Matching Items (9)
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- All Subjects: Reliability
- All Subjects: Semiconductor
- Creators: Schroder, Dieter
- Creators: Pan, Rong
Description
Electromigration in metal interconnects is the most pernicious failure mechanism in semiconductor integrated circuits (ICs). Early electromigration investigations were primarily focused on aluminum interconnects for silicon-based ICs. An alternative metallization compatible with gallium arsenide (GaAs) was required in the development of high-powered radio frequency (RF) compound semiconductor devices operating at higher current densities and elevated temperatures. Gold-based metallization was implemented on GaAs devices because it uniquely forms a very low resistance ohmic contact and gold interconnects have superior electrical and thermal conductivity properties. Gold (Au) was also believed to have improved resistance to electromigration due to its higher melting temperature, yet electromigration reliability data on passivated Au interconnects is scarce and inadequate in the literature. Therefore, the objective of this research was to characterize the electromigration lifetimes of passivated Au interconnects under precisely controlled stress conditions with statistically relevant quantities to obtain accurate model parameters essential for extrapolation to normal operational conditions. This research objective was accomplished through measurement of electromigration lifetimes of large quantities of passivated electroplated Au interconnects utilizing high-resolution in-situ resistance monitoring equipment. Application of moderate accelerated stress conditions with a current density limited to 2 MA/cm2 and oven temperatures in the range of 300°C to 375°C avoided electrical overstress and severe Joule-heated temperature gradients. Temperature coefficients of resistance (TCRs) were measured to determine accurate Joule-heated Au interconnect film temperatures. A failure criterion of 50% resistance degradation was selected to prevent thermal runaway and catastrophic metal ruptures that are problematic of open circuit failure tests. Test structure design was optimized to reduce resistance variation and facilitate failure analysis. Characterization of the Au microstructure yielded a median grain size of 0.91 ìm. All Au lifetime distributions followed log-normal distributions and Black's model was found to be applicable. An activation energy of 0.80 ± 0.05 eV was measured from constant current electromigration tests at multiple temperatures. A current density exponent of 1.91 was extracted from multiple current densities at a constant temperature. Electromigration-induced void morphology along with these model parameters indicated grain boundary diffusion is dominant and the void nucleation mechanism controlled the failure time.
ContributorsKilgore, Stephen (Author) / Adams, James (Thesis advisor) / Schroder, Dieter (Thesis advisor) / Krause, Stephen (Committee member) / Gaw, Craig (Committee member) / Arizona State University (Publisher)
Created2013
Description
This thesis presents a meta-analysis of lead-free solder reliability. The qualitative analyses of the failure modes of lead- free solder under different stress tests including drop test, bend test, thermal test and vibration test are discussed. The main cause of failure of lead- free solder is fatigue crack, and the speed of propagation of the initial crack could differ from different test conditions and different solder materials. A quantitative analysis about the fatigue behavior of SAC lead-free solder under thermal preconditioning process is conducted. This thesis presents a method of making prediction of failure life of solder alloy by building a Weibull regression model. The failure life of solder on circuit board is assumed Weibull distributed. Different materials and test conditions could affect the distribution by changing the shape and scale parameters of Weibull distribution. The method is to model the regression of parameters with different test conditions as predictors based on Bayesian inference concepts. In the process of building regression models, prior distributions are generated according to the previous studies, and Markov Chain Monte Carlo (MCMC) is used under WinBUGS environment.
ContributorsXu, Xinyue (Author) / Pan, Rong (Thesis advisor) / Montgomery, Douglas C. (Committee member) / Wu, Teresa (Committee member) / Arizona State University (Publisher)
Created2014
Description
The increased use of commercial complementary metal-oxide-semiconductor (CMOS) technologies in harsh radiation environments has resulted in a new approach to radiation effects mitigation. This approach utilizes simulation to support the design of integrated circuits (ICs) to meet targeted tolerance specifications. Modeling the deleterious impact of ionizing radiation on ICs fabricated in advanced CMOS technologies requires understanding and analyzing the basic mechanisms that result in buildup of radiation-induced defects in specific sensitive regions. Extensive experimental studies have demonstrated that the sensitive regions are shallow trench isolation (STI) oxides. Nevertheless, very little work has been done to model the physical mechanisms that result in the buildup of radiation-induced defects and the radiation response of devices fabricated in these technologies. A comprehensive study of the physical mechanisms contributing to the buildup of radiation-induced oxide trapped charges and the generation of interface traps in advanced CMOS devices is presented in this dissertation. The basic mechanisms contributing to the buildup of radiation-induced defects are explored using a physical model that utilizes kinetic equations that captures total ionizing dose (TID) and dose rate effects in silicon dioxide (SiO2). These mechanisms are formulated into analytical models that calculate oxide trapped charge density (Not) and interface trap density (Nit) in sensitive regions of deep-submicron devices. Experiments performed on field-oxide-field-effect-transistors (FOXFETs) and metal-oxide-semiconductor (MOS) capacitors permit investigating TID effects and provide a comparison for the radiation response of advanced CMOS devices. When used in conjunction with closed-form expressions for surface potential, the analytical models enable an accurate description of radiation-induced degradation of transistor electrical characteristics. In this dissertation, the incorporation of TID effects in advanced CMOS devices into surface potential based compact models is also presented. The incorporation of TID effects into surface potential based compact models is accomplished through modifications of the corresponding surface potential equations (SPE), allowing the inclusion of radiation-induced defects (i.e., Not and Nit) into the calculations of surface potential. Verification of the compact modeling approach is achieved via comparison with experimental data obtained from FOXFETs fabricated in a 90 nm low-standby power commercial bulk CMOS technology and numerical simulations of fully-depleted (FD) silicon-on-insulator (SOI) n-channel transistors.
ContributorsSanchez Esqueda, Ivan (Author) / Barnaby, Hugh J (Committee member) / Schroder, Dieter (Thesis advisor) / Schroder, Dieter K. (Committee member) / Holbert, Keith E. (Committee member) / Gildenblat, Gennady (Committee member) / Arizona State University (Publisher)
Created2011
Description
This dissertation addresses challenges pertaining to multi-junction (MJ) solar cells from material development to device design and characterization. Firstly, among the various methods to improve the energy conversion efficiency of MJ solar cells using, a novel approach proposed recently is to use II-VI (MgZnCd)(SeTe) and III-V (AlGaIn)(AsSb) semiconductors lattice-matched on GaSb or InAs substrates for current-matched subcells with minimal defect densities. CdSe/CdTe superlattices are proposed as a potential candidate for a subcell in the MJ solar cell designs using this material system, and therefore the material properties of the superlattices are studied. The high structural qualities of the superlattices are obtained from high resolution X-ray diffraction measurements and cross-sectional transmission electron microscopy images. The effective bandgap energies of the superlattices obtained from the photoluminescence (PL) measurements vary with the layer thicknesses, and are smaller than the bandgap energies of either the constituent material. Furthermore, The PL peak position measured at the steady state exhibits a blue shift that increases with the excess carrier concentration. These results confirm a strong type-II band edge alignment between CdSe and CdTe. The valence band offset between unstrained CdSe and CdTe is determined as 0.63 eV±0.06 eV by fitting the measured PL peak positions using the Kronig-Penney model. The blue shift in PL peak position is found to be primarily caused by the band bending effect based on self-consistent solutions of the Schrödinger and Poisson equations. Secondly, the design of the contact grid layout is studied to maximize the power output and energy conversion efficiency for concentrator solar cells. Because the conventional minimum power loss method used for the contact design is not accurate in determining the series resistance loss, a method of using a distributed series resistance model to maximize the power output is proposed for the contact design. It is found that the junction recombination loss in addition to the series resistance loss and shadowing loss can significantly affect the contact layout. The optimal finger spacing and maximum efficiency calculated by the two methods are close, and the differences are dependent on the series resistance and saturation currents of solar cells. Lastly, the accurate measurements of external quantum efficiency (EQE) are important for the design and development of MJ solar cells. However, the electrical and optical couplings between the subcells have caused EQE measurement artifacts. In order to interpret the measurement artifacts, DC and small signal models are built for the bias condition and the scan of chopped monochromatic light in the EQE measurements. Characterization methods are developed for the device parameters used in the models. The EQE measurement artifacts are found to be caused by the shunt and luminescence coupling effects, and can be minimized using proper voltage and light biases. Novel measurement methods using a pulse voltage bias or a pulse light bias are invented to eliminate the EQE measurement artifacts. These measurement methods are nondestructive and easy to implement. The pulse voltage bias or pulse light bias is superimposed on the conventional DC voltage and light biases, in order to control the operating points of the subcells and counterbalance the effects of shunt and luminescence coupling. The methods are demonstrated for the first time to effectively eliminate the measurement artifacts.
ContributorsLi, Jingjing (Author) / Zhang, Yong-Hang (Thesis advisor) / Tao, Meng (Committee member) / Schroder, Dieter (Committee member) / Vasileska, Dragica (Committee member) / Arizona State University (Publisher)
Created2012
Description
Potential-Induced Degradation (PID) is an extremely serious photovoltaic (PV) durability issue significantly observed in crystalline silicon PV modules due to its rapid power degradation, particularly when compared to other PV degradation modes. The focus of this dissertation is to understand PID mechanisms and to develop PID-free cells and modules. PID-affected modules have been claimed to be fully recovered by high temperature and reverse potential treatments. However, the results obtained in this work indicate that the near-full recovery of efficiency can be achieved only at high irradiance conditions, but the full recovery of efficiency at low irradiance levels, of shunt resistance, and of quantum efficiency (QE) at short wavelengths could not be achieved. The QE loss observed at short wavelengths was modeled by changing the front surface recombination velocity. The QE scaling error due to a measurement on a PID shunted cell was addressed by developing a very low input impedance accessory applicable to an existing QE system. The impacts of silicon nitride (SiNx) anti-reflection coating (ARC) refractive index (RI) and emitter sheet resistance on PID are presented. Low RI ARC cells (1.87) were observed to be PID-susceptible whereas high RI ARC cells (2.05) were determined to be PID-resistant using a method employing high dose corona charging followed by time-resolved measurement of surface voltage. It has been demonstrated that the PID could be prevented by deploying an emitter having a low sheet resistance (~ 60 /sq) even if a PID-susceptible ARC is used in a cell. Secondary ion mass spectroscopy (SIMS) results suggest that a high phosphorous emitter layer hinders sodium transport, which is responsible for the PID. Cells can be screened for PID susceptibility by illuminated lock-in thermography (ILIT) during the cell fabrication process, and the sample structure for this can advantageously be simplified as long as the sample has the SiNx ARC and an aluminum back surface field. Finally, this dissertation presents a prospective method for eliminating or minimizing the PID issue either in the factory during manufacturing or in the field after system installation. The method uses commercially available, thin, and flexible Corning® Willow® Glass sheets or strips on the PV module glass superstrates, disrupting the current leakage path from the cells to the grounded frame.
ContributorsOh, Jaewon (Author) / Bowden, Stuart (Thesis advisor) / Tamizhmani, Govindasamy (Thesis advisor) / Honsberg, Christiana (Committee member) / Hacke, Peter (Committee member) / Schroder, Dieter (Committee member) / Arizona State University (Publisher)
Created2016
Description
Distributed Renewable energy generators are now contributing a significant amount of energy into the energy grid. Consequently, reliability adequacy of such energy generators will depend on making accurate forecasts of energy produced by them. Power outputs of Solar PV systems depend on the stochastic variation of environmental factors (solar irradiance, ambient temperature & wind speed) and random mechanical failures/repairs. Monte Carlo Simulation which is typically used to model such problems becomes too computationally intensive leading to simplifying state-space assumptions. Multi-state models for power system reliability offer a higher flexibility in providing a description of system state evolution and an accurate representation of probability. In this study, Universal Generating Functions (UGF) were used to solve such combinatorial problems. 8 grid connected Solar PV systems were analyzed with a combined capacity of about 5MW located in a hot-dry climate (Arizona) and accuracy of 98% was achieved when validated with real-time data. An analytics framework is provided to grid operators and utilities to effectively forecast energy produced by distributed energy assets and in turn, develop strategies for effective Demand Response in times of increased share of renewable distributed energy assets in the grid. Second part of this thesis extends the environmental modelling approach to develop an aging test to be run in conjunction with an accelerated test of Solar PV modules. Accelerated Lifetime Testing procedures in the industry are used to determine the dominant failure modes which the product undergoes in the field, as well as predict the lifetime of the product. UV stressor is one of the ten stressors which a PV module undergoes in the field. UV exposure causes browning of modules leading to drop in Short Circuit Current. This thesis presents an environmental modelling approach for the hot-dry climate and extends it to develop an aging test methodology. This along with the accelerated tests would help achieve the goal of correlating field failures with accelerated tests and obtain acceleration factor. This knowledge would help predict PV module degradation in the field within 30% of the actual value and help in knowing the PV module lifetime accurately.
ContributorsKadloor, Nikhil (Author) / Kuitche, Joseph (Thesis advisor) / Pan, Rong (Thesis advisor) / Wu, Teresa (Committee member) / Arizona State University (Publisher)
Created2017
Description
Hydropower generation is one of the clean renewable energies which has received great attention in the power industry. Hydropower has been the leading source of renewable energy. It provides more than 86% of all electricity generated by renewable sources worldwide. Generally, the life span of a hydropower plant is considered as 30 to 50 years. Power plants over 30 years old usually conduct a feasibility study of rehabilitation on their entire facilities including infrastructure. By age 35, the forced outage rate increases by 10 percentage points compared to the previous year. Much longer outages occur in power plants older than 20 years. Consequently, the forced outage rate increases exponentially due to these longer outages. Although these long forced outages are not frequent, their impact is immense. If reasonable timing of rehabilitation is missed, an abrupt long-term outage could occur and additional unnecessary repairs and inefficiencies would follow. On the contrary, too early replacement might cause the waste of revenue. The hydropower plants of Korea Water Resources Corporation (hereafter K-water) are utilized for this study. Twenty-four K-water generators comprise the population for quantifying the reliability of each equipment. A facility in a hydropower plant is a repairable system because most failures can be fixed without replacing the entire facility. The fault data of each power plant are collected, within which only forced outage faults are considered as raw data for reliability analyses. The mean cumulative repair functions (MCF) of each facility are determined with the failure data tables, using Nelson's graph method. The power law model, a popular model for a repairable system, can also be obtained to represent representative equipment and system availability. The criterion-based analysis of HydroAmp is used to provide more accurate reliability of each power plant. Two case studies are presented to enhance the understanding of the availability of each power plant and represent economic evaluations for modernization. Also, equipment in a hydropower plant is categorized into two groups based on their reliability for determining modernization timing and their suitable replacement periods are obtained using simulation.
ContributorsKwon, Ogeuk (Author) / Holbert, Keith E. (Thesis advisor) / Heydt, Gerald T (Committee member) / Pan, Rong (Committee member) / Arizona State University (Publisher)
Created2011
Description
Yield is a key process performance characteristic in the capital-intensive semiconductor fabrication process. In an industry where machines cost millions of dollars and cycle times are a number of months, predicting and optimizing yield are critical to process improvement, customer satisfaction, and financial success. Semiconductor yield modeling is essential to identifying processing issues, improving quality, and meeting customer demand in the industry. However, the complicated fabrication process, the massive amount of data collected, and the number of models available make yield modeling a complex and challenging task. This work presents modeling strategies to forecast yield using generalized linear models (GLMs) based on defect metrology data. The research is divided into three main parts. First, the data integration and aggregation necessary for model building are described, and GLMs are constructed for yield forecasting. This technique yields results at both the die and the wafer levels, outperforms existing models found in the literature based on prediction errors, and identifies significant factors that can drive process improvement. This method also allows the nested structure of the process to be considered in the model, improving predictive capabilities and violating fewer assumptions. To account for the random sampling typically used in fabrication, the work is extended by using generalized linear mixed models (GLMMs) and a larger dataset to show the differences between batch-specific and population-averaged models in this application and how they compare to GLMs. These results show some additional improvements in forecasting abilities under certain conditions and show the differences between the significant effects identified in the GLM and GLMM models. The effects of link functions and sample size are also examined at the die and wafer levels. The third part of this research describes a methodology for integrating classification and regression trees (CART) with GLMs. This technique uses the terminal nodes identified in the classification tree to add predictors to a GLM. This method enables the model to consider important interaction terms in a simpler way than with the GLM alone, and provides valuable insight into the fabrication process through the combination of the tree structure and the statistical analysis of the GLM.
ContributorsKrueger, Dana Cheree (Author) / Montgomery, Douglas C. (Thesis advisor) / Fowler, John (Committee member) / Pan, Rong (Committee member) / Pfund, Michele (Committee member) / Arizona State University (Publisher)
Created2011
Description
As the world energy demand increases, semiconductor devices with high energy conversion efficiency become more and more desirable. The energy conversion consists of two distinct processes, namely energy generation and usage. In this dissertation, novel multi-junction solar cells and light emitting diodes (LEDs) are proposed and studied for high energy conversion efficiency in both processes, respectively. The first half of this dissertation discusses the practically achievable energy conversion efficiency limit of solar cells. Since the demonstration of the Si solar cell in 1954, the performance of solar cells has been improved tremendously and recently reached 41.6% energy conversion efficiency. However, it seems rather challenging to further increase the solar cell efficiency. The state-of-the-art triple junction solar cells are analyzed to help understand the limiting factors. To address these issues, the monolithically integrated II-VI and III-V material system is proposed for solar cell applications. This material system covers the entire solar spectrum with a continuous selection of energy bandgaps and can be grown lattice matched on a GaSb substrate. Moreover, six four-junction solar cells are designed for AM0 and AM1.5D solar spectra based on this material system, and new design rules are proposed. The achievable conversion efficiencies for these designs are calculated using the commercial software package Silvaco with real material parameters. The second half of this dissertation studies the semiconductor luminescence refrigeration, which corresponds to over 100% energy usage efficiency. Although cooling has been realized in rare-earth doped glass by laser pumping, semiconductor based cooling is yet to be realized. In this work, a device structure that monolithically integrates a GaAs hemisphere with an InGaAs/GaAs quantum-well thin slab LED is proposed to realize cooling in semiconductor. The device electrical and optical performance is calculated. The proposed device then is fabricated using nine times photolithography and eight masks. The critical process steps, such as photoresist reflow and dry etch, are simulated to insure successful processing. Optical testing is done with the devices at various laser injection levels and the internal quantum efficiency, external quantum efficiency and extraction efficiency are measured.
ContributorsWu, Songnan (Author) / Zhang, Yong-Hang (Thesis advisor) / Menéndez, Jose (Committee member) / Ponce, Fernando (Committee member) / Belitsky, Andrei (Committee member) / Schroder, Dieter (Committee member) / Arizona State University (Publisher)
Created2010