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Description
This dissertation proposes and presents two different passive sigma-delta
modulator zoom Analog to Digital Converter (ADC) architectures. The first ADC is fullydifferential, synthesizable zoom-ADC architecture with a passive loop filter for lowfrequency Built in Self-Test (BIST) applications. The detailed ADC architecture and a step
by step process designing the zoom-ADC along with a synthesis tool that can target various
design specifications are presented. The design flow does not rely on extensive knowledge
of an experienced ADC designer. Two example set of BIST ADCs have been synthesized
with different performance requirements in 65nm CMOS process. The first ADC achieves
90.4dB Signal to Noise Ratio (SNR) in 512µs measurement time and consumes 17µW
power. Another example achieves 78.2dB SNR in 31.25µs measurement time and
consumes 63µW power. The second ADC architecture is a multi-mode, dynamically
zooming passive sigma-delta modulator. The architecture is based on a 5b interpolating
flash ADC as the zooming unit, and a passive discrete time sigma delta modulator as the
fine conversion unit. The proposed ADC provides an Oversampling Ratio (OSR)-
independent, dynamic zooming technique, employing an interpolating zooming front-end.
The modulator covers between 0.1 MHz and 10 MHz signal bandwidth which makes it
suitable for cellular applications including 4G radio systems. By reconfiguring the OSR,
bias current, and component parameters, optimal power consumption can be achieved for
every mode. The ADC is implemented in 0.13 µm CMOS technology and it achieves an
SNDR of 82.2/77.1/74.2/68 dB for 0.1/1.92/5/10MHz bandwidth with 1.3/5.7/9.6/11.9mW
power consumption from a 1.2 V supply.
modulator zoom Analog to Digital Converter (ADC) architectures. The first ADC is fullydifferential, synthesizable zoom-ADC architecture with a passive loop filter for lowfrequency Built in Self-Test (BIST) applications. The detailed ADC architecture and a step
by step process designing the zoom-ADC along with a synthesis tool that can target various
design specifications are presented. The design flow does not rely on extensive knowledge
of an experienced ADC designer. Two example set of BIST ADCs have been synthesized
with different performance requirements in 65nm CMOS process. The first ADC achieves
90.4dB Signal to Noise Ratio (SNR) in 512µs measurement time and consumes 17µW
power. Another example achieves 78.2dB SNR in 31.25µs measurement time and
consumes 63µW power. The second ADC architecture is a multi-mode, dynamically
zooming passive sigma-delta modulator. The architecture is based on a 5b interpolating
flash ADC as the zooming unit, and a passive discrete time sigma delta modulator as the
fine conversion unit. The proposed ADC provides an Oversampling Ratio (OSR)-
independent, dynamic zooming technique, employing an interpolating zooming front-end.
The modulator covers between 0.1 MHz and 10 MHz signal bandwidth which makes it
suitable for cellular applications including 4G radio systems. By reconfiguring the OSR,
bias current, and component parameters, optimal power consumption can be achieved for
every mode. The ADC is implemented in 0.13 µm CMOS technology and it achieves an
SNDR of 82.2/77.1/74.2/68 dB for 0.1/1.92/5/10MHz bandwidth with 1.3/5.7/9.6/11.9mW
power consumption from a 1.2 V supply.
ContributorsEROL, OSMAN EMIR (Author) / Ozev, Sule (Thesis advisor) / Kitchen, Jennifer (Committee member) / Ogras, Umit Y. (Committee member) / Blain-Christen, Jennifer (Committee member) / Arizona State University (Publisher)
Created2018
Description
There is an ever-increasing demand for higher bandwidth and data rate ensuing from exploding number of radio frequency integrated systems and devices. As stated in the Shannon-Hartley theorem, the maximum achievable data rate of a communication channel is linearly proportional to the system bandwidth. This is the main driving force behind pushing wireless systems towards millimeter-wave frequency range, where larger bandwidth is available at a higher carrier frequency. Observing the Moor’s law, highly scaled complementary metal–oxide–semiconductor (CMOS) technologies provide fast transistors with a high unity power gain frequency which enables operating at millimeter-wave frequency range. CMOS is the compelling choice for digital and signal processing modules which concurrently offers high computation speed, low power consumption, and mass integration at a high manufacturing yield. One of the main shortcomings of the sub-micron CMOS technologies is the low breakdown voltage of the transistors that limits the dynamic range of the radio frequency (RF) power blocks, especially with the power amplifiers. Low voltage swing restricts the achievable output power which translates into low signal to noise ratio and degraded linearity. Extensive research has been done on proposing new design and IC fabrication techniques with the goal of generating higher output power in CMOS technology. The prominent drawbacks of these solutions are an increased die area, higher cost per design, and lower overall efficiency due to lossy passive components. In this dissertation, CMOS compatible metal–semiconductor field-effect transistor (MESFETs) are utilized to put forward a new solution to enhance the power amplifier’s breakdown voltage, gain and maximum output power. Requiring no change to the conventional CMOS process flow, this low cost approach allows direct incorporation of high voltage power MESFETs into silicon. High voltage MESFETs were employed in a cascode structure to push the amplifier’s cutoff frequency and unity power gain frequency to the 5G and K-band frequency range. This dissertation begins with CMOS compatible MESFET modeling and fabrication steps, and culminates in the discussion of amplifier design and optimization methodology, parasitic de-embedding steps, simulation and measurement results, and high resistivity RF substrate characterization.
ContributorsHabibiMehr, Payam (Author) / Thornton, Trevor John (Thesis advisor) / Bakkaloglu, Bertan (Committee member) / Formicone, Gabriele (Committee member) / Kitchen, Jennifer (Committee member) / Arizona State University (Publisher)
Created2019
Description
This work analyzes and develops a point-of-load (PoL) synchronous buck converter using enhancement-mode Gallium Nitride (e-GaN), with emphasis on optimizing reverse conduction loss by using a well-known technique of placing an anti-parallel Schottky diode across the synchronous power device. This work develops an improved analytical switching model for the GaN-based converter with the Schottky diode using piecewise linear approximations.
To avoid a shoot-through between the power switches of the buck converter, a small dead-time is inserted between gate drive switching transitions. Despite optimum dead-time management for a power converter, optimum dead-times vary for different load conditions. These variations become considerably large for PoL applications, which demand high output current with low output voltages. At high switching frequencies, these variations translate into losses that contribute significantly to the total loss of the converter. To understand and quantify power loss in a hard-switching buck converter that uses a GaN power device in parallel with a Schottky diode, piecewise transitions are used to develop an analytical switching model that quantifies the contribution of reverse conduction loss of GaN during dead-time.
The effects of parasitic elements on the dynamics of the switching converter are investigated during one switching cycle of the converter. A designed prototype of a buck converter is correlated to the predicted model to determine the accuracy of the model. This comparison is presented using simulations and measurements at 400 kHz and 2 MHz converter switching speeds for load (1A) condition and fixed dead-time values. Furthermore, performance of the buck converter with and without the Schottky diode is also measured and compared to demonstrate and quantify the enhanced performance when using an anti-parallel diode. The developed power converter achieves peak efficiencies of 91.7% and 93.86% for 2 MHz and 400 KHz switching frequencies, respectively, and drives load currents up to 6A for a voltage conversion from 12V input to 3.3V output.
In addition, various industry Schottky diodes have been categorized based on their packaging and electrical characteristics and the developed analytical model provides analytical expressions relating the diode characteristics to power stage performance parameters. The performance of these diodes has been characterized for different buck converter voltage step-down ratios that are typically used in industry applications and different switching frequencies ranging from 400 KHz to 2 MHz.
To avoid a shoot-through between the power switches of the buck converter, a small dead-time is inserted between gate drive switching transitions. Despite optimum dead-time management for a power converter, optimum dead-times vary for different load conditions. These variations become considerably large for PoL applications, which demand high output current with low output voltages. At high switching frequencies, these variations translate into losses that contribute significantly to the total loss of the converter. To understand and quantify power loss in a hard-switching buck converter that uses a GaN power device in parallel with a Schottky diode, piecewise transitions are used to develop an analytical switching model that quantifies the contribution of reverse conduction loss of GaN during dead-time.
The effects of parasitic elements on the dynamics of the switching converter are investigated during one switching cycle of the converter. A designed prototype of a buck converter is correlated to the predicted model to determine the accuracy of the model. This comparison is presented using simulations and measurements at 400 kHz and 2 MHz converter switching speeds for load (1A) condition and fixed dead-time values. Furthermore, performance of the buck converter with and without the Schottky diode is also measured and compared to demonstrate and quantify the enhanced performance when using an anti-parallel diode. The developed power converter achieves peak efficiencies of 91.7% and 93.86% for 2 MHz and 400 KHz switching frequencies, respectively, and drives load currents up to 6A for a voltage conversion from 12V input to 3.3V output.
In addition, various industry Schottky diodes have been categorized based on their packaging and electrical characteristics and the developed analytical model provides analytical expressions relating the diode characteristics to power stage performance parameters. The performance of these diodes has been characterized for different buck converter voltage step-down ratios that are typically used in industry applications and different switching frequencies ranging from 400 KHz to 2 MHz.
ContributorsKoli, Gauri (Author) / Kitchen, Jennifer (Thesis advisor) / Bakkaloglu, Bertan (Committee member) / Ozev, Sule (Committee member) / Arizona State University (Publisher)
Created2020