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- All Subjects: Mechanical Engineering
- Creators: Rykaczewski, Konrad
Description
With the increasing focus on developing environmentally benign electronic packages, lead-free solder alloys have received a great deal of attention. Mishandling of packages, during manufacture, assembly, or by the user may cause failure of solder joint. A fundamental understanding of the behavior of lead-free solders under mechanical shock conditions is lacking. Reliable experimental and numerical analysis of lead-free solder joints in the intermediate strain rate regime need to be investigated. This dissertation mainly focuses on exploring the mechanical shock behavior of lead-free tin-rich solder alloys via multiscale modeling and numerical simulations. First, the macroscopic stress/strain behaviors of three bulk lead-free tin-rich solders were tested over a range of strain rates from 0.001/s to 30/s. Finite element analysis was conducted to determine appropriate specimen geometry that could reach a homogeneous stress/strain field and a relatively high strain rate. A novel self-consistent true stress correction method is developed to compensate the inaccuracy caused by the triaxial stress state at the post-necking stage. Then the material property of micron-scale intermetallic was examined by micro-compression test. The accuracy of this measure is systematically validated by finite element analysis, and empirical adjustments are provided. Moreover, the interfacial property of the solder/intermetallic interface is investigated, and a continuum traction-separation law of this interface is developed from an atomistic-based cohesive element method. The macroscopic stress/strain relation and microstructural properties are combined together to form a multiscale material behavior via a stochastic approach for both solder and intermetallic. As a result, solder is modeled by porous plasticity with random voids, and intermetallic is characterized as brittle material with random vulnerable region. Thereafter, the porous plasticity fracture of the solders and the brittle fracture of the intermetallics are coupled together in one finite element model. Finally, this study yields a multiscale model to understand and predict the mechanical shock behavior of lead-free tin-rich solder joints. Different fracture patterns are observed for various strain rates and/or intermetallic thicknesses. The predictions have a good agreement with the theory and experiments.
ContributorsFei, Huiyang (Author) / Jiang, Hanqing (Thesis advisor) / Chawla, Nikhilesh (Thesis advisor) / Tasooji, Amaneh (Committee member) / Mobasher, Barzin (Committee member) / Rajan, Subramaniam D. (Committee member) / Arizona State University (Publisher)
Created2011
Description
Shock loading is a complex phenomenon that can lead to failure mechanisms such as strain localization, void nucleation and growth, and eventually spall fracture. Studying incipient stages of spall damage is of paramount importance to accurately determine initiation sites in the material microstructure where damage will nucleate and grow and to formulate continuum models that account for the variability of the damage process due to microstructural heterogeneity. The length scale of damage with respect to that of the surrounding microstructure has proven to be a key aspect in determining sites of failure initiation. Correlations have been found between the damage sites and the surrounding microstructure to determine the preferred sites of spall damage, since it tends to localize at and around the regions of intrinsic defects such as grain boundaries and triple points. However, considerable amount of work still has to be done in this regard to determine the physics driving the damage at these intrinsic weak sites in the microstructure. The main focus of this research work is to understand the physical mechanisms behind the damage localization at these preferred sites. A crystal plasticity constitutive model is implemented with different damage criteria to study the effects of stress concentration and strain localization at the grain boundaries. A cohesive zone modeling technique is used to include the intrinsic strength of the grain boundaries in the simulations. The constitutive model is verified using single elements tests, calibrated using single crystal impact experiments and validated using bicrystal and multicrystal impact experiments. The results indicate that strain localization is the predominant driving force for damage initiation and evolution. The microstructural effects on theses damage sites are studied to attribute the extent of damage to microstructural features such as grain orientation, misorientation, Taylor factor and the grain boundary planes. The finite element simulations show good correlation with the experimental results and can be used as the preliminary step in developing accurate probabilistic models for damage nucleation.
ContributorsKrishnan, Kapil (Author) / Peralta, Pedro (Thesis advisor) / Mignolet, Marc (Committee member) / Sieradzki, Karl (Committee member) / Jiang, Hanqing (Committee member) / Oswald, Jay (Committee member) / Arizona State University (Publisher)
Created2013
Description
As one of the most promising materials for high capacity electrode in next generation of lithium ion batteries, silicon has attracted a great deal of attention in recent years. Advanced characterization techniques and atomic simulations helped to depict that the lithiation/delithiation of silicon electrode involves processes including large volume change (anisotropic for the initial lithiation of crystal silicon), plastic flow or softening of material dependent on composition, electrochemically driven phase transformation between solid states, anisotropic or isotropic migration of atomic sharp interface, and mass diffusion of lithium atoms. Motivated by the promising prospect of the application and underlying interesting physics, mechanics coupled with multi-physics of silicon electrodes in lithium ion batteries is studied in this dissertation. For silicon electrodes with large size, diffusion controlled kinetics is assumed, and the coupled large deformation and mass transportation is studied. For crystal silicon with small size, interface controlled kinetics is assumed, and anisotropic interface reaction is studied, with a geometry design principle proposed. As a preliminary experimental validation, enhanced lithiation and fracture behavior of silicon pillars via atomic layer coatings and geometry design is studied, with results supporting the geometry design principle we proposed based on our simulations. Through the work documented here, a consistent description and understanding of the behavior of silicon electrode is given at continuum level and some insights for the future development of the silicon electrode are provided.
ContributorsAn, Yonghao (Author) / Jiang, Hanqing (Thesis advisor) / Chawla, Nikhilesh (Committee member) / Phelan, Patrick (Committee member) / Wang, Yinming (Committee member) / Yu, Hongyu (Committee member) / Arizona State University (Publisher)
Created2014
Description
Gels are three-dimensional polymer networks with entrapped solvent (water etc.). They bear amazing features such as stimuli-responsive (temperature, PH, electric field etc.), high water content and biocompatibility and thus find a lot of applications. To understand the complex physics behind gel's swelling phenomenon, it is important to build up fundamental mechanical model and extend to complicated cases. In this dissertation, a coupled large deformation and diffusion model regarding gel's swelling behavior is presented. In this model, free-energy of the total gel is constituted by polymer stretching energy and polymer-solvent mixing energy. In-house nonlinear finite element code is implemented with fast computational capability. Complex phenomenon such as buckling and healing of cracked gel by swelling are studied. Due to the wide coverage of polymeric materials and solvents, solvent diffusion in gels not only follows Fickian diffusion law where concentration map is continuous but also follows non-Fickian diffusion law where concentration map shows high gradient. Phenomenological model with viscoelastic polymer constitutive and concentration dependent diffusivity is created. The model well captures this special diffusion phenomenon such as sharp diffusion front and distinctive swollen and unswollen region.
ContributorsZhang, Jiaping (Author) / Jiang, Hanqing (Thesis advisor) / Peralta, Pedro (Committee member) / Dai, Lenore (Committee member) / Rajan, Subramaniam D. (Committee member) / Chawla, Nikhilesh (Committee member) / Arizona State University (Publisher)
Created2012
Description
With increasing concerns of the intrinsic toxicity of lead (Pb) in electronics, a series of tin (Sn) based alloys involving silver (Ag) and copper (Cu) have been proposed as replacements for Pb-Sn solder and widely accepted by industry. However, they have a higher melting point and often exhibit poorer damage tolerance than Pb-Sn alloys. Recently, a new class of alloys with trace amount of rare-earth (RE) elements has been discovered and investigated. In previous work from Prof. Chawla's group, it has been shown that cerium (Ce)-based Pb-free solder are less prone to oxidation and Sn whiskering, and exhibit desirable attributes of microstructural refinement and enhanced ductility relative to lanthanum (La)-based Sn-3.9Ag-0.7Cu (SAC) alloy. Although the formation of RESn3 was believed to be directly responsible for the enhanced ductility in RE-containing SAC solder by allowing microscopic voids to nucleate throughout the solder volume, this cavitation-based mechanism needs to be validated experimentally and numerically. Additionally, since the previous study has exhibited the realistic feasibility of Ce-based SAC lead-free solder alloy as a replacement to conventional SAC alloys, in this study, the proposed objective focuses on the in in-depth understanding of mechanism of enhanced ductility in Ce-based SAC alloy and possible issues associated with integration of this new class of solder into electronic industry, including: (a) study of long-term thermal and mechanical stability on industrial metallization, (b) examine the role of solder volume and wetting behavior of the new solder, relative to Sn-3.9Ag-0.7Cu alloys, (c) conduct experiments of new solder alloys in the form of mechanical shock and electromigration. The research of this new class alloys will be conducted in industrially relevant conditions, and the results would serve as the first step toward integration of these new, next generation solders into the industry.
ContributorsXie, Huxiao (Author) / Chawla, Nikhilesh (Thesis advisor) / Krause, Stephen (Committee member) / Solanki, Kiran (Committee member) / Mirpuri, Kabir (Committee member) / Arizona State University (Publisher)
Created2012
Description
The following is a report that will evaluate the microstructure of the nickel-based superalloy Hastelloy X and its relationship to mechanical properties in different load conditions. Hastelloy X is of interest to the company AORA because its strength and oxidation resistance at high temperatures is directly applicable to their needs in a hybrid concentrated solar module. The literature review shows that the microstructure will produce different carbides at various temperatures, which can be beneficial to the strength of the alloy. These precipitates are found along the grain boundaries and act as pins that limit dislocation flow, as well as grain boundary sliding, and improve the rupture strength of the material. Over time, harmful precipitates form which counteract the strengthening effect of the carbides and reduce rupture strength, leading to failure. A combination of indentation and microstructure mapping was used in an effort to link local mechanical behavior to microstructure variability. Electron backscatter diffraction (EBSD) and energy dispersive spectroscopy (EDS) were initially used as a means to characterize the microstructure prior to testing. Then, a series of room temperature Vickers hardness tests at 50 and 500 gram-force were used to evaluate the variation in the local response as a function of indentation size. The room temperature study concluded that both the hardness and standard deviation increased at lower loads, which is consistent with the grain size distribution seen in the microstructure scan. The material was then subjected to high temperature spherical indentation. Load-displacement curves were essential in evaluating the decrease in strength of the material with increasing temperature. Through linear regression of the unloading portion of the curve, the plastic deformation was determined and compared at different temperatures as a qualitative method to evaluate local strength.
ContributorsCelaya, Andrew Jose (Author) / Peralta, Pedro (Thesis director) / Solanki, Kiran (Committee member) / Barrett, The Honors College (Contributor) / Mechanical and Aerospace Engineering Program (Contributor)
Created2015-05
Finite element analysis of silicon thin films on soft substrates as anodes for lithium ion batteries
Description
The wide-scale use of green technologies such as electric vehicles has been slowed due to insufficient means of storing enough portable energy. Therefore it is critical that efficient storage mediums be developed in order to transform abundant renewable energy into an on-demand source of power. Lithium (Li) ion batteries are seeing a stream of improvements as they are introduced into many consumer electronics, electric vehicles and aircraft, and medical devices. Li-ion batteries are well suited for portable applications because of their high energy-to-weight ratios, high energy densities, and reasonable life cycles. Current research into Li-ion batteries is focused on enhancing its energy density, and by changing the electrode materials, greater energy capacities can be realized. Silicon (Si) is a very attractive option because it has the highest known theoretical charge capacity. Current Si anodes, however, suffer from early capacity fading caused by pulverization from the stresses induced by large volumetric changes that occur during charging and discharging. An innovative system aimed at resolving this issue is being developed. This system incorporates a thin Si film bonded to an elastomeric substrate which is intended to provide the desired stress relief. Non-linear finite element simulations have shown that a significant amount of deformation can be accommodated until a critical threshold of Li concentration is reached; beyond which buckling is induced and a wavy structure appears. When compared to a similar system using rigid substrates where no buckling occurs, the stress is reduced by an order of magnitude, significantly prolonging the life of the Si anode. Thus the stress can be released at high Li-ion diffusion induced strains by buckling the Si thin film. Several aspects of this anode system have been analyzed including studying the effects of charge rate and thin film plasticity, and the results are compared with preliminary empirical measurements to show great promise. This study serves as the basis for a radical resolution to one of the few remaining barriers left in the development of high performing Si based electrodes for Li-ion batteries.
ContributorsShaffer, Joseph (Author) / Jiang, Hanqing (Thesis advisor) / Rajan, Subramaniam D. (Committee member) / Peralta, Pedro (Committee member) / Arizona State University (Publisher)
Created2011
Description
Current trends in the Computer Aided Engineering (CAE) involve the integration of legacy mesh-based finite element software with newer solid-modeling kernels or full CAD systems in order to simplify laborious or highly specialized tasks in engineering analysis. In particular, mesh generation is becoming increasingly automated. In addition, emphasis is increasingly placed on full assembly (multi-part) models, which in turn necessitates an automated approach to contact analysis. This task is challenging due to increases in algebraic system size, as well as increases in the number of distorted elements - both of which necessitate manual intervention to maintain accuracy and conserve computer resources. In this investigation, it is demonstrated that the use of a mesh-free B-Spline finite element basis for structural contact problems results in significantly smaller algebraic systems than mesh-based approaches for similar grid spacings. The relative error in calculated contact pressure is evaluated for simple two dimensional smooth domains at discrete points within the contact zone and compared to the analytical Hertz solution, as well as traditional mesh-based finite element solutions for similar grid spacings. For smooth curved domains, the relative error in contact pressure is shown to be less than for bi-quadratic Serendipity elements. The finite element formulation draws on some recent innovations, in which the domain to be analyzed is integrated with the use of transformed Gauss points within the domain, and boundary conditions are applied via distance functions (R-functions). However, the basis is stabilized through a novel selective normalization procedure. In addition, a novel contact algorithm is presented in which the B-Spline support grid is re-used for contact detection. The algorithm is demonstrated for two simple 2-dimensional assemblies. Finally, a modified Penalty Method is demonstrated for connecting elements with incompatible bases.
ContributorsGrishin, Alexander (Author) / Shah, Jami J. (Thesis advisor) / Davidson, Joe (Committee member) / Hjelmstad, Keith (Committee member) / Huebner, Ken (Committee member) / Farin, Gerald (Committee member) / Peralta, Pedro (Committee member) / Arizona State University (Publisher)
Created2010
Description
In nature, it is commonly observed that animals and birds perform movement-based thermoregulation activities to regulate their body temperatures. For example, flapping of elephant ears or plumage fluffing in birds. Taking inspiration from nature and to explore the possibilities of such heat transfer enhancements, augmentation of heat transfer rates induced by the vibration of solid and well as novel flexible pinned heatsinks were studied in this research project. Enhancement of natural convection has always been very important in improving the performance of the cooling mechanisms. In this research, flexible heatsinks were developed and they were characterized based on natural convection cooling with moderately vibrating conditions. The vibration of heated surfaces such as motor surfaces, condenser surfaces, robotic arms and exoskeletons led to the motivation of the development of heat sinks having flexible fins with an improved heat transfer capacity. The performance of an inflexible, solid copper pin fin heat sink was considered as the baseline, current industry standard for the thermal performance. It is expected to obtain maximum convective heat transfer at the resonance frequency of the flexible pin fins. Current experimental results with fixed input frequency and varying amplitudes indicate that the vibration provides a moderate improvement in convective heat transfer, however, the flexibility of fins had negligible effects.
ContributorsPrabhu, Saurabh (Author) / Rykaczewski, Konrad (Thesis advisor) / Phelan, Patrick (Committee member) / Wang, Robert (Committee member) / Arizona State University (Publisher)
Created2019
Description
In convective heat transfer processes, heat transfer rate increases generally with a large fluid velocity, which leads to complex flow patterns. However, numerically analyzing the complex transport process and conjugated heat transfer requires extensive time and computing resources. Recently, data-driven approach has risen as an alternative method to solve physical problems in a computational efficient manner without necessitating the iterative computations of the governing physical equations. However, the research on data-driven approach for convective heat transfer is still in nascent stage. This study aims to introduce data-driven approaches for modeling heat and mass convection phenomena. As the first step, this research explores a deep learning approach for modeling the internal forced convection heat transfer problems. Conditional generative adversarial networks (cGAN) are trained to predict the solution based on a graphical input describing fluid channel geometries and initial flow conditions. A trained cGAN model rapidly approximates the flow temperature, Nusselt number (Nu) and friction factor (f) of a flow in a heated channel over Reynolds number (Re) ranging from 100 to 27750. The optimized cGAN model exhibited an accuracy up to 97.6% when predicting the local distributions of Nu and f. Next, this research introduces a deep learning based surrogate model for three-dimensional (3D) transient mixed convention in a horizontal channel with a heated bottom surface. Conditional generative adversarial networks (cGAN) are trained to approximate the temperature maps at arbitrary channel locations and time steps. The model is developed for a mixed convection occurring at the Re of 100, Rayleigh number of 3.9E6, and Richardson number of 88.8. The cGAN with the PatchGAN based classifier without the strided convolutions infers the temperature map with the best clarity and accuracy.
Finally, this study investigates how machine learning analyzes the mass transfer in 3D printed fluidic devices. Random forests algorithm is hired to classify the flow images taken from semi-transparent 3D printed tubes. Particularly, this work focuses on laminar-turbulent transition process occurring in a 3D wavy tube and a straight tube visualized by dye injection. The machine learning model automatically classifies experimentally obtained flow images with an accuracy > 0.95.
ContributorsKang, Munku (Author) / Kwon, Beomjin (Thesis advisor) / Phelan, Patrick (Committee member) / Ren, Yi (Committee member) / Rykaczewski, Konrad (Committee member) / Sohn, SungMin (Committee member) / Arizona State University (Publisher)
Created2022