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Recent literature indicates potential benefits in microchannel cooling if an inlet orifice is used to suppress pressure oscillations that develop under two-phase conditions. This study investigates the costs and benefits of using an adjustable microchannel inlet orifice. The focus is on orifice effect during steady-state boiling and critical heat flux

Recent literature indicates potential benefits in microchannel cooling if an inlet orifice is used to suppress pressure oscillations that develop under two-phase conditions. This study investigates the costs and benefits of using an adjustable microchannel inlet orifice. The focus is on orifice effect during steady-state boiling and critical heat flux (CHF) in the channels using R134a in a pumped refrigerant loop (PRL). To change orifice size, a dam controlled with a micrometer was placed in front of 31 parallel microchannels. Each channel had a hydraulic diameter of 0.235 mm and a length of 1.33 cm. For steady state two-phase conditions, mass fluxes of 300 kg m-2 s-1 and 600 kg m-2 s-1were investigated. For orifice sizes with a hydraulic diameter to unrestricted hydraulic diameter (Dh:Dh,ur) ratio less than 35 percent, oscillations were reduced and wall temperatures fell up to 1.5 °C. Critical heat flux data were obtained for 7 orifice sizes with mass fluxes from 186 kg m-2 s-1 to 847 kg m-2 s-1. For all mass fluxes and inlet conditions tested, CHF values for a Dh:Dh,ur ratio of 1.8 percent became increasingly lower (up to 37 W cm-2 less) than those obtained with larger orifices. An optimum orifice size with Dh:Dh,ur of 35 percent emerged, offering up to 5 W cm-2 increase in CHF over unrestricted conditions at the highest mass flux tested, 847 kg m-2 s-1. These improvements in cooling ability with inlet orifices in place under both steady-state and impending CHF conditions are modest, leading to the conclusion that inlet orifices are only mildly effective at improving heat transfer coefficients. Stability of the PRL used for experimentation was also studied and improved. A vapor compression cycle's (VCC) proportional, integral, and derivative controller was found to adversely affect stability within the PRL and cause premature CHF. Replacing the VCC with an ice water heat sink maintained steady pumped loop system pressures and mass flow rates. The ice water heat sink was shown to have energy cost savings over the use of a directly coupled VCC for removing heat from the PRL.
ContributorsOdom, Brent A (Author) / Phelan, Patrick E (Thesis advisor) / Herrmann, Marcus (Committee member) / Trimble, Steve (Committee member) / Tasooji, Amaneh (Committee member) / Holcomb, Don (Committee member) / Arizona State University (Publisher)
Created2012
Description
This creative project thesis involves electronic music composition and production, and it uses some elements of algorithmic music composition (through recurrent neural networks). Algorithmic composition techniques are used here as a tool in composing the pieces, but are not the main focus. Thematically, this project explores the analogy between artificial

This creative project thesis involves electronic music composition and production, and it uses some elements of algorithmic music composition (through recurrent neural networks). Algorithmic composition techniques are used here as a tool in composing the pieces, but are not the main focus. Thematically, this project explores the analogy between artificial neural networks and neural activity in the brain. This project consists of three short pieces, each exploring these concept in different ways.
ContributorsKarpur, Ajay (Author) / Suzuki, Kotoka (Thesis director) / Ingalls, Todd (Committee member) / Electrical Engineering Program (Contributor) / Barrett, The Honors College (Contributor)
Created2016-05
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Description
The Metal Semiconductor Field Effect Transistor (MESFET) has high potential to enter analog and RF applications due to their high breakdown voltage and switching frequency characteristics. These MESFET devices could allow for high voltage analog circuits to be integrated with low voltage digital circuits on a single chip in an

The Metal Semiconductor Field Effect Transistor (MESFET) has high potential to enter analog and RF applications due to their high breakdown voltage and switching frequency characteristics. These MESFET devices could allow for high voltage analog circuits to be integrated with low voltage digital circuits on a single chip in an extremely cost effective way. Higher integration leads to electronics with increased functionality and a smaller finished product. The MESFETs are designed in-house by the research group led by Dr. Trevor Thornton. The layouts are then sent to multi-project wafer (MPW) integrated circuit foundry companies, such as the Metal Oxide Semiconductor Implementation Service (MOSIS) to be fabricated. Once returned, the electrical characteristics of the devices are measured. The MESFET has been implemented in various applications by the research group, including the low dropout linear regulator (LDO) and RF power amplifier. An advantage of the MESFET is that it can function in extreme environments such as space, allowing for complex electrical systems to continue functioning properly where traditional transistors would fail.
ContributorsKam, Jason (Author) / Thornton, Trevor (Thesis director) / Goryll, Michael (Committee member) / Barrett, The Honors College (Contributor) / Electrical Engineering Program (Contributor)
Created2015-05
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Description
The transition to lead-free solder in the electronics industry has benefited the environment in many ways. However, with new materials systems comes new materials issues. During the processing of copper pads, a protective surface treatment is needed to prevent the copper from oxidizing. Characterizing the copper oxidation underneath the surface

The transition to lead-free solder in the electronics industry has benefited the environment in many ways. However, with new materials systems comes new materials issues. During the processing of copper pads, a protective surface treatment is needed to prevent the copper from oxidizing. Characterizing the copper oxidation underneath the surface treatment is challenging but necessary for product reliability and failure analysis. Currently, FIB-SEM, which is time-consuming and expensive, is what is used to understand and analyze the surface treatment-copper oxide(s)-copper system. This project's goals were to determine a characterization methodology that cuts both characterization time and cost in half for characterizing copper oxidation beneath a surface treatment and to determine which protective surface treatment is the best as defined by multiple criterion such as cost, sustainability, and reliability. Two protective surface treatments, organic solderability preservative (OSP) and chromium zincate, were investigated, and multiple characterization techniques were researched. Six techniques were tested, and three were deemed promising. Through our studies, it was determined that the best surface treatment was organic solderability preservative (OSP) and the ideal characterization methodology would be using FIB-SEM to calibrate a QCM model, along with using SERA to confirm the QCM model results. The methodology we propose would result in a 91% reduction in characterization cost and a 92% reduction in characterization time. Future work includes further calibration of the QCM model using more FIB/SEM data points and eventually creating a model for oxide layer thickness as a function of exposure time and processing temperature using QCM as the primary data source. An additional short essay on the role of SEM on the continuing miniaturization of integrated circuits is included at the end. This paper explores the intertwined histories of the scanning electron microscope and the integrated circuit, highlighting how advances in SEM influence integrated circuit advances.
ContributorsSmith, Bethany Blair (Co-author) / Marion, Branch Kelly (Co-author) / Cruz, Hernandez (Co-author) / Kimberly, McGuiness (Co-author) / Adams, James (Thesis director) / Krause, Stephen (Committee member) / Barrett, The Honors College (Contributor) / Materials Science and Engineering Program (Contributor)
Created2015-05
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Description
Growing up in Ghana West Africa, I realized there were a few major obstacles hindering the education of the youth. One of them was the consistent supply of all year-round power. Therefore, pursuing a career in power electronics, I decided to research and implement a budget-friendly DC-AC converter that can

Growing up in Ghana West Africa, I realized there were a few major obstacles hindering the education of the youth. One of them was the consistent supply of all year-round power. Therefore, pursuing a career in power electronics, I decided to research and implement a budget-friendly DC-AC converter that can take power from a DC source such as a solar panel to make AC power, suitable for grid-implementation. This project was undertaken with two other colleagues (Ian Vogt and Brett Fennelly), as our Senior Design Capstone project. My colleagues primarily researched into the "advanced" part of the converter such as Volt-VAR, Maximum Power Point Tracking (MPPT), and variable power factor, making the Capstone project be dubbed as "Smart Inverter". In this paper, I elaborate on the entire process of my research and simulation, through the design and layout of the PCB board to milling, soldering and testing. That was my contribution to the capstone project. After testing the board, it was concluded that although the inverter was intended to be the very inexpensive, some electrical and design principles could not be compromised. The converter did successfully invert DC power to AC, but it was only at low voltage levels; it could not withstand the higher voltages. This roadblock stymied the testing of advanced functionalities, paving way for an avenue of further research and implementation.
ContributorsAsigbekye, John (Author) / Ayyanar, Raja (Thesis director) / Sedillo, James (Committee member) / Electrical Engineering Program (Contributor) / Barrett, The Honors College (Contributor)
Created2018-05
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Description
The characteristics possessed by undergraduates who have enjoyed success in an intern position are defined. Through an interview process, four traits were identified: multitasking, strong team work understanding, an inquisitive nature, and application of a cross-disciplinary mindset. An exposition of how these four traits are employed to ensure success in

The characteristics possessed by undergraduates who have enjoyed success in an intern position are defined. Through an interview process, four traits were identified: multitasking, strong team work understanding, an inquisitive nature, and application of a cross-disciplinary mindset. An exposition of how these four traits are employed to ensure success in an internship setting is then given. Finally, a personal account of a project with Intel is expounded upon. This project addressed the unoptimized characterization test time of an Intel package quality control process. It improved throughput by developing a parallel testing method by increasing package carrier capacity and utilizing simultaneous testing. The final design led to a 4x increase of throughput rate.
ContributorsHusein, Sebastian Saint Tsei (Author) / Adams, James (Thesis director) / Krause, Stephen (Committee member) / Jarrell, Joseph (Committee member) / Barrett, The Honors College (Contributor) / Materials Science and Engineering Program (Contributor)
Created2013-05
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Description
This paper begins with an introduction to the topics relevant to the research presented. Properties of diamond, diamond’s ability to be used in power electronics compared to other semiconducting materials, and a brief overview of field effect transistors are among the topics discussed. The remainder of the paper centers around

This paper begins with an introduction to the topics relevant to the research presented. Properties of diamond, diamond’s ability to be used in power electronics compared to other semiconducting materials, and a brief overview of field effect transistors are among the topics discussed. The remainder of the paper centers around research that has been conducted on seven diamond samples. Interface characterization was performed on two diamond samples, one with a high boron incorporation epitaxial layer and another with a low boron incorporation epitaxial layer. UPS He I analysis and UPS He II analysis were used to construct band alignments for the two samples, which revealed no significant differences between their measured properties. A Python program designed to optimize XPS loss peak and UPS He II graphical data analysis is also discussed in detail. Next, Hall effect measurements are examined. Hall effect measurements were carried out on seven diamond samples, two of which have high boron incorporation epitaxial layers, two of which have low boron incorporation epitaxial layers, one of which has a moderate boron incorporation epitaxial layer, and two of which have a phosphorus-doped epitaxial layer. Hall measurements of the boron-doped samples revealed no significant differences in measured parameters amongst the samples with varying boron incorporation epitaxial layers, with the exception of an expected difference in measured carrier concentration proportional to the amount of dopant incorporation in the layers. Some samples with boron-doped epitaxial layers produced measurements indicating n-type charge carriers, which is unexpected given the p-type charge carriers within these samples. The phosphorus-doped samples were unable to be measured due to overly high resistance following an oxygen termination step, and this effect was functionally reversed following hydrogen termination of the samples. It is hypothesized that Fermi pinning is responsible for this effect. The paper concludes with a summary of data discussed in previous sections and a suggested direction for future research on this topic.
ContributorsJacobs, Madeleine (Author) / Nemanich, Robert (Thesis director) / Botana, Antia (Committee member) / Barrett, The Honors College (Contributor) / College of Integrative Sciences and Arts (Contributor)
Created2022-05
Description
Engineering, and more specifically, electrical engineering can be a difficult topic to explain through spoken communication. Along with taking years of education to learn and understand necessary topics, the field is riddled with jargon and items that may take lectures to explain. However, this type of education may not be

Engineering, and more specifically, electrical engineering can be a difficult topic to explain through spoken communication. Along with taking years of education to learn and understand necessary topics, the field is riddled with jargon and items that may take lectures to explain. However, this type of education may not be feasible for a younger or inexperienced audience. Therefore, engineers must find new ways to explain such difficult topics, especially in an attempt to garner interest in children, for example, through art.
ContributorsHedges, Madison (Author) / Aukes, Daniel (Thesis director) / Weeks, Eric (Committee member) / Barrett, The Honors College (Contributor) / Engineering Programs (Contributor) / School of Earth and Space Exploration (Contributor)
Created2023-12