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Description
Thermal interface materials (TIMs) are extensively used in thermal management applications especially in the microelectronics industry. With the advancement in microprocessors design and speed, the thermal management is becoming more complex. With these advancements in microelectronics, there have been parallel advancements in thermal interface materials. Given the vast number of

Thermal interface materials (TIMs) are extensively used in thermal management applications especially in the microelectronics industry. With the advancement in microprocessors design and speed, the thermal management is becoming more complex. With these advancements in microelectronics, there have been parallel advancements in thermal interface materials. Given the vast number of available TIM types, selection of the material for each specific application is crucial. Most of the metrologies currently available on the market are designed to qualify TIMs between two perfectly flat surfaces, mimicking an ideal scenario. However, in realistic applications parallel surfaces may not be the case. In this study, a unique characterization method is proposed to address the need for TIMs characterization between non-parallel surfaces. Two different metrologies are custom-designed and built to measure the impact of tilt angle on the performance of TIMs. The first metrology, Angular TIM Tester, is based on the ASTM D5470 standard with flexibility to perform characterization of the sample under induced tilt angle of the rods. The second metrology, Bare Die Tilting Metrology, is designed to validate the performance of TIM under induced tilt angle between the bare die and the cooling solution in an "in-situ" package testing format. Several types of off-the-shelf thermal interface materials were tested and the results are outlined in the study. Data were collected using both metrologies for all selected materials. It was found that small tilt angles, up to 0.6°, have an impact on thermal resistance of all materials especially for in-situ testing. In addition, resistance change between 0° and the selected tilt angle was found to be in close agreement between the two metrologies for paste-based materials and phase-change material. However, a clear difference in the thermal performance of the tested materials was observed between the two metrologies for the gap filler materials.
ContributorsHarris, Enisa (Author) / Phelan, Patrick (Thesis advisor) / Calhoun, Ronald (Committee member) / Devasenathipathy, Shankar (Committee member) / Arizona State University (Publisher)
Created2011
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Description
This dissertation will investigate two of the most promising high-capacity anode

materials for lithium-based batteries: silicon (Si) and metal lithium (Li). It will focus on

studying the mechanical behaviors of the two materials during charge and discharge and

understanding how these mechanical behaviors may affect their electrochemical

performance.

In

This dissertation will investigate two of the most promising high-capacity anode

materials for lithium-based batteries: silicon (Si) and metal lithium (Li). It will focus on

studying the mechanical behaviors of the two materials during charge and discharge and

understanding how these mechanical behaviors may affect their electrochemical

performance.

In the first part, amorphous Si anode will be studied. Despite many existing studies

on silicon (Si) anodes for lithium ion batteries (LIBs), many essential questions still exist

on compound formation, composition, and properties. Here it is shown that some

previously accepted findings do not truthfully reflect the actual lithiation mechanisms in

realistic battery configurations. Furthermore the correlation between structure and

mechanical properties in these materials has not been properly established. Here, a rigorous

and thorough study is performed to comprehensively understand the electrochemical

reaction mechanisms of amorphous-Si (a-Si) in a realistic LIB configuration. In-depth

microstructural characterization was performed and correlations were established between

Li-Si composition, volumetric expansion, and modulus/hardness. It is found that the

lithiation process of a-Si in a real battery setup is a single-phase reaction rather than the

accepted two-phase reaction obtained from in-situ TEM experiments. The findings in this

dissertation establish a reference to quantitatively explain many key metrics for lithiated a

Si as anodes in real LIBs, and can be used to rationally design a-Si based high-performance

LIBs guided by high-fidelity modeling and simulations.

In the second part, Li metal anode will be investigated. Problems related to dendrite

growth on lithium metal anodes such as capacity loss and short circuit present major

barriers to the next-generation high-energy-density batteries. The development of

successful mitigation strategies is impeded by the incomplete understanding of the Li

dendrite growth mechanisms. Here the enabling role of plating residual stress in dendrite

initiation through novel experiments of Li electrodeposition on soft substrates is confirmed,

and the observations is explained with a stress-driven dendrite growth model. Dendrite

growth is mitigated on such soft substrates through surface-wrinkling-induced stress

relaxation in deposited Li film. It is demonstrated that this new dendrite mitigation

mechanism can be utilized synergistically with other existing approaches in the form of

three-dimensional (3D) soft scaffolds for Li plating, which achieves superior coulombic

efficiency over conventional hard copper current collectors under large current density.
ContributorsWang, Xu (Author) / Jiang, Hanqing (Thesis advisor) / Yu, Hongbin (Thesis advisor) / Chan, Candace (Committee member) / Wang, Liping (Committee member) / Qiong, Nian (Committee member) / Arizona State University (Publisher)
Created2018
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Description
Soft polymer composites with improved thermal conductivity are needed for the thermal management of electronics. Interfacial thermal boundary resistance, however, prevents the efficient use of many high thermal conductivity fill materials. Magnetic alignment of ferrous fill material enforces percolation of the high thermal conductivity fill, thereby shifting the governing boundary

Soft polymer composites with improved thermal conductivity are needed for the thermal management of electronics. Interfacial thermal boundary resistance, however, prevents the efficient use of many high thermal conductivity fill materials. Magnetic alignment of ferrous fill material enforces percolation of the high thermal conductivity fill, thereby shifting the governing boundary resistance to the particle- particle interfaces and increasing the directional thermal conductivity of the polymer composite. Magnetic alignment maximizes the thermal conductivity while minimizing composite stiffening at a fill fraction of half the maximum packing factor. The directional thermal conductivity of the composite is improved by more than 2-fold. Particle-particle contact engineering is then introduced to decrease the particle- particle boundary resistance and further improve the thermal conductivity of the composite.

The interface between rigid fill particles is a point contact with very little interfacial area connecting them. Silver and gallium-based liquid metal (LM) coatings provide soft interfaces that, under pressure, increase the interfacial area between particles and decrease the particle-particle boundary resistance. These engineered contacts are investigated both in and out of the polymer matrix and with and without magnetic alignment of the fill. Magnetically aligned in the polymer matrix, 350nm- thick silver coatings on nickel particles produce a 1.8-fold increase in composite thermal conductivity over the aligned bare-nickel composites. The LM coatings provide similar enhancements, but require higher volumes of LM to do so. This is due to the rapid formation of gallium oxide, which introduces additional thermal boundaries and decreases the benefit of the LM coatings.

The oxide shell of LM droplets (LMDs) can be ruptured using pressure. The pressure needed to rupture LMDs matches closely to thin-walled pressure vessel theory. Furthermore, the addition of tungsten particles stabilizes the mixture for use at higher pressures. Finally, thiols and hydrochloric acid weaken the oxide shell and boost the thermal performance of the beds of LMDs by 50% at pressures much lower than 1 megapascal (MPa) to make them more suitable for use in TIMs.
ContributorsRalphs, Matthew (Author) / Rykaczewski, Konrad (Thesis advisor) / Wang, Robert Y (Thesis advisor) / Phelan, Patrick (Committee member) / Wang, Liping (Committee member) / Devasenathipathy, Shankar (Committee member) / Arizona State University (Publisher)
Created2019
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Description
Mechanical behavior of metallic thin films at room temperature (RT) is relatively well characterized. However, measuring the high temperature mechanical properties of thin films poses several challenges. These include ensuring uniformity in sample temperature and minimizing temporal fluctuations due to ambient heat loss, in addition to difficulties involved in mechanical

Mechanical behavior of metallic thin films at room temperature (RT) is relatively well characterized. However, measuring the high temperature mechanical properties of thin films poses several challenges. These include ensuring uniformity in sample temperature and minimizing temporal fluctuations due to ambient heat loss, in addition to difficulties involved in mechanical testing of microscale samples. To address these issues, we designed and analyzed a MEMS-based high temperature tensile testing stage made from single crystal silicon. The freestanding thin film specimens were co-fabricated with the stage to ensure uniaxial loading. Multi-physics simulations of Joule heating, incorporating both radiation and convection heat transfer, were carried out using COMSOL to map the temperature distribution across the stage and the specimen. The simulations were validated using temperature measurements from a thermoreflectance microscope.
ContributorsEswarappa Prameela, Suhas (Author) / Rajagopalan, Jagannathan (Thesis advisor) / Wang, Liping (Committee member) / Jiao, Yang (Committee member) / Arizona State University (Publisher)
Created2016
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Description
Advancements in thermal interface materials (TIMs) allows for the creation of new and more powerful electronics as they increase the heat transfer from the component to the heat sink. Current industrial options provide decent heat transfer, but the creation of TIMs with higher thermal conductivities is needed. In addition, if

Advancements in thermal interface materials (TIMs) allows for the creation of new and more powerful electronics as they increase the heat transfer from the component to the heat sink. Current industrial options provide decent heat transfer, but the creation of TIMs with higher thermal conductivities is needed. In addition, if these TIMs are elastic in nature, their effectiveness can greatly increase as they can deal with changing interfaces without degradation of their properties. The research performed delves into this idea, creating elastic TIMs using liquid metal (LM), in this case galinstan, along with other matrix particles embedded in Polydimethylsiloxane (PDMS) to create an easy to use, relatively inexpensive, thermally conductive, but electrically insulative, pad with increased thermal conductivity from industrial solutions.

The pads were created using varying amounts of LM and matrix materials ranging from copper microspheres to diamond powder mixed into PDMS using a high-speed mixer. The material was then cast into molds and cured to create the pads. Once the pads were created, the difficulty came in quantifying their thermal properties. A stepped bar apparatus (SBA) following ASTM D5470 was created to measure the thermal resistance of the pads but it was determined that thermal conductivity was a more usable metric of the pads’ performance. This meant that the pad’s in-situ thickness was needed during testing, prompting the installation of a linear encoder to measure the thickness. The design and analysis of the necessary modification and proposed future design is further detailed in the following paper.
ContributorsKemme, Nicholas (Author) / Rykaczewski, Konrad (Thesis advisor) / Wang, Robert (Thesis advisor) / Wang, Liping (Committee member) / Arizona State University (Publisher)
Created2017
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Description
The relationships between the properties of materials and their microstructures have been a central topic in materials science. The microstructure-property mapping and numerical failure prediction are critical for integrated computational material engineering (ICME). However, the bottleneck of ICME is the lack of a clear understanding of the failure mechanism as

The relationships between the properties of materials and their microstructures have been a central topic in materials science. The microstructure-property mapping and numerical failure prediction are critical for integrated computational material engineering (ICME). However, the bottleneck of ICME is the lack of a clear understanding of the failure mechanism as well as an efficient computational framework. To resolve these issues, research is performed on developing novel physics-based and data-driven numerical methods to reveal the failure mechanism of materials in microstructure-sensitive applications. First, to explore the damage mechanism of microstructure-sensitive materials in general loading cases, a nonlocal lattice particle model (LPM) is adopted because of its intrinsic ability to handle the discontinuity. However, the original form of LPM is unsuitable for simulating nonlinear behavior involving tensor calculation. Therefore, a damage-augmented LPM (DLPM) is proposed by introducing the concept of interchangeability and bond/particle-based damage criteria. The proposed DLPM successfully handles the damage accumulation behavior in general material systems under static and fatigue loading cases. Then, the study is focused on developing an efficient physics-based data-driven computational framework. A data-driven model is proposed to improve the efficiency of a finite element analysis neural network (FEA-Net). The proposed model, i.e., MFEA-Net, aims to learn a more powerful smoother in a multigrid context. The learned smoothers have good generalization properties, and the resulted MFEA-Net has linear computational complexity. The framework has been applied to efficiently predict the thermal and elastic behavior of composites with various microstructural fields. Finally, the fatigue behavior of additively manufactured (AM) Ti64 alloy is analyzed both experimentally and numerically. The fatigue experiments show the fatigue life is related with the contour process parameters, which can result in different pore defects, surface roughness, and grain structures. The fractography and grain structures are closely observed using scanning electron microscope. The sample geometry and defect/crack morphology are characterized through micro computed tomography (CT). After processing the pixel-level CT data, the fatigue crack initiation and growth behavior are numerically simulated using MFEA-Net and DLPM. The experiments and simulation results provided valuable insights in fatigue mechanism of AM Ti64 alloy.
ContributorsMeng, Changyu (Author) / Liu, Yongming (Thesis advisor) / Hoover, Christian (Committee member) / Li, Lin (Committee member) / Peralta, Pedro (Committee member) / Wang, Liping (Committee member) / Arizona State University (Publisher)
Created2023