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Description
The way a granular material is transported and handled plays a huge part in the quality of final product and the overall efficiency of the manufacturing process. Currently, there is a gap in the understanding of the basic relationship between the fundamental variables of granular materials such as moisture content,

The way a granular material is transported and handled plays a huge part in the quality of final product and the overall efficiency of the manufacturing process. Currently, there is a gap in the understanding of the basic relationship between the fundamental variables of granular materials such as moisture content, particle shape and size. This can lead to flowability issues like arching and ratholing, which can lead to unexpected downtimes in the whole manufacturing process and considerable wastage of time, energy, and resources. This study specifically focuses on the development of a model based on the surface mean diameter and the moisture content to predict the flow metric flow function coefficient (FFC) to describe the nature of flow of the material. The investigation involved three parts. The first entailed the characterization of the test materials with respect to their physical properties - density, size, and shape distributions. In the second, flowability tests were conducted with the FT4 Powder Rheometer. Shear cell tests were utilized to calculate each test specimen's flow function parameters. Finally, the physical properties were correlated with the results from the flowability tests to develop a reliable model to predict the nature of flow of the test specimens. The model displayed an average error of -6.5%. Predicted values showed great correlation with values obtained from further shear cell tests on the FT4 Rheometer. Additionally, particle shape factors and other flowability descriptors like Carr Index and Hausner Ratio were also evaluated for the sample materials. All size ranges displayed a decreasing trend in the values of Carr Index, Hausner Ratio, and FFC with increasing moisture percentages except the 5-11 micron glass beads, which showed an increasing trend in FFC. The results from this investigation could be helpful in designing equipment for powder handling and avoiding potential flowability issues.
ContributorsDeb, Anindya (Author) / Emady, Heather (Thesis advisor) / Marvi, Hamidreza (Committee member) / Jiao, Yang (Committee member) / Arizona State University (Publisher)
Created2021
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Description
The evolution of defects at different stages of strain relaxation in low-mismatched GaAs/GaAs1-xSbx/GaAs(001) (x ~ 0.08) heterostructures, and the underlying relaxation mechanisms, have been comprehensively studied primarily using transmission electron microscopy (TEM). Aberration-corrected scanning transmission electron microscopy (STEM) has been used for atomic-scale study of interfacial defects in low-mismatched GaAs(001)-based

The evolution of defects at different stages of strain relaxation in low-mismatched GaAs/GaAs1-xSbx/GaAs(001) (x ~ 0.08) heterostructures, and the underlying relaxation mechanisms, have been comprehensively studied primarily using transmission electron microscopy (TEM). Aberration-corrected scanning transmission electron microscopy (STEM) has been used for atomic-scale study of interfacial defects in low-mismatched GaAs(001)-based and high-mismatched GaSb/GaAs(001) heterostructures.Three distinct stages of strain relaxation were identified in GaAs/GaAs1-xSbx/GaAs(001) (x ~ 0.08) heterostructures with GaAsSb film thicknesses in the range of 50 to 4000 nm capped with 50-nm-thick GaAs layers. Diffraction contrast analysis with conventional TEM revealed that although 60° dislocations were primarily formed during the initial sluggish Stage-I relaxation, 90° dislocations were also created. Many curved dislocations, the majority of which extended into the substrate, were formed during Stage-II and Stage-III relaxation. The capping layers of heterostructures with larger film thickness (500 nm onwards) exhibited only Stage-I relaxation. A decrease in dislocation density was observed at the cap/film interface of the heterostructure with 4000-nm-thick film compared to that with 2000-nm-thick film, which correlated with smoothening of surface cross-hatch morphology. Detailed consideration of plausible dislocation sources for the capping layer led to the conclusion that dislocation half-loops nucleated at surface troughs were the main source of threading dislocations in these heterostructures. Aberration-corrected STEM imaging revealed that interfacial 60° dislocations in GaAs/GaAsSb/GaAs(001) and GaAs/GaAsP/GaAs(001) heterostructures were dissociated to form intrinsic stacking faults bounded by 90° and 30° Shockley partial dislocations. The cores of the 30° partials contained single atomic columns indicating that these dislocations primarily belonged to glide set. Apart from isolated dissociated 60° dislocations, Lomer-Cottrell locks, Lomer dislocations and a novel type of dissociated 90° dislocation were observed in GaAs/GaAsSb/GaAs heterostructures. The core structure of interfacial defects in GaSb/GaAs(001) heterostructure was also investigated using aberration-corrected STEM. 90° Lomer dislocations were primarily formed; however, glide-set perfect 60° and dissociated 60° dislocations were also observed. The 5-7 atomic-ring shuffle-set dislocation, the left-displaced 6-8 atomic-ring glide-set and the right-displaced 6-8 atomic-ring glide-set dislocations were three types of Lomer dislocations that were identified, among which the shuffle-set type was most common.
ContributorsGangopadhyay, Abhinandan (Author) / Smith, David J. (Thesis advisor) / Bertoni, Mariana (Committee member) / Crozier, Peter A. (Committee member) / King, Richard R. (Committee member) / McCartney, Martha R. (Committee member) / Arizona State University (Publisher)
Created2021
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Description
How to effectively and accurately describe, character and quantify the microstructure of the heterogeneous material and its 4D evolution process with time suffered from external stimuli or provocations is very difficult and challenging, but it’s significant and crucial for its performance prediction, processing, optimization and design. The goal of this

How to effectively and accurately describe, character and quantify the microstructure of the heterogeneous material and its 4D evolution process with time suffered from external stimuli or provocations is very difficult and challenging, but it’s significant and crucial for its performance prediction, processing, optimization and design. The goal of this research is to overcome these challenges by developing a series of novel hierarchical statistical microstructure descriptors called “n-point polytope functions” which is as known as Pn functions to quantify heterogeneous material’s microstructure and creating Pn functions related quantification methods which are Omega Metric and Differential Omega Metric to analyze its 4D processing.In this dissertation, a series of powerful programming tools are used to demonstrate that Pn functions can be used up to n=8 for chaotically scattered images which can hardly be distinguished by our naked eyes in chapter 3 to find or compare the potential configuration feature of structure such as symmetry or polygon geometry relation between the different targets when target’s multi-modal imaging is provided. These n-point statistic results calculated from Pn functions for features of interest in the microstructure can efficiently decompose the structural hidden features into a set of “polytope basis” to provide a concise, explainable, expressive, universal and efficient quantifying manner. In Chapter 4, the Pn functions can also be incorporated into material reconstruction algorithms readily for fast virtualizing 3D microstructure regeneration and also allowing instant material property prediction via analytical structure-property mappings for material design. In Chapter 5, Omega Metric and Differential Omega Metric are further created and used to provide a time-dependent reduced-dimension metric to analyze the 4D evaluation processing instead of using Pn functions directly because these 2 simplified methods can provide undistorted results to be easily compared. The real case of vapor-deposition alloy films analysis are implemented in this dissertation to demonstrate that One can use these methods to predict or optimize the design for 4D evolution of heterogeneous material. The advantages of the all quantification methods in this dissertation can let us economically and efficiently quantify, design, predict the microstructure and 4D evolution of the heterogeneous material in various fields.
ContributorsCHEN, PEI-EN (Author) / Jiao, Yang (Thesis advisor) / Ren, Yi (Thesis advisor) / Liu, Yongming (Committee member) / Zhuang, Houlong (Committee member) / Nian, Qiong (Committee member) / Arizona State University (Publisher)
Created2021
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Description
2D materials with reduced symmetry have gained great interest in the past decade due to the arising quantum properties introduced by the structural asymmetry. A particular example is called 2D Janus materials. Named after Roman god Janus with two faces, Janus materials have different chemical compositions on the two sides

2D materials with reduced symmetry have gained great interest in the past decade due to the arising quantum properties introduced by the structural asymmetry. A particular example is called 2D Janus materials. Named after Roman god Janus with two faces, Janus materials have different chemical compositions on the two sides of materials, leading to a structure with broken mirror symmetry. Electronegativity difference of the facial elements induces a built-in polarization field pointing out of the plane, which has driven a lot of theory predictions on Rashba splitting, high- temperature ferromagnetism, Skyrmion formation, and so on. Previously reported experimental synthesis of Janus 2D materials relies on high-temperature processing, which limits the crystallinity of as produced 2D layers. In this dissertation, I present a room temperature selective epitaxial atomic re- placement (SEAR) method to convert CVD-grown transition metal dichalcogenides (TMDs) into a Janus structure. Chemically reactive H2 plasma is used to selectively etch off the top layer of chalcogen atoms and the introduction of replacement chalco- gen source in-situ allows for the achievement of Janus structures in one step at room temperature. It is confirmed that the produced Janus monolayers possess high crys- tallinity and good excitonic properties. Moving forward, I show the fabrication of lateral and vertical heterostructures of Janus materials, which are predicted to show exotic properties because of the intrinsic polarization field. To efficiently screen other kinds of interesting Janus structures, a new plasma chamber is designed to allow in-situ optical measurement on the target monolayer during the SEAR process. Successful conversion is seen on mechanically exfoliated MoSe2 and WSe2, and insights into reaction kinetics are gain from Raman spectra evolution. Using the monitoring ability, Janus SNbSe is synthesized for the first time. It’s also demonstrated that the overall crystallinity of as produced Janus monolayer SWSe and SMoSe are correlated with the source of monolayer TMDs. Overall, the synthesis of the Janus monolayers using the described method paves the way to the production of highly crystalline Janus materials, and with the in-situ monitoring ability, a deeper understanding of the mechanism is reached. This will accelerate future exploration of other Janus materials synthesis, and confirmation and discovery of their exciting quantum properties.
ContributorsQin, Ying (Author) / Tongay, Sefaattin (Thesis advisor) / Zhuang, Houlong (Committee member) / Jiao, Yang (Committee member) / Arizona State University (Publisher)
Created2021
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Description
Wide bandgap semiconductors are of much current interest due to their superior electrical properties. This dissertation describes electron microscopy characterization of GaN-on-GaN structures for high-power vertical device applications. Unintentionally-doped (UID) GaN layers grown homoepitaxially via metal-organic chemical vapor deposition on freestanding GaN substrates, were subjected to dry etching, and layers

Wide bandgap semiconductors are of much current interest due to their superior electrical properties. This dissertation describes electron microscopy characterization of GaN-on-GaN structures for high-power vertical device applications. Unintentionally-doped (UID) GaN layers grown homoepitaxially via metal-organic chemical vapor deposition on freestanding GaN substrates, were subjected to dry etching, and layers of UID-GaN/p-GaN were over-grown. The as-grown and regrown heterostructures were examined in cross-section using transmission electron microscopy (TEM). Two different etching treatments, fast-etch-only and multiple etches with decreasing power, were employed. The fast-etch-only devices showed GaN-on-GaN interface at etched location, and low device breakdown voltages were measured (~ 45-95V). In comparison, no interfaces were visible after multiple etching steps, and the corresponding breakdown voltages were much higher (~1200-1270V). These results emphasized importance of optimizing surface etching techniques for avoiding degraded device performance. The morphology of GaN-on-GaN devices after reverse-bias electrical stressing to breakdown was investigated. All failed devices had irreversible structural damage, showing large surface craters (~15-35 microns deep) with lengthy surface cracks. Cross-sectional TEM of failed devices showed high densities of threading dislocations (TDs) around the cracks and near crater surfaces. Progressive ion-milling across damaged devices revealed high densities of TDs and the presence of voids beneath cracks: these features were not observed in unstressed devices. The morphology of GaN substrates grown by hydride vapor-phase epitaxy (HVPE) and by ammonothermal methods were correlated with reverse-bias results. HVPE substrates showed arrays of surface features when observed by X-ray topography (XRT). All fabricated devices that overlapped with these features had typical reverse-bias voltages less than 100V at a leakage current limit of 10-6 A. In contrast, devices not overlapping with such features reached voltages greater than 300V. After etching, HVPE substrate surfaces showed defect clusters and macro-pits, whereas XRT images of ammonothermal substrate revealed no visible features. However, some devices fabricated on ammonothermal substrate failed at low voltages. Devices on HVPE and ammonothermal substrates with low breakdown voltages showed crater-like surface damage and revealed TDs (~25µm deep) and voids; such features were not observed in devices reaching higher voltages. These results should assist in developing protocols to fabricate reliable high-voltage devices.
ContributorsPeri, Prudhvi Ram (Author) / Smith, David J. (Thesis advisor) / Alford, Terry (Committee member) / Mccartney, Martha R (Committee member) / Nemanich, Robert (Committee member) / Zhao, Yuji (Committee member) / Arizona State University (Publisher)
Created2021
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Description
Multifunctional oxide thin-films grown on silicon and several oxide substrates have been characterized using High Resolution (Scanning) Transmission Electron Microscopy (HRTEM), Energy-Dispersive X-ray Spectroscopy (EDX), and Electron Energy-Loss Spectroscopy (EELS). Oxide thin films grown on SrTiO3/Si pseudo-substrate showed the presence of amorphised SrTiO3 (STO) at the STO/Si interface. Oxide/oxide interfaces

Multifunctional oxide thin-films grown on silicon and several oxide substrates have been characterized using High Resolution (Scanning) Transmission Electron Microscopy (HRTEM), Energy-Dispersive X-ray Spectroscopy (EDX), and Electron Energy-Loss Spectroscopy (EELS). Oxide thin films grown on SrTiO3/Si pseudo-substrate showed the presence of amorphised SrTiO3 (STO) at the STO/Si interface. Oxide/oxide interfaces were observed to be atomically clean with very few defects.

Al-doped SrTiO3 thin films grown on Si were of high crystalline quality. The Ti/O ratio estimated from EELS line scans revealed that substitution of Ti by Al created associated O vacancies. The strength of the crystal field in STO was measured using EELS, and decreased by ~1.0 eV as Ti4+ was substituted by Al3+. The damping of O-K EELS peaks confirmed the rise in oxygen vacancies. For Co-substituted STO films grown on Si, the EDS and EELS spectra across samples showed Co doping was quite random. The substitution of Ti4+ with Co3+ or Co2+ created associated oxygen vacancies for charge balance. Presence of oxygen vacancies was also confirmed by shift of Ti-L EELS peaks towards lower energy by ~0.4 eV. The crystal-field strength decreased by ~0.6 eV as Ti4+ was partially substituted by Co3+ or Co2+.

Spinel Co3O4 thin films grown on MgAl2O4 (110) were observed to have excellent crystalline quality. The structure of the Co3O4/MgAl2O4 interface was determined using HRTEM and image simulations. It was found that MgAl2O4 substrate is terminated with Al and oxygen. Stacking faults and associated strain fields in spinel Co3O4 were found along [111], [001], and [113] using Geometrical Phase Analysis.

NbO2 films on STO (111) were observed to be tetragonal with lattice parameter of 13.8 Å and NbO films on LSAT (111) were observed to be cubic with lattice parameter of 4.26 Å. HRTEM showed formation of high quality NbOx films and excellent coherent interface. HRTEM of SrAl4 on LAO (001) confirmed an island growth mode. The SrAl4 islands were highly crystalline with excellent epitaxial registry with LAO. By comparing HRTEM images with image simulations, the interface structure was determined to consist of Sr-terminated SrAl4 (001) on AlO2-terminated LAO (001).
ContributorsDhamdhere, Ajit (Author) / Smith, David J. (Thesis advisor) / McCartney, Martha R. (Committee member) / Chamberlin, Ralph (Committee member) / Ponce, Fernando (Committee member) / Arizona State University (Publisher)
Created2015
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Description
Pipeline infrastructure forms a vital aspect of the United States economy and standard of living. A majority of the current pipeline systems were installed in the early 1900’s and often lack a reliable database reporting the mechanical properties, and information about manufacturing and installation, thereby raising a concern for their

Pipeline infrastructure forms a vital aspect of the United States economy and standard of living. A majority of the current pipeline systems were installed in the early 1900’s and often lack a reliable database reporting the mechanical properties, and information about manufacturing and installation, thereby raising a concern for their safety and integrity. Testing for the aging pipe strength and toughness estimation without interrupting the transmission and operations thus becomes important. The state-of-the-art techniques tend to focus on the single modality deterministic estimation of pipe strength and do not account for inhomogeneity and uncertainties, many others appear to rely on destructive means. These gaps provide an impetus for novel methods to better characterize the pipe material properties. The focus of this study is the design of a Bayesian Network information fusion model for the prediction of accurate probabilistic pipe strength and consequently the maximum allowable operating pressure. A multimodal diagnosis is performed by assessing the mechanical property variation within the pipe in terms of material property measurements, such as microstructure, composition, hardness and other mechanical properties through experimental analysis, which are then integrated with the Bayesian network model that uses a Markov chain Monte Carlo (MCMC) algorithm. Prototype testing is carried out for model verification, validation and demonstration and data training of the model is employed to obtain a more accurate measure of the probabilistic pipe strength. With a view of providing a holistic measure of material performance in service, the fatigue properties of the pipe steel are investigated. The variation in the fatigue crack growth rate (da/dN) along the direction of the pipe wall thickness is studied in relation to the microstructure and the material constants for the crack growth have been reported. A combination of imaging and composition analysis is incorporated to study the fracture surface of the fatigue specimen. Finally, some well-known statistical inference models are employed for prediction of manufacturing process parameters for steel pipelines. The adaptability of the small datasets for the accuracy of the prediction outcomes is discussed and the models are compared for their performance.
ContributorsDahire, Sonam (Author) / Liu, Yongming (Thesis advisor) / Jiao, Yang (Committee member) / Ren, Yi (Committee member) / Arizona State University (Publisher)
Created2018
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Description
Over the past several years, the density of integrated circuits has been increasing at a very fast rate, following Moore’s law. The advent of three dimensional (3D) packaging technologies enable the increase in density of integrated circuits without necessarily shrinking the dimensions of the device. Under such constraints, the solder

Over the past several years, the density of integrated circuits has been increasing at a very fast rate, following Moore’s law. The advent of three dimensional (3D) packaging technologies enable the increase in density of integrated circuits without necessarily shrinking the dimensions of the device. Under such constraints, the solder volume necessary to join the various layers of the package is also extremely small. At smaller length scales, the local cooling rates are higher, so the microstructures are much finer than that obtained in larger joints (BGA, C4). The fraction of intermetallic compounds (IMCs) present in solder joints in these volumes will be larger. The Cu6Sn5 precipitate size and spacing, and Sn grain structure and crystallography will be different at very small volumes. These factors will most certainly affect the performance of the solder. Examining the mechanical behavior and reliability of Pb-free solders is difficult, primarily because a methodology to characterize the microstructure and the mechanics of deformation at these extremely small length scales has yet to be developed.

In this study, Sn grain orientation and Cu6Sn5 IMC fraction, size, and morphology are characterized in 3D, in pure Sn based solder joints. The obtained results show differences in morphology of Sn grains and IMC precipitates as a function of location within the solder joint indicating influence of local cooling rate differences. Ex situ and in situ electromigration tests done on 250 um and 500 um pure Sn solder joints elucidate the evolution of microstructure, specifically Sn grain growth, IMC segregation and surface degradation. This research implements 3D quantification of microstructural features over micro and nano-scales, thereby enabling a multi-scale / multi-characterization approach.
ContributorsKirubanandham, Antony (Author) / Chawla, Nikhilesh (Thesis advisor) / Jiao, Yang (Committee member) / Lu, Minhua (Committee member) / Rajagopalan, Jagannathan (Committee member) / Arizona State University (Publisher)
Created2016
Description
Transition metal dichalcogenides (TMDs) are a family of layered crystals with the chemical formula MX2 (M = W, Nb, Mo, Ta and X = S, Se, Te). These TMDs exhibit many fascinating optical and electronic properties making them strong candidates for high-end electronics, optoelectronic application, and spintronics. The layered structure

Transition metal dichalcogenides (TMDs) are a family of layered crystals with the chemical formula MX2 (M = W, Nb, Mo, Ta and X = S, Se, Te). These TMDs exhibit many fascinating optical and electronic properties making them strong candidates for high-end electronics, optoelectronic application, and spintronics. The layered structure of TMDs allows the crystal to be mechanically exfoliated to a monolayer limit, where bulk-scale properties no longer apply and quantum effects arise, including an indirect-to-direct bandgap transition. Controllably tuning the electronic properties of TMDs like WSe2 is therefore a highly attractive prospect achieved by substitutionally doping the metal atoms to enable n- and p-type doping at various concentrations, which can ultimately lead to more effective electronic devices due to increased charge carriers, faster transmission times and possibly new electronic and optical properties to be probed. WSe2 is expected to exhibit the largest spin splitting size and spin-orbit coupling, which leads to exciting potential applications in spintronics over its similar TMD counterparts, which can be controlled through electrical doping. Unfortunately, the well-established doping technique of ion implantation is unable to preserve the crystal quality leading to a major roadblock for the electronics applications of tungsten diselenide. Synthesizing WSe2 via chemical vapor transport (CVT) and flux method have been previously established, but controllable p-type (niobium) doping WSe2 in low concentrations ranges (<1 at %) by CVT methods requires further experimentation and study. This work studies the chemical vapor transport synthesis of doped-TMD W1-xNbxSe2 through characterization techniques of X-ray Diffraction, Scanning Electron Microscopy, Energy Dispersive X-ray Spectroscopy, and X-ray Photoelectron Spectroscopy techniques. In this work, it is observed that excess selenium transport does not enhance the controllability of niobium doping in WSe2, and that tellurium tetrachloride (TeCl4) transport has several barriers in successfully incorporating niobium into WSe2.
ContributorsRuddick, Hayley (Author) / Tongay, Sefaattin (Thesis director) / Jiao, Yang (Committee member) / Barrett, The Honors College (Contributor) / Materials Science and Engineering Program (Contributor)
Created2024-05