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Description
Through manipulation of adaptable opportunities available within a given environment, individuals become active participants in managing personal comfort requirements, by exercising control over their comfort without the assistance of mechanical heating and cooling systems. Similarly, continuous manipulation of a building skin's form, insulation, porosity, and transmissivity qualities exerts control over

Through manipulation of adaptable opportunities available within a given environment, individuals become active participants in managing personal comfort requirements, by exercising control over their comfort without the assistance of mechanical heating and cooling systems. Similarly, continuous manipulation of a building skin's form, insulation, porosity, and transmissivity qualities exerts control over the energy exchanged between indoor and outdoor environments. This research uses four adaptive response variables in a modified software algorithm to explore an adaptive building skin's potential in reacting to environmental stimuli with the purpose of minimizing energy use without sacrificing occupant comfort. Results illustrate that significant energy savings can be realized with adaptive envelopes over static building envelopes even under extreme summer and winter climate conditions; that the magnitude of these savings are dependent on climate and orientation; and that occupant thermal comfort can be improved consistently over comfort levels achieved by optimized static building envelopes. The resulting adaptive envelope's unique climate-specific behavior could inform designers in creating an intelligent kinetic aesthetic that helps facilitate adaptability and resiliency in architecture.
ContributorsErickson, James (Author) / Bryan, Harvey (Thesis advisor) / Addison, Marlin (Committee member) / Kroelinger, Michael D. (Committee member) / Reddy, T. Agami (Committee member) / Arizona State University (Publisher)
Created2013
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Description
Semiconductor manufacturing facilities are very complex and capital intensive in nature. During the lifecycle of these facilities various disciplines come together, generate and use a tremendous amount of building and process information to support various decisions that enable them to successfully design, build and sustain these advanced facilities. However, a

Semiconductor manufacturing facilities are very complex and capital intensive in nature. During the lifecycle of these facilities various disciplines come together, generate and use a tremendous amount of building and process information to support various decisions that enable them to successfully design, build and sustain these advanced facilities. However, a majority of the information generated and processes taking place are neither integrated nor interoperable and result in a high degree of redundancy. The objective of this thesis is to build an interoperable Building Information Model (BIM) for the Base-Build and Tool Installation in a semiconductor manufacturing facility. It examines existing processes and data exchange standards available to facilitate the implementation of BIM and provides a framework for the development of processes and standards that can help in building an intelligent information model for a semiconductor manufacturing facility. To understand the nature of the flow of information between the various stakeholders the flow of information between the facility designer, process tool manufacturer and tool layout designer is examined. An information model for the base build and process tool is built and the industry standards SEMI E6 and SEMI E51 are used as a basis to model the information. It is found that applications used to create information models support interoperable industry standard formats such as the Industry Foundation Classes (IFC) and ISO 15926 in a limited manner. A gap analysis has revealed that interoperability standards applicable to the semiconductor manufacturing industry such as the IFC and ISO15926 need to be expanded to support information transfers unique to the industry. Information modeling for a semiconductor manufacturing facility is unique in that it is a process model (Process Tool Information Model) within a building model (Building Information Model), each of them supported more robustly by different interoperability standards. Applications support interoperability data standards specific to the domain or industry they serve but information transfers need to occur between the various domains. To facilitate flow of information between the different domains it is recommended that a mapping of the industry standards be undertaken and translators between them be developed for business use.
ContributorsPindukuri, Shruthi (Author) / Chasey, Allan D (Thesis advisor) / Wiezel, Avi (Committee member) / Mamlouk, Michael (Committee member) / Arizona State University (Publisher)
Created2011
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Description
This research is aimed at studying the impact of building design parameters in terms of their importance and mutual interaction, and how these aspects vary across climates and HVAC system types. A methodology is proposed for such a study, by examining the feasibility and use of two different statistical methods

This research is aimed at studying the impact of building design parameters in terms of their importance and mutual interaction, and how these aspects vary across climates and HVAC system types. A methodology is proposed for such a study, by examining the feasibility and use of two different statistical methods to derive all realistic ‘near-optimum’ solutions which might be lost using a simple optimization technique.

DOE prototype medium office building compliant with ASHRAE 90.1-2010 was selected for the analysis and four different HVAC systems in three US climates were simulated.

The interaction between building design parameters related to envelope characteristics and geometry (total of seven variables) has been studied using two different statistical methods, namely the ‘Morris method’ and ‘Predictive Learning via Rule Ensembles’.

Subsequently, a simple graphical tool based on sensitivity analysis has been developed and demonstrated to present the results from parametric simulations. This tool would be useful to better inform design decisions since it allows imposition of constraints on various parameters and visualize their interaction with other parameters.

It was observed that the Radiant system performed best in all three climates, followed by displacement ventilation system. However, it should be noted that this study did not deal with performance optimization of HVAC systems while there have been several studies which concluded that a VAV system with better controls can perform better than some of the newer HVAC technologies. In terms of building design parameters, it was observed that ‘Ceiling Height’, ‘Window-Wall Ratio’ and ‘Window Properties’ showed highest importance as well as interaction as compared to other parameters considered in this study, for all HVAC systems and climates.

Based on the results of this study, it is suggested to extend such analysis using statistical methods such as the ‘Morris method’, which require much fewer simulations to categorize parameters based on their importance and interaction strength. Usage of statistical methods like ‘Rule Ensembles’ or other simple visual tools to analyze simulation results for all combinations of parameters that show interaction would allow designers to make informed and superior design decisions while benefiting from large reduction in computational time.
ContributorsDidwania, Srijan Kumar (Author) / Reddy, T. Agami (Thesis advisor) / Addison, Marlin S. (Thesis advisor) / Bryan, Harvey J. (Committee member) / Arizona State University (Publisher)
Created2015