Matching Items (2)
Description
For decades, microelectronics manufacturing has been concerned with failures related to electromigration phenomena in conductors experiencing high current densities. The influence of interconnect microstructure on device failures related to electromigration in BGA and flip chip solder interconnects has become a significant interest with reduced individual solder interconnect volumes. A survey indicates that x-ray computed micro-tomography (µXCT) is an emerging, novel means for characterizing the microstructures' role in governing electromigration failures. This work details the design and construction of a lab-scale µXCT system to characterize electromigration in the Sn-0.7Cu lead-free solder system by leveraging in situ imaging.
In order to enhance the attenuation contrast observed in multi-phase material systems, a modeling approach has been developed to predict settings for the controllable imaging parameters which yield relatively high detection rates over the range of x-ray energies for which maximum attenuation contrast is expected in the polychromatic x-ray imaging system. In order to develop this predictive tool, a model has been constructed for the Bremsstrahlung spectrum of an x-ray tube, and calculations for the detector's efficiency over the relevant range of x-ray energies have been made, and the product of emitted and detected spectra has been used to calculate the effective x-ray imaging spectrum. An approach has also been established for filtering `zinger' noise in x-ray radiographs, which has proven problematic at high x-ray energies used for solder imaging. The performance of this filter has been compared with a known existing method and the results indicate a significant increase in the accuracy of zinger filtered radiographs.
The obtained results indicate the conception of a powerful means for the study of failure causing processes in solder systems used as interconnects in microelectronic packaging devices. These results include the volumetric quantification of parameters which are indicative of both electromigration tolerance of solders and the dominant mechanisms for atomic migration in response to current stressing. This work is aimed to further the community's understanding of failure-causing electromigration processes in industrially relevant material systems for microelectronic interconnect applications and to advance the capability of available characterization techniques for their interrogation.
In order to enhance the attenuation contrast observed in multi-phase material systems, a modeling approach has been developed to predict settings for the controllable imaging parameters which yield relatively high detection rates over the range of x-ray energies for which maximum attenuation contrast is expected in the polychromatic x-ray imaging system. In order to develop this predictive tool, a model has been constructed for the Bremsstrahlung spectrum of an x-ray tube, and calculations for the detector's efficiency over the relevant range of x-ray energies have been made, and the product of emitted and detected spectra has been used to calculate the effective x-ray imaging spectrum. An approach has also been established for filtering `zinger' noise in x-ray radiographs, which has proven problematic at high x-ray energies used for solder imaging. The performance of this filter has been compared with a known existing method and the results indicate a significant increase in the accuracy of zinger filtered radiographs.
The obtained results indicate the conception of a powerful means for the study of failure causing processes in solder systems used as interconnects in microelectronic packaging devices. These results include the volumetric quantification of parameters which are indicative of both electromigration tolerance of solders and the dominant mechanisms for atomic migration in response to current stressing. This work is aimed to further the community's understanding of failure-causing electromigration processes in industrially relevant material systems for microelectronic interconnect applications and to advance the capability of available characterization techniques for their interrogation.
ContributorsMertens, James Charles Edwin (Author) / Chawla, Nikhilesh (Thesis advisor) / Alford, Terry (Committee member) / Jiao, Yang (Committee member) / Neithalath, Narayanan (Committee member) / Arizona State University (Publisher)
Created2015
Description
Aluminum alloys are commonly used for engineering applications due to their high strength to weight ratio, low weight, and low cost. Pitting corrosion, accelerated by saltwater environments, leads to fatigue cracks and stress corrosion cracking during service. Two-dimensional (2D) characterization methods are typically used to identify and characterize corrosion; however, these methods are destructive and do not enable an efficient means of quantifying mechanisms of pit initiation and growth. In this study, lab-scale x-ray microtomography was used to non-destructively observe, quantify, and understand pit growth in three dimensions over a 20-day corrosion period in the AA7075-T651 alloy. The XRT process, capable of imaging sample volumes with a resolution near one micrometer, was found to be an ideal tool for large-volume pit examination. Pit depths were quantified over time using renderings of sample volumes, leading to an understanding of how inclusion particles, oxide breakdown, and corrosion mechanisms impact the growth and morphology of pits. This process, when carried out on samples produced with two different rolling directions and rolling extents, yielded novel insights into the long-term macroscopic corrosion behaviors impacted by alloy production and design. Key among these were the determinations that the alloy’s rolling direction produces a significant difference in the average growth rate of pits and that the corrosion product layer loses its passivating effect as a result of cyclic immersion. In addition, a new mechanism of pitting corrosion is proposed which is focused on the pseudo-random spatial distribution of iron-rich inclusion particles in the alloy matrix, which produces a random distribution of pit depths based on the occurrence of co-operative corrosion near inclusion clusters.
ContributorsSinclair, Daniel Ritchie (Author) / Chawla, Nikhilesh (Thesis director) / Jiao, Yang (Committee member) / Bale, Hrishikesh (Committee member) / School of International Letters and Cultures (Contributor) / Materials Science and Engineering Program (Contributor, Contributor) / Barrett, The Honors College (Contributor)
Created2020-05