structures using microelectrode implants is critical for the success of emerging clinical applications including cortical neural prostheses, deep brain stimulation and other neurobiology studies such as progression of disease states, learning and memory, brain mapping etc. However, current microelectrode technologies are not capable enough of reaching those clinical milestones given their inconsistency in performance and reliability in long-term studies. In all the aforementioned applications, it is important to understand the limitations & demands posed by technology as well as biological processes. Recent advances in implantable Micro Electro Mechanical Systems (MEMS) technology have tremendous potential and opens a plethora of opportunities for long term studies which were not possible before. The overall goal of the project is to develop large scale autonomous, movable, micro-scale interfaces which can seek and monitor/stimulate large ensembles of precisely targeted neurons and neuronal networks that can be applied for brain mapping in behaving animals. However, there are serious technical (fabrication) challenges related to packaging and interconnects, examples of which include: lack of current industry standards in chip-scale packaging techniques for silicon chips with movable microstructures, incompatible micro-bonding techniques to elongate current micro-electrode length to reach deep brain structures, inability to achieve hermetic isolation of implantable devices from biological tissue and fluids (i.e. cerebrospinal fluid (CSF), blood, etc.). The specific aims are to: 1) optimize & automate chip scale packaging of MEMS devices with unique requirements not amenable to conventional industry standards with respect to bonding, process temperature and pressure in order to achieve scalability 2) develop a novel micro-bonding technique to extend the length of current polysilicon micro-electrodes to reach and monitor deep brain structures 3) design & develop high throughput packaging mechanism for constructing a dense array of movable microelectrodes. Using a combination of unique micro-bonding technique which involves conductive thermosetting epoxy’s with hermetically sealed support structures and a highly optimized, semi-automated, 90-minute flip-chip packaging process, I have now extended the repertoire of previously reported movable microelectrode arrays to bond conventional stainless steel and Pt/Ir microelectrode arrays of desired lengths to steerable polysilicon shafts. I tested scalable prototypes in rigorous bench top tests including Impedance measurements, accelerated aging and non-destructive testing to assess electrical and mechanical stability of micro-bonds under long-term implantation. I propose a 3D printed packaging method allows a wide variety of electrode configurations to be realized such as a rectangular or circular array configuration or other arbitrary geometries optimal for specific regions of the brain with inter-electrode distance as low as 25 um with an unprecedented capability of seeking and recording/stimulating targeted single neurons in deep brain structures up to 10 mm deep (with 6 μm displacement resolution). The advantage of this computer controlled moveable deep brain electrodes facilitates potential capabilities of moving past glial sheath surrounding microelectrodes to restore neural connection, counter the variabilities in signal amplitudes, and enable simultaneous recording/stimulation at precisely targeted layers of brain.
ContributorsPalaniswamy, Sivakumar (Author) / Muthuswamy, Jitendran (Thesis advisor) / Buneo, Christopher (Committee member) / Abbas, James (Committee member) / Arizona State University (Publisher)
Created2016
Description
Micro-Electro Mechanical System (MEMS) is the micro-scale technology applying on various fields. Traditional testing strategy of MEMS requires physical stimulus, which leads to high cost specified equipment. Also there are a large number of wafer-level measurements for MEMS. A method of estimation calibration coefficient only by electrical stimulus based wafer level measurements is included in the thesis. Moreover, a statistical technique is introduced that can reduce the number of wafer level measurements, meanwhile obtaining an accurate estimate of unmeasured parameters. To improve estimation accuracy, outlier analysis is the effective technique and merged in the test flow. Besides, an algorithm for optimizing test set is included, also providing numerical estimated prediction error.
ContributorsDeng, Lingfei (Author) / Ozev, Sule (Thesis advisor) / Yu, Hongyu (Committee member) / Christen, Jennifer Blain (Committee member) / Arizona State University (Publisher)
Created2012